Abstract: A method for producing an MI element includes: an insulation step of forming an insulator layer on an outer periphery of an amorphous wire; an electroless plating step of forming an electroless plating layer on an outer peripheral surface of the insulator layer; an electrolytic plating step of forming an electrolytic plating layer on an outer peripheral surface of the electroless plating layer; a resist step of forming a resist layer on an outer peripheral surface of the electrolytic plating layer; an exposure step of exposing the resist layer with a laser to form a spiral groove strip on an outer peripheral surface of the resist layer; an etching step of performing etching using the resist layer as a masking material and removing the electroless plating layer and the electrolytic plating layer in the groove strip to form a coil with the remaining electroless plating layer and electrolytic plating layer.

Abstract: A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.

Abstract: A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.

Abstract: A control device in a hybrid vehicle in which control is performed so that the hybrid vehicle can travel using only one shift mechanism from two shift mechanisms is provided. The control device in the hybrid vehicle includes: a transmission including: a first input shaft connected to a motor and optionally connected to an engine; a second input shaft optionally connected to the engine; an output shaft configured to output to power to drive wheels; a first shift mechanism including a plurality of shift gears optionally coupled to the first input shaft; and a second shift mechanism including a plurality of other shift gears optionally coupled to the second input shaft; and an electronic control unit (ECU), wherein the ECU starts the engine with the first input shaft using the motor if none of the shift gears in the first shift mechanism is engaged when the engine is not operating.

Abstract: A revolution rate sensor configured to detect a revolution rate of a first input shaft and an ECU configured to estimate the revolution rate of the first input shaft using another method which is not based on detection of the revolution rate sensor are provided, and the ECU performs engagement permission determination of a switching mechanism associated with the lowest shift stage in first engagement switching mechanisms using an estimated value of the revolution rate of the first input shaft estimated by the ECU when it is determined that a revolution rate of the first input shaft cannot be detected normally by the revolution rate sensor.

Abstract: A gear operating mechanism comprises: a power source; an operation shaft driven using the power source and rotatably supported in a rotational direction and an axial direction; members to be operated corresponding to fork parts; an operation engagement piece attached to the operation shaft and configured to move each member to be operated between a reference position and an engagement position; a release engagement pieces attached to the operation shaft and configured to return the members to be operated from the engagement position to the reference position; and a control unit configured to control an operation of the operation shaft is provided, wherein the control unit has a first release mode using the release engagement pieces and a second release mode using the operation engagement piece when the member to be operated is returned from the engagement position to the reference position.

Abstract: A manufacturing method of a semiconductor package includes etching a first surface and a side surface of a base substrate, the base substrate including the first, a second and the side surfaces positioned between the first and the second surfaces, the base substrate containing a metal, attaching a metal different from the metal contained in the base substrate to the first and the side surfaces, disposing a semiconductor device on the second surface, the semiconductor device having an external terminal, forming a resin insulating layer sealing the semiconductor device, forming a first conductive layer on the resin insulating layer, forming an opening, exposing the external terminal, in the first conductive layer and the resin insulating layer; and forming a metal layer on the first and the side surfaces, on the first conductive layer and in the opening.

Abstract: A gear operating mechanism configured to more reliably perform a gear operation is provided. A power source, an operation shaft driven using the power source and rotatably supported in a rotational direction and an axial direction, member to be operated corresponding to fork parts, an operation engagement piece attached to the operation shaft and configured to move each member to be operated between a reference position and an engagement position, release engagement pieces attached to the operation shaft and configured to return the members to be operated from the engagement position to the reference position, and a control unit configured to control an operation of the operation shaft are provided, wherein the control unit has a first release mode using the release engagement pieces and a second release mode using the operation engagement piece when the member to be operated is returned from the engagement position to the reference position.

Abstract: A control device in a hybrid vehicle in which control is performed so that the hybrid vehicle can travel using only one shift mechanism from two shift mechanisms is provided. The control device in the hybrid vehicle includes: a transmission including: a first input shaft connected to a motor and optionally connected to an engine; a second input shaft optionally connected to the engine; an output shaft configured to output to power to drive wheels; a first shift mechanism including a plurality of shift gears optionally coupled to the first input shaft; and a second shift mechanism including a plurality of other shift gears optionally coupled to the second input shaft; and an electronic control unit (ECU), wherein the ECU starts the engine with the first input shaft using the motor if none of the shift gears in the first shift mechanism is engaged when the engine is not operating.

Abstract: A revolution rate sensor configured to detect a revolution rate of a first input shaft and a revolution rate estimation unit configured to estimate the revolution rate of the first input shaft using another method which is not based on detection of the revolution rate sensor are provided, and a control unit performs engagement permission determination of a switching mechanism associated with the lowest shift stage in first engagement switching mechanisms using an estimated value of the revolution rate of the first input shaft estimated by the revolution rate estimation unit when it is determined that a revolution rate of the first input shaft cannot be detected normally by the revolution rate sensor.

