Patents by Inventor Kazuhiko Hatakawa

Kazuhiko Hatakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6457963
    Abstract: The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a resin injection inlet of a pot has an opening at the center of the cavity surface of a cavity of a bottom mold that is a component of a mold unit, and a plunger for injecting molten resin in the pot from the opposite side to the resin injection inlet side is provided slidably and airtightly with the inside wall of the pot.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: October 1, 2002
    Assignee: Sony Corporation
    Inventors: Masato Tawara, Toshiyuki Ebara, Kazuhiko Hatakawa, Sadayuki Ito
  • Patent number: 5383077
    Abstract: Tape cassette tape guides are molded from a complex material of super macromolecular weight polyethylene-based resin having a molecular weight of from 500,000 to 1,000,000 mixed with polyphenyl sulfide resin or polybutylene terephthalate resin and carbon black of 1 to 15 percent by weight in order to reduce manufacturing costs.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: January 17, 1995
    Assignee: Sony Corporation
    Inventors: Shinya Sato, Kazuhiko Hatakawa