Abstract: Provided are a flip connection structure, a room-temperature flip connection structure, and a connection method therefor, in which there is no risk of deterioration of a substrate or a semiconductor chip due to heat. Provided is a flip-chip connection structure in which semiconductors are connected using a flip chip structure of chip on chip. Each of terminals that connects the semiconductors is formed by aluminum (Al), and the terminals constitute a joined body integrally joined to each other by ultrasonic vibration involving pressurization.