Patents by Inventor Kazuhiko Akahane

Kazuhiko Akahane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EDGE RING AND SUBSTRATE PROCESSING APPARATUS
    Publication number: 20220157573
    Abstract: An edge ring disposed around a processing target substrate includes a first member of an annular shape, which is made of a first material and has a first inclined portion at a lower portion of an inner peripheral side surface thereof; and a second member of an annular shape, which is made of a second material different from the first material and has a second inclined portion facing the first inclined portion, the second member being provided under the first member.
    Type: Application
    Filed: November 10, 2021
    Publication date: May 19, 2022
    Inventors: Junichi Sasaki, Masashi Ikegami, Mitsuaki Sato, Kazuhiko Akahane
  • EDGE RING AND SUBSTRATE PROCESSING APPARATUS
    Publication number: 20210217649
    Abstract: An edge ring is disposed to surround a target substrate. The edge ring includes a first upper surface made of silicon carbide, tungsten carbide, magnesium oxide, or yttria, and a second upper surface made of silicon. The second upper surface is formed at a position lower than the first upper surface to face a bottom surface of a peripheral portion of the target substrate.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 15, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kazuhiko AKAHANE, Toshiya TSUKAHARA, Sungjae LEE, Namho YUN, Jisoo SUH
  • Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same
    Patent number: 7554242
    Abstract: A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.
    Type: Grant
    Filed: January 16, 2006
    Date of Patent: June 30, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Shinya Aoki, Kazuhiko Akahane, Yoshio Maeda
  • Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same
    Publication number: 20060158062
    Abstract: A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.
    Type: Application
    Filed: January 16, 2006
    Publication date: July 20, 2006
    Inventors: Shinya Aoki, Kazuhiko Akahane, Yoshio Maeda