Abstract: A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside the engagement holes. Soldering paste is applied in the vicinity of the engagement holes or in an area covering a portion of each of the engagement holes and the vicinity of the engagement holes on the mother printed-circuit board from the side of the component-mounted surface such that soldering paste is not entirely filled in the engagement hole. A plurality of shielding cases are engaged in the mother printed-circuit board by inserting engagement protrusion portions of the shielding cases into the engagement holes. Then the engagement protrusion portions of the shielding cases are soldered to case-fixing electrodes inside the engagement holes by melting solder in the soldering paste. The mother printed-circuit board is then cut and divided into individual electronic components.

Abstract: A method of producing an electronic component including the steps of applying solder paste to both a connection land electrode, to which a surface-mount part is to be electrically and mechanically connected, and a case-fixing electrode, to which an engaging portion of a shield case is to be electrically and mechanically connected and affixed; mounting the surface-mount part and the shield case onto predetermined locations of a printed board, the shield case being mounted so as to accommodate the surface-mount part therein; and after the mounting step, soldering the surface-mount part and the shield case onto the printed board at the same time by putting printed board, having the surface-mount part and the shield case mounted thereon, into a reflow oven. The electronic component production method makes it possible to efficiently produce an electronic component having a structure in which a surface-mount part is accommodated in a shield case.

Abstract: The present invention provides an electronic component with high positional accuracy for attaching a shield case to a substrate while being excellent in shielding performance and having high reliability for mounting, wherein engaging recesses are provided on the side face of the substrate mounting the surface mounted component, and a plurality of engaging pins to be inserted into the engaging recesses of the substrate are provided on the shield case, the engaging pin of the shield case being so configured as to engage with the engaging recess while applying an enhanced elastic force to the engaging pin, thereby allowing the shield case to be securely held on the substrate by the plural engaging pin inserted into the engaging recesses of the substrate.

Abstract: The present invention provides a method for manufacturing a highly reliable electronic component in which the shield case is securely fixed to a substrate without requiring a step for filling a solder paste in engaging holes, and a highly reliable electronic component with a shield case manufactured by the method, wherein engaging pins of the shield case are inserted into the engaging holes of the mother substrate, reflow soldering is applied when the solder paste is coated on the circumference of the engaging holes as well as on the area including the circumference of the engaging hole and at least a part of the engaging hole at the reversed face (back face) of the component mounting face covered with the shield case of the mother substrate, and mother substrate is divided into individual electronic component with the shield case after soldering the engaging pins of the shield case to the case fixing electrodes disposed on the circumference face of the engaging holes.

Abstract: A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside the engagement holes. Soldering paste is applied in the vicinity of the engagement holes or in an area covering a portion of each of the engagement holes and the vicinity of the engagement holes on the mother printed-circuit board from the side of the component-mounted surface such that soldering paste is not entirely filled in the engagement hole. A plurality of shielding cases are engaged in the mother printed-circuit board by inserting engagement protrusion portions of the shielding cases into the engagement holes. Then the engagement protrusion portions of the shielding cases are soldered to case-fixing electrodes inside the engagement holes by melting solder in the soldering paste. The mother printed-circuit board is then cut and divided into individual electronic components.

Abstract: Disclosed is a method for manufacturing electronic parts in which the soldering operation, the operation of checking the soldering and the operation of mounting the shield cases are simplified and in which an improvement is achieved in terms of the dimensional accuracy of the electronic parts. Before a mother board is cut and divided, through-holes 14 formed around sections corresponding to substrates 2 are filled with solder 15. Next, legs 1c of shield cases 1 are inserted into the solder 15 such that they are brought into close contact with the inner peripheral surfaces of the through-holes 14, and the legs 1c are secured in position by reflow soldering. Then, the mother board is cut so as to separate the through-holes 14 (the solder 15), whereby electronic parts are obtained each of which is composed of a shield case 1 and a substrate 2 on the sides 2b and 2c of which the solder 15 is exposed.