Abstract: A manufacturing method of a semiconductor package includes etching a first surface and a side surface of a base substrate, the base substrate including the first, a second and the side surfaces positioned between the first and the second surfaces, the base substrate containing a metal, attaching a metal different from the metal contained in the base substrate to the first and the side surfaces, disposing a semiconductor device on the second surface, the semiconductor device having an external terminal, forming a resin insulating layer sealing the semiconductor device, forming a first conductive layer on the resin insulating layer, forming an opening, exposing the external terminal, in the first conductive layer and the resin insulating layer; and forming a metal layer on the first and the side surfaces, on the first conductive layer and in the opening.

Abstract: A manufacturing method of a semiconductor package includes disposing one or more semiconductor devices on a base substrate, each of the one or more semiconductor devices having an external terminal; forming a frame on the base substrate, the frame surrounding the one or more semiconductor devices; and forming a resin insulating layer inside the frame, the resin insulating layer sealing the one or more semiconductor devices and the resin insulating layer including a resin insulating material; wherein a surface of each of the one or more semiconductor devices on which the external terminal is not provided faces the base substrate.

Abstract: A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.

Abstract: A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.

Abstract: A sheet discharging device includes a shift tray 202 on which a sheet P1 is stacked, a discharging roller 6 that discharges a sheet P2 onto the shift tray 202, a blowing device 230 that sends air to a lower surface of the sheet P2 discharged by the discharging roller 6, a blocking member 231 that blocks air sent to the lower surface of the sheet P2 from a blowing port 230-2 of the blowing device 230, and a control unit that controls the blocking amount of the blocking member 231. The blocking amount is determined based upon sheet information including sheet-type information, sheet-size information, and sheet-thickness information, for example.

Abstract: A sheet discharging device includes a shift tray 202 on which a sheet P1 is stacked, a discharging roller 6 that discharges a sheet P2 onto the shift tray 202, a blowing device 230 that sends air to a lower surface of the sheet P2 discharged by the discharging roller 6, a blocking member 231 that blocks air sent to the lower surface of the sheet P2 from a blowing port 230-2 of the blowing device 230, and a control unit that controls the blocking amount of the blocking member 231. The blocking amount is determined based upon sheet information including sheet-type information, sheet-size information, and sheet-thickness information, for example.

Abstract: A sheet discharging device includes a shift tray 202 on which a sheet P1 is stacked, a discharging roller 6 that discharges a sheet P2 onto the shift tray 202, a blowing device 230 that sends air to a lower surface of the sheet P2 discharged by the discharging roller 6, a blocking member 231 that blocks air sent to the lower surface of the sheet P2 from a blowing port 230-2 of the blowing device 230, and a control unit that controls the blocking amount of the blocking member 231. The blocking amount is determined based upon sheet information including sheet-type information, sheet-size information, and sheet-thickness information, for example.

Abstract: A sheet discharging device includes a shift tray 202 on which a sheet P1 is stacked, a discharging roller 6 that discharges a sheet P2 onto the shift tray 202, a blowing device 230 that sends air to a lower surface of the sheet P2 discharged by the discharging roller 6, a blocking member 231 that blocks air sent to the lower surface of the sheet P2 from a blowing port 230-2 of the blowing device 230, and a control unit that controls the blocking amount of the blocking member 231. The blocking amount is determined based upon sheet information including sheet-type information, sheet-size information, and sheet-thickness information, for example.

Abstract: A sheet discharging device includes a shift tray 202 on which a sheet P1 is stacked, a discharging roller 6 that discharges a sheet P2 onto the shift tray 202, a blowing device 230 that sends air to a lower surface of the sheet P2 discharged by the discharging roller 6, a blocking member 231 that blocks air sent to the lower surface of the sheet P2 from a blowing port 230-2 of the blowing device 230, and a control unit that controls the blocking amount of the blocking member 231. The blocking amount is determined based upon sheet information including sheet-type information, sheet-size information, and sheet-thickness information, for example.

Abstract: A hybrid vehicle comprises an engine 2, a motor generator 4, a torque converter 6 with a lock-up clutch 5, and a ratio-change mechanism 7. A control system for the hybrid vehicle comprises a rotational sensor 22, which detects the slip ratio of the torque converter, and a hydraulic control valve 12, which controls the engagement of the lock-up clutch. While the vehicle is moving along with the accelerator pedal being released from its stepped down condition, a driving force from the wheels is transmitted to the motor generator 4 for energy regeneration. If the slip ratio of the torque converter is equal to or smaller than a first threshold value, then only the lock-up clutch is controlled into engagement. However, if the slip ratio is between the first threshold value and a second threshold value, then additionally the motor generator is controlled in cooperative operation.