Abstract: To provide an opto-electric module that can be cooled efficiently.

Abstract: Provided is an optical module having high efficiency in optical coupling to a functional element on a substrate. An optical module includes: a first optical waveguide disposed parallel to a substrate; a condensing mirror configured to reflect and condense light propagated in the first optical waveguide toward the substrate; a second optical waveguide formed in a tapered shape narrowed toward the substrate, the second optical waveguide guiding the light reflected by the condensing mirror to the vicinity of the surface of the substrate; and an optical function unit disposed on the substrate such that the light emitted from the second optical waveguide is incident on the optical function unit.

Abstract: Provided is a light receiving element with high light receiving sensitivity. The light receiving element comprises: a light absorbing layer that absorbs light to generate a carrier; and a diffraction element that converts the optical path of first polarized light, which is obliquely incident on a plane formed by the light absorbing layer, so that the first polarized light propagates in a first direction along the light absorbing layer, and that converts the optical path of second polarized light incident from the same direction as the first polarized light so that the second polarized light propagates in a second direction, opposite the first direction, along the light absorbing layer.

Abstract: Provided is a light receiving element with high light receiving sensitivity. The light receiving element comprises: a light absorbing layer that absorbs light to generate a carrier; and a diffraction element that converts the optical path of first polarized light, which is obliquely incident on a plane formed by the light absorbing layer, so that the first polarized light propagates in a first direction along the light absorbing layer, and that converts the optical path of second polarized light incident from the same direction as the first polarized light so that the second polarized light propagates in a second direction, opposite the first direction, along the light absorbing layer.

Abstract: A semiconductor integrated circuit that reduces a loss in an electrical signal and a method for manufacturing the semiconductor integrated circuit are provided. The semiconductor integrated circuit comprises a first region on which an optical circuit is to be formed and a second region on which an electrical signal wiring is to be formed. The first region comprises an Si substrate (502), a BOX layer (504) formed on the Si substrate (502), a first SOI layer (506) formed as an optical circuit on the BOX layer (504), and a first SiO2 layer (508) formed on the first SOI layer (506). The second region comprises the Si substrate (502), the BOX layer (504), a second SiO2 layer (508) formed on the BOX layer (504), and an electrical signal wiring (510) formed on the second SiO2 layer (508).

Abstract: This present invention is provided with: a semiconductor laser for emitting laser light in a plurality of channels; optical waveguides optically coupled in a corresponding manner to the semiconductor lasers, the optical waveguides propagating laser light as input light for each channel; optical modulators for modulating the input light and generating an optical signal; and an optical signal output unit coupled to the optical modulators, the optical signal output unit outputting the optical signal propagated from the optical modulators to the exterior. The present invention is characterized in that the semiconductor laser is arranged on the opposite side from an optical branching unit and the optical modulators, with the optical signal output unit interposed therebetween, in the plane of an opto-electric hybrid board.

Abstract: A photoelectric hybrid device includes an optical connector on a flat optical surface at one end of vertical optical waveguides for inputting and outputting an optical signal. Integration of the photoelectric hybrid device into an interposer or the like is standardized. The photoelectric hybrid device includes: conductive pins connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member having a flat optical surface and a translucent part; and self-organizing optical waveguides that form an optical path between the translucent part and an optical waveguide. The flat optical surface is not lower than the tops of the electrical connection parts on the conductive pins. Collision of the optical connector and the tops of the electrical connection parts can be avoided when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides.

Abstract: A semiconductor integrated circuit that reduces a loss in an electrical signal and a method for manufacturing the semiconductor integrated circuit are provided. The semiconductor integrated circuit comprises a first region on which an optical circuit is to be formed and a second region on which an electrical signal wiring is to be formed. The first region comprises an Si substrate (502), a BOX layer (504) formed on the Si substrate (502), a first SOI layer (506) formed as an optical circuit on the BOX layer (504), and a first SiO2 layer (508) formed on the first SOI layer (506). The second region comprises the Si substrate (502), the BOX layer (504), a second SiO2 layer (508) formed on the BOX layer (504), and an electrical signal wiring (510) formed on the second SiO2 layer (508).

Abstract: Provided is a transmission unit for an optical transmitter/receiver or an optical transmitter provided with an optical integrated circuit, characterized in the arrangement of a single-channel or multichannel semiconductor laser and the placement of a plurality of optical waveguides. This present invention is provided with: a semiconductor laser for emitting laser light in a plurality of channels; optical waveguides optically coupled in a corresponding manner to the semiconductor lasers, the optical waveguides propagating laser light as input light for each channel; optical modulators for modulating the input light and generating an optical signal; and an optical signal output unit coupled to the optical modulators, the optical signal output unit outputting the optical signal propagated from the optical modulators to the exterior.

Abstract: In a photoelectric hybrid device, an optical connector is mounted on a flat optical surface provided on one end of vertical optical waveguides for inputting and outputting an optical signal, and along with making integration of the photoelectric hybrid device into an interposer or the like easy, integration is standardized. The photoelectric hybrid device is provided with: conductive pins (108) that are connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member (116) that has a flat optical surface and also has a translucent part (118); and a plurality of self organizing optical waveguides (122) that form an optical path between the translucent part (118) and an optical waveguide of the photoelectric hybrid substrate.

Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.

Abstract: An optical backplane connector with a board removable (being possible to insert and remove) therein in the direction perpendicular to the backplane plate surface is arranged on a backplane having optical transmission paths. The optical backplane connector accommodates a photoelectric conversion module in such a manner the incident and exit light are perpendicular to the backplane and a transparent board with a photoelectric conversion element mounted thereon is perpendicular to the board and parallel to the backplane. The conduction between the electric contacts of the photoelectric conversion module and the inner electric contacts of the optical backplane connector is held by mechanical contact. At the end portion of the optical transmission path on the backplane, an optical connector having a 45? mirror and guide pins is mounted. The positioning operation is achieved by fitting the guide pins of the optical connector with the guide holes of the photoelectric conversion module.

Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.

Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.

Abstract: An optical connector fitted upon a tip end portion of an optical fiber ribbon and disposed to face an optical input and output terminators which are installed upon a substrate, and which optically connects between optical fibers of the optical fiber ribbon and each of the optical input and output terminators. The optical connector includes a block shaped connector main body which is disposed to face the optical input and output terminators.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: On the back surface of a transparent plate having a light extracting part for outputting lights to the outside, an electrode for wiring, and an electrode for an electromagnetic shield, an optical device is flip-chip mounted right under the light extracting part, an a driver IC is flip-chip mounted at a desired position with metal bumps. When currents driving the optical device flow from the driver IC according to an electric logical signal from the outside, an optical signal is emitted from the optical device, and is output to the outside through the light extracting part. The light extracting part may be provided with a light coupling material or an optical axis converter.

Abstract: An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.

Abstract: An optical backplane connector with a board removable (being possible to insert and remove) therein in the direction perpendicular to the backplane plate surface is arranged on a backplane having optical transmission paths. The optical backplane connector accommodates a photoelectric conversion module in such a manner the incident and exit light are perpendicular to the backplane and a transparent board with a photoelectric conversion element mounted thereon is perpendicular to the board and parallel to the backplane. The conduction between the electric contacts of the photoelectric conversion module and the inner electric contacts of the optical backplane connector is held by mechanical contact. At the end portion of the optical transmission path on the backplane, an optical connector having a 45? mirror and guide pins is mounted. The positioning operation is achieved by fitting the guide pins of the optical connector with the guide holes of the photoelectric conversion module.

Abstract: A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.