Abstract: An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

Abstract: Provided are an aqueous composition with which the surface of stainless steel is adequately roughened in an efficient manner with few steps, a method for roughening stainless steel, etc. The problem mentioned above is solved by an aqueous composition for roughening the surface of stainless steel, the aqueous composition including 0.1-20 mass % of hydrogen peroxide with reference to the total amount of the aqueous composition, 0.25-40 mass % of copper ions with reference to the total amount of the aqueous composition, and 1-30 mass % of halide ions with reference to the total amount of the aqueous composition.

Abstract: Provided is a chromium-containing steel sheet for a current collector of a nonaqueous electrolyte secondary battery. The chromium-containing steel sheet for a current collector of a nonaqueous electrolyte secondary battery has a chemical composition containing Cr in an amount of 10% by mass or more. A parameter Sa defined in ISO 25178 is from 0.15 ?m to 0.50 ?m inclusive, and a parameter Ssk defined in ISO 25178 is more than 0.

Abstract: The problem of the present invention is to provide a roughening treatment method in which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good surface quality of the stainless steel after treatment. The above problem is solved by a roughening treatment method for stainless steel, which comprises a roughening treatment step that uses a first aqueous composition, and a post-treatment step that uses a second aqueous composition. Namely, the roughening treatment step is to roughen the surface of stainless steel containing copper or a metal having an ionization tendency larger than copper by bringing the first aqueous composition into contact with the surface, wherein the first aqueous composition comprises 0.1% to 20% by mass of hydrogen peroxide based on the total amount of the first aqueous composition, 0.

Abstract: The problem of the present invention is to provide an aqueous composition with which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good quality (e.g., thickness) of the stainless steel after treatment. The above problem is solved by the following aqueous composition for roughening the surface of stainless steel. Namely, the aqueous composition comprises 0.1% to 10% by mass of hydrogen peroxide based on the total amount of the aqueous composition, 1% to 30% by mass of halide ions based on the total amount of the aqueous composition, and 0% to 3% by mass of copper ions based on the total amount of the aqueous composition.

Abstract: Provided is a stainless steel foil for a catalyst support of an exhaust gas purifier excellent in both diffusion bonding resistance and brazeability and also excellent in oxidation resistance at high temperatures. The stainless steel foil for a catalyst support of an exhaust gas purifier comprises: a predetermined chemical composition; a parameter Sa defined in ISO 25178 of 0.50 ?m to 3.00 ?m; and a parameter Str defined in ISO 25178 of 0.20 to 1.00.

Abstract: It is provided a stainless steel sheet for fuel cell separators with low contact resistance, which can be produced very advantageously in terms of safety as well as mass production. A parameter Sa specified in ISO 25178 is set to 0.15 ?m or more and 0.50 ?m or less, and a parameter Ssk specified in ISO 25178 is set to more than 0.

Abstract: Provided are an aqueous composition with which the surface of stainless steel is adequately roughened in an efficient manner with few steps, a method for roughening stainless steel, etc. The problem mentioned above is solved by an aqueous composition for roughening the surface of stainless steel, the aqueous composition including 0.1-20 mass % of hydrogen peroxide with reference to the total amount of the aqueous composition, 0.25-40 mass % of copper ions with reference to the total amount of the aqueous composition, and 1-30 mass % of halide ions with reference to the total amount of the aqueous composition.

Abstract: The present invention provides: a composition with which the surface of a stainless steel is sufficiently roughened in an efficient manner with few steps; a method for roughening a stainless steel; and the like. The above are achieved by means of a composition for roughening the surface of a stainless steel, said composition containing from 0.1% by mass to 25% by mass of one or more substances that are selected from the group consisting of persulfuric acid and persulfuric acid salts based on the total amount of the composition, and from 1% by mass to 30% by mass of halide ions based on the total amount of the composition.

