Abstract: The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

Abstract: The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

Abstract: A wireless communication apparatus includes a transmitting antenna; and a receiving antenna that receives a wireless signal transmitted from the transmitting antenna. Each of the transmitting antenna and the receiving antenna includes a plurality of circular loop antennas arranged concentrically in an identical plane, each of the plurality of circular loop antennas having a loop perimeter approximately equal to an integer multiple of one wavelength determined from a frequency in a wireless communication; and a plurality of feeding sections individually connected with the plurality of circular loop antennas. A central axis of the plurality of circular loop antennas of the transmitting antenna and a central axis of the plurality of circular loop antennas of the receiving antenna are arranged approximately on a straight line. Thus, a wireless signal is transmitted between the circular loop antennas having a loop perimeter of a transmitting side and a receiving side.

Abstract: Circular loop antenna elements of each of a transmitting antenna 100 and a receiving antenna 200 have different perimeters of approximately integral multiples of a wavelength determined from a wireless communication frequency. The transmitting antenna 100 and the receiving antenna 200 include first circular loop antenna groups 100A and 200A concentrically disposed on the same plane and second circular loop antenna groups 100B and 200B including circular loop antenna elements of the same perimeter as that of a plurality of circular loop antenna elements of the first circular loop antenna group. An angular position of a terminal for connecting power supply units to circular loop antenna elements having the same perimeter is set to an angular position rotated by (2l+1)?/2mi (where l is any integer, and mi is a value of m1 to mN that are approximately integral multiples of a wavelength) in the first and second circular loop antenna groups.

Abstract: Circular loop antenna elements of each of a transmitting antenna and a receiving antenna have different perimeters of approximately integral multiples of a wavelength determined from a wireless communication frequency. The transmitting antenna and the receiving antenna include first circular loop antenna groups concentrically disposed on the same plane and second circular loop antenna groups including circular loop antenna elements of the same perimeter as that of a plurality of circular loop antenna elements of the first circular loop antenna group. An angular position of a terminal for connecting power supply units to circular loop antenna elements having the same perimeter is set to an angular position rotated by (2l+1)?/2mi (where l is any integer, and mi is a value of m1 to mN that are approximately integral multiples of a wavelength) in the first and second circular loop antenna groups.

Abstract: A concurrent-type multiband amplifier (or a dual-band amplifier) which amplifies multiband signals concurrently using a plurality of (N) amplifier circuits which each independently amplify signals in a plurality of (N) frequency bands. An n-th (n=any of 1 to N) amplifier circuit is provided with a circuit for blocking signals in frequency bands other than the n-th frequency band so as to amplify and output only the n-th frequency band signal. The n-th amplifier circuit is designed so as to consist of its input/output impedance matching circuit for the n-th an amplifier element at the n-th frequency band.

Abstract: A wireless communication apparatus includes a transmitting antenna; and a receiving antenna that receives a wireless signal transmitted from the transmitting antenna. Each of the transmitting antenna and the receiving antenna includes a plurality of circular loop antennas arranged concentrically in an identical plane, each of the plurality of circular loop antennas having a loop perimeter approximately equal to an integer multiple of one wavelength determined from a frequency in a wireless communication; and a plurality of feeding sections individually connected with the plurality of circular loop antennas. A central axis of the plurality of circular loop antennas of the transmitting antenna and a central axis of the plurality of circular loop antennas of the receiving antenna are arranged approximately on a straight line. Thus, a wireless signal is transmitted between the circular loop antennas having a loop perimeter of a transmitting side and a receiving side.

Abstract: A concurrent-type multiband amplifier (or a dual-band amplifier) which amplifies multiband signals concurrently using a plurality of (N) amplifier circuits which each independently amplify signals in a plurality of (N) frequency bands. An n-th (n=any of 1 to N) amplifier circuit is provided with a circuit for blocking signals in frequency bands other than the n-th frequency band so as to amplify and output only the n-th frequency band signal. The n-th amplifier circuit is designed so as to consist of its input/output impedance matching circuit for the n-th an amplifier element at the n-th frequency band.

Abstract: A high efficiency power amplifier of the present invention includes a transistor and an output power processing circuit section. The output power processing circuit section includes an output matching circuit section and an output harmonic processing circuit section. The output matching circuit section carries out impedance matching to the fundamental wave component of the output power. The output harmonic processing circuit section carries out a reactive power control to a reactive power of a plurality of harmonic power components respectively having a plurality of harmonic angular frequencies which are integral multiples of the base angular frequency of the output power. The output harmonic processing circuit section is formed to realize the reactive power control to at least one of the plurality of harmonic power components by orthogonalizing the phases of the current and voltage in the reactive power.

