Patents by Inventor Kazuhide SEKIGUCHI

Kazuhide SEKIGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11854919
    Abstract: A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2·mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: December 26, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Dongchul Kang, Takahiro Horie, Kenta Ishibashi, Naoki Namai, Kazuhide Sekiguchi, Keichi Hori
  • Publication number: 20200335409
    Abstract: A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2.mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
    Type: Application
    Filed: May 29, 2017
    Publication date: October 22, 2020
    Applicant: Hitachi ChemicalCompany, Ltd.
    Inventors: Dongchul KANG, Takahiro HORIE, Kenta ISHIBASHI, Naoki NAMAI, Kazuhide SEKIGUCHI, Keichi HORI