Abstract: A pet food recommending device and a pet food recommending method for recommending a food suitable for a pet are provided. A pet food recommending device is provided, the device including a recommending means that recommends a food suitable for a pet, based on a result of a stool inspection of the pet and attribute information on the pet.

Abstract: An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

Abstract: Coaxial connector including a center conductor provided inside an outer conductor with a tubular outer conductor main body. A mating portion on one side in the axial direction of the outer conductor main body detachably mates with a counterpart connector. A supporting portion on the other side in the axial direction of the outer conductor main body supports the center conductor through the insulating member medium. Securing portions projecting from the end face on the other side in the axial direction or from the outer peripheral surface on the other side in the axial direction of the outer conductor main body towards the other side in the axial direction securing the outer conductor by soldering to a conductor pattern on the board surface. A first barrier portion on the outer peripheral surface on the other side in the axial direction of the outer conductor main body blocks solder flow.

Abstract: Coaxial connector including a center conductor provided inside an outer conductor with a tubular outer conductor main body. A mating portion on one side in the axial direction of the outer conductor main body detachably mates with a counterpart connector. A supporting portion on the other side in the axial direction of the outer conductor main body supports the center conductor through the insulating member medium. Securing portions projecting from the end face on the other side in the axial direction or from the outer peripheral surface on the other side in the axial direction of the outer conductor main body towards the other side in the axial direction securing the outer conductor by soldering to a conductor pattern on the board surface. A first barrier portion on the outer peripheral surface on the other side in the axial direction of the outer conductor main body blocks solder flow.

Abstract: The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating 4 on an insulation layer 3 or forming a copper thin film on the insulation layer 3 using a sputtering method; subjecting the obtained copper surface 4 to a roughening treatment using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles; attaching a dry film resist 5 to the copper surface 4 after the roughening treatment to perform exposure and development and providing an electrolytic copper plating 7 to an opening 6 after the exposure; and subjecting the remaining dry film resist to a stripping treatment using a resist stripping liquid containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycols and 0.01 to 0.5% by mass of azoles.

Abstract: The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating 4 on an insulation layer 3 or forming a copper thin film on the insulation layer 3 using a sputtering method; subjecting the obtained copper surface 4 to a roughening treatment using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles; attaching a dry film resist 5 to the copper surface 4 after the roughening treatment to perform exposure and development and providing an electrolytic copper plating 7 to an opening 6 after the exposure; and subjecting the remaining dry film resist to a stripping treatment using a resist stripping liquid containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycols and 0.01 to 0.5% by mass of azoles.

Abstract: According to one aspect of the invention, there is provided a mobile apparatus including: a sensor configured to detect acceleration applied to the mobile apparatus and to generate a detection signal; a memory configured to record count data based on the detection signal, the count data associated with movement of the mobile apparatus; a counting module configured to count the number of user's steps based on the count data; a sound module configured to sound; and a counting control module configured to control the counting module to stop counting of the number of user's steps when the sound module starts sounding.

Abstract: The present invention discloses an antenna apparatus including a dielectric substrate on which an element including a conductive material pattern is formed. The dielectric substrate is a film.

Abstract: The present invention provides a method of predicting drug-induced phospholipidosis, comprising a step of contacting a mammalian cell with a test compound, a step of measuring extracellular and/or intracellular lysosomal enzyme level or activity, or measuring intracellular LC3 level, and a step of selecting a test compound that has enhanced extracellular secretion of the enzyme or increased the protein level as a compound capable of inducing drug-induced phospholipidosis.

Abstract: A disclosed antenna apparatus includes: a punched out antenna element made of a sheet metal; a punched out ground element made of a sheet metal, the ground element facing the antenna element; and a surface mount type coaxial connector mounted across the antenna element and the ground element.

Abstract: A disclosed antenna apparatus includes: a punched out antenna element made of a sheet metal; a punched out ground element made of a sheet metal, the ground element facing the antenna element; and a surface mount type coaxial connector mounted across the antenna element and the ground element.