Abstract: A multi-frequency circularly polarized antenna (100) comprises a substrate and multi-frequency antennas (900, 901). The multi-frequency antennas (900, 901) comprise antenna elements (120, 220, 30, 420), shunt-inductor conductors (170, 270, 370, 470), series-capacitor conductors (160a, 160b, 260a, 260b, 360a, 360b, 460a, 460b), series-inductor capacitors (140, 240, 340, 440), a center point (199) and input/output terminals (1q0, 210, 310, 410). The multi-frequency circularly polarized antenna (100) is constructed by connecting the shunt-inductor conductors (170, 270, 370, 470) of the multi-frequency antennas (900, 901) at the center point (199) in a substantially perpendicular manner.

Abstract: Electronic device is provided, including: a base wafer whose surface is made of silicon crystal; a Group 3-5 compound semiconductor crystal formed directly or indirectly on partial region of the silicon crystal; an electronic element including a portion of the Group 3-5 compound semiconductor crystal as active layer; an insulating film formed directly or indirectly on the base wafer and covering the electronic element; an electrode formed directly or indirectly on the insulating film; a first coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the electrode; a passive element formed directly or indirectly on the insulating film; a second coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the passive element.

Abstract: A multi-frequency antenna (1) comprises a dielectric substrate (100), an antenna element (110), a shunt inductor (120), a capacitor conductor (130), a series inductor (140), a grounded part (150) and a feeding point (160). The antenna element (110) is arranged on the substrate (100), and is electrically connected to the grounded part (150) through the shunt inductor (120). Moreover, the antenna element (110) is electrically connected to the feeding point (160) through a series capacitor formed by a part where the antenna element (110) faces the capacitor conductor (130) and the substrate (100) therebetween, and through the series inductor (140).

Abstract: A high efficiency power amplifier of the present invention includes a transistor and an output power processing circuit section. The output power processing circuit section includes an output matching circuit section and an output harmonic processing circuit section. The output matching circuit section carries out impedance matching to the fundamental wave component of the output power. The output harmonic processing circuit section carries out a reactive power control to a reactive power of a plurality of harmonic power components respectively having a plurality of harmonic angular frequencies which are integral multiples of the base angular frequency of the output power. The output harmonic processing circuit section is formed to realize the reactive power control to at least one of the plurality of harmonic power components by orthogonalizing the phases of the current and voltage in the reactive power.

Abstract: A miniature variable-beam microwave antenna (1) comprises antenna conductors (100a, 100b), an EBG conductor (120), a variable reactance element (130), and an adjusting part (150). The EBG conductor (120) is connected to a grounded part (160) through the variable reactance element (130). The adjusting part (150) changes the apparent reactance of the EBG conductor (120) by changing the capacity of the variable reactance element (130). As the apparent reactance of the EBG conductor (120) changes, the directivity of the miniature variable-beam microwave antenna (1) also changes.

Abstract: A microwave harmonic processing circuit includes (n?1) parallel open ended stubs differing in length, connected in parallel to an output terminal of a serial transmission line at a single point, and having predetermined electrical lengths corresponding to second to higher n-th (n is any integer) harmonics, respectively, the serial transmission line having an input terminal connected to an output terminal of a transistor and having a predetermined electrical length; a first strip conductor connecting the serial transmission line to two parallel open ended stubs of the (n?1) parallel open ended stubs at a single connecting point; a second strip conductor connecting the (n?3) parallel open ended stubs to each other at a single connecting point; a ground layer disposed between first strip conductor and second strip conductor; and a via electrically connecting a connecting portion of first strip conductor and a connecting portion of second strip conductor.

Abstract: A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region.

Abstract: A multi-frequency circularly polarized antenna (100) comprises a substrate and multi-frequency antennas (900, 901). The multi-frequency antennas (900, 901) comprise antenna elements (120, 220, 30, 420), shunt-inductor conductors (170, 270, 370, 470), series-capacitor conductors (160a, 160b, 260a, 260b, 360a, 360b, 460a, 460b), series-inductor capacitors (140, 240, 340, 440), a center point (199) and input/output terminals (1q0, 210, 310, 410). The multi-frequency circularly polarized antenna (100) is constructed by connecting the shunt-inductor conductors (170, 270, 370, 470) of the multi-frequency antennas (900, 901) at the center point (199) in a substantially perpendicular manner.

Abstract: Electronic device is provided, including: a base wafer whose surface is made of silicon crystal; a Group 3-5 compound semiconductor crystal formed directly or indirectly on partial region of the silicon crystal; an electronic element including a portion of the Group 3-5 compound semiconductor crystal as active layer; an insulating film formed directly or indirectly on the base wafer and covering the electronic element; an electrode formed directly or indirectly on the insulating film; a first coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the electrode; a passive element formed directly or indirectly on the insulating film; a second coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the passive element.

Abstract: A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor.

Abstract: The multifrequency antenna comprises a substrate, antenna elements, shunt inductor conductors, series capacitor conductors, series inductor conductors, a connection point, and input/output terminals. The antenna elements are provided on the substrate and electrically connected to the connection point via the shunt inductor conductors. The antenna elements form capacitors together with the parts facing the series capacitor conductors and are electrically connected to the input/output terminals via these capacitors and series inductor conductors.