Abstract: Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.

Abstract: A lamp house is located face to face with a substrate which is transferred by a conveyer means. A dielectric barrier discharge lamp is provided in the lamp house to irradiate the substrate with ultraviolet light, while a moistened inert gas, consisting of an inert gas and water vapor, is supplied to a space between the substrate and the dielectric barrier discharge lamp from a moistened inert gas generating means. Under irradiation of ultraviolet light from the dielectric barrier discharge lamp, water vapor in the moistened inert gas is split into a reducing active member [H.] and an oxidative active member [.OH].

Abstract: A lamp house is located face to face with a substrate which is transferred by a conveyer means. A dielectric barrier discharge lamp is provided in the lamp house to irradiate the substrate with ultraviolet light, while a moistened inert gas, consisting of an inert gas and water vapor, is supplied to a space between the substrate and the dielectric barrier discharge lamp from a moistened inert gas generating means. Under irradiation of ultraviolet light from the dielectric barrier discharge lamp, water vapor in the moistened inert gas is split into a reducing active member [H·] and an oxidative active member [·OH].

Abstract: Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.

Abstract: While being transferred in substantially horizontal state along a predetermined path of transfer by a conveyer means, a substrate plate is dried by a jet of compressed air which is spurted out from a slit-like mouth of an air knife nozzle crosswise of the entire width of the substrate plate and at a predetermined angle of incidence with respect to a drying surface of the substrate plate to scrape off a liquid. The angle of incidence of jet air is made shallower as soon as the substrate on the conveyer means comes to a point of entry to an air blasting zone and is made deeper at latest when the substrate plate comes to a position immediately before a point of disengagement from the air blasting zone.

Abstract: Thin substrate plates are transferred in a horizontal or tilted posture on and by a substrate transfer means. Provided by a substrate transfer path is an air knife nozzle for scraping and drying off a liquid successively from surfaces of the substrates on the substrate transfer means. The air knife nozzle is located substantially at a uniform distance across a drying surface of a substrate plate on the transfer means. The air knife nozzle is provided with a slit-like nozzle hole to spurt jet air to the drying surface from an angular direction relative to a direction perpendicular to the substrate transfer direction and to sweep the substrate across the entire width of the drying surface and with a predetermined angle of incidence relative to the substrate transfer direction.

Abstract: While being transferred in substantially horizontal state along a predetermined path of transfer by a conveyer means, a substrate plate is dried by a jet of compressed air which is spurted out from a slit-like mouth of an air knife nozzle crosswise of the entire width of the substrate plate and at a predetermined angle of incidence with respect to a drying surface of the substrate plate to scrape off a liquid. The angle of incidence of jet air is made shallower as soon as the substrate on the conveyer means comes to a point of entry to an air blasting zone and is made deeper at latest when the substrate plate comes to a position immediately before a point of disengagement from the air blasting zone.

Abstract: Described herein is a disk washing apparatus for cleaning substrate disks of memory medium, which comprises in combination: a loader section having a magazine for holding a number of disks to be washed; a working section including a washing stage arranged to wash the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, a rinsing stage arranged to rinse the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, and a drying stage adapted to dry a washed and rinsed disk by high speed spin drying; an unloader section having a magazine for accommodating cleaned disks; and disk transfer chucks adapted to transfer disks one after another stepwise from the loader section to the unloader section, passing the disks successively to the washing, rinsing and drying stages of the working section, the washing, rinsing, and drying stages being located in series between the loader and unloader sections.