Abstract: A semiconductor device according to the present invention includes a conductor member, an IC-chip and leads, all molded together with a resin mold. The conductor member is composed of a base portion on which the IC-chip is mounted, a cover portion for covering a functioning surface of the IC-chip, and a bent portion connecting the cover portion to the base portion. The base portion includes a lead portion that is grounded. The cover portion and the base portion are positioned substantially in parallel to each other, and the IC-chip is disposed in an inner space between the cover portion and the base portion. The lead portion to be grounded and the leads electrically connected to the IC-chip extend out of the resin mold. Since the IC-hip is disposed in the inner space of the conductor member that is grounded, the IC-chip is protected from the electromagnetic noises and from electrostatic charges otherwise accumulated in the resin mold.

Abstract: A connector having insulation for electrical connection includes a housing having a concave portion, a terminal insert-molded in the housing, a lead wire electrically coupled with the terminal, a potting material for sealing the concave portion and an insulation material. The connector uses the insulation material in contact with the potting material to cover an end of the terminal extending upward in the concave portion.

Abstract: An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an electronic element mounted on the casing through wires. The buffer is made of a material having a coefficient of thermal expansion smaller than that of the body of the casing, thereby decreasing undesirable movement of the terminals leading to fatigue of the wires which arises from a change in temperature of the casing. This minimizes a drop in mechanical strength of the wires caused by thermal cycling to which the casing is subjected.

Abstract: An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an electronic element mounted on the casing through wires. The buffer is made of a material having a coefficient of thermal expansion smaller than that of the body of the casing, thereby decreasing undesirable movement of the terminals leading to fatigue of the wires which arises from a change in temperature of the casing. This minimizes a drop in mechanical strength of the wires caused by thermal cycling to which the casing is subjected.

Abstract: A pressure detection apparatus is manufactured by fitting an end portion of a first case into an opening portion of a second case, filling a space, which is defined between the end portion of the first case and an opening edge portion of the second case, with adhesive, and hardening the adhesive. Accordingly, variations in volume of a pressure detection chamber sealed between the first case and the second case can be reduced, resulting in decreased variations in output.

Abstract: A pressure-adjusting device for adjusting an output of an integrated pressure sensor in which a silicon wafer is joined onto a seat that has pressure-adjusting passages formed therein, and which has formed in the silicon wafer a signal processing circuit with an adjusting resistor for each chip, a thin diaphragm for each chip and a piezo-resistance layer for each chip. The pressure-adjusting device includes a pressure-setting stage on which the seat is placed, the pressure setting stage having pressure-adjusting passages formed therein to adjust a pressure exerted on the respective thin diaphragm via the pressure-adjusting passages formed in the seat. A holding member is arranged on the pressure-setting stage as to surround at least an outer periphery of the seat. A first elastic air-tight member is arranged on the pressure-setting stage as to surround the outer periphery of the seat and be held compressed by the pressure-setting stage and by the holding member.

Abstract: A method of fabricating an integrated pressure sensor, which is capable of decreasing adverse effects caused by the distortion occurring at the time when a silicon wafer and a seat are joined together. On a silicon wafer 1 are formed a thin diaphragm 2 for each of the chips, a piezo-resitance layer for each of the chips, and a signal processing circuit with an adjusting resistor for each of the chips. The silicon wafer 1 is joined onto a glass seat 6 that has pressure-adjusting passges 7 formed therein to adjust the pressure exerted on the diaphragms 2 of the silicon wafer 1. Half-dicing is effected that reaches a predetermined depth of the glass seat 6 penetrating through the silicon wafer 1 for each of the chips, and resistance of the adjusting resistor is adjusted for each of the chips while adjusting the pressure applied to the diaphragms 2 via pressure-adjusting passages 7 in the seat in a step of adjusting the pressure sensitivity by trimming the wafer and by applying a negative pressure.

Abstract: A floating type composite magnetic head includes a head core fixed to a slider formed of nonmagnetic material. In the head core, a pair of magnetic core halves are abutted against each other with nonmagnetic material such as SiO.sub.2 or the like interposed therebetween. The first and second magnetic core half members have first and second gap forming surfaces to be abutted against each other to define a magnetic gap (g), respectively. A first groove is formed on the second gap forming surface. A glass layer is formed in the first groove. A first thin film including a ferromagnetic metal thin film is selectively formed on the first gap forming surface. A second thin film including a ferromagnetic metal thin film is selectively formed on the second gap forming surface so that at least a portion except the surface of the glass layer in the second gap forming surface is exposed. A second groove is formed on the exposed second gap forming surface adjacent to the first groove.

Abstract: A floating-type magnetic head comprising a slider and a core chip secured thereto. The core chip comprises a pair of core segments joined together with a gap spacer and a thin ferromagnetic metal film which are formed at the joint only over a portion of the entire area of the joint which portion terminates at the face of the core chip to be opposed to magnetic recording media. The two core segments area bonded to each other with glass present over the remaining portion of the joint area. In producing the magnetic head, the core chip is prepared by fabricating a core block comprising a pair of base plates joined together and strips of thin ferromagnetic metal film and gap spacer provided at the joint, and machining the core block.