Abstract: An ultrasonic endoscope in which the temperature rise can be suppressed with a reduced diameter. The ultrasonic endoscope includes: an ultrasonic transducer part including plural ultrasonic transducers; an exterior member for accommodating the ultrasonic transducer part; and a heat conducting part provided inside of the exterior member and respectively connected to the ultrasonic transducer part and an inner surface of the exterior member. It is preferable that the heat conducting part has a coefficient of thermal conductivity equal to or more than 10 W/(m·K). Further, it is preferable that one of the heat conducting member and the exterior member has an electric insulation property.

Abstract: An ultrasonic endoscope having a small size and a slight temperature rise of an insertion part even when the transmission output of an ultrasonic transducer part is increased or an imaging device is attached thereto. The ultrasonic endoscope includes: an ultrasonic transducer part having plural ultrasonic transducers for transmitting and receiving ultrasonic waves; a flexing part for flexibly supporting the ultrasonic transducer part; a coupling part for coupling the flexing part to an operation part; a covering material for covering at least the flexing part and the coupling part; and a heat-conducting member provided inside of the covering material and coupled to the ultrasonic transducer part, for transferring heat generated in the ultrasonic transducer part to the operation part.

Abstract: A laser apparatus includes: a plurality of laser diodes respectively having light-emission points and being fixed to a block so that the light-emission points are aligned along a direction; and a collimator-lens array integrally formed to contain a plurality of collimator lenses which are arranged along a direction and respectively collimate laser beams emitted from the plurality of laser diodes. The block has a lens-setting surface which is flat, perpendicular to optical axes of the plurality of laser diodes, and located on the forward side of the plurality of laser diodes at a predetermined distance from the light-emission points, and the collimator-lens array is fixed to the block so that an end surface of the collimator-lens array is in contact with the lens-setting surface.

Abstract: In an ultrasonic endoscope, excessive temperature rise due to heat generated from ultrasonic transducers and/or an image pickup device is prevented. The ultrasonic endoscope includes: an ultrasonic transducer part including plural ultrasonic transducers for transmitting and receiving ultrasonic waves, and a backing material provided on a back of the plural ultrasonic transducers and having plural signal terminals provided on a surface opposite to the plural ultrasonic transducers; a signal line holding part including a highly heat conducting filler filling a space holding a group of shield lines electrically connected to the ultrasonic transducers via the plural signal terminals, and coupled to the backing material; and a highly heat conducting layer provided in contact with the signal line holding part, and thereby coupled to the signal line holding part.

Abstract: A laser module includes: a chassis having a light-output window from which one or more laser beams are outputted; a hermetically sealed package which is fixed to the chassis; one or more semiconductor laser elements which are arranged in the hermetically sealed package, and emit the one or more laser beams; a transparent member which is arranged to cover the light-output window; an optical fiber which has a light-entrance end face, and is arranged outside the chassis so that the light-entrance end face is in contact with the transparent member; and an optical condensing system which is arranged inside the chassis, and makes the one or more laser beams pass through the transparent member and be condensed on the light-entrance end face. The transparent member and the optical fiber are detachably attached to the chassis.

Abstract: In a laser array unit in which a plurality of laser beams emitted from a laser array is received by a lens array, the lens holder for fixedly bonding the lens array is formed such that the length of the surface on which the lens array is bonded in the direction orthogonal to the optical axis direction of the lens is longer than the length of the surface to be bonded to a certain other fixing member in the same direction.

Abstract: An ultrasonic endoscope in which the temperature rise can be suppressed with a reduced diameter. The ultrasonic endoscope includes: an ultrasonic transducer part including plural ultrasonic transducers; an exterior member for accommodating the ultrasonic transducer part; and a heat conducting part provided inside of the exterior member and respectively connected to the ultrasonic transducer part and an inner surface of the exterior member. It is preferable that the heat conducting part has a coefficient of thermal conductivity equal to or more than 10 W/(m·K). Further, it is preferable that one of the heat conducting member and the exterior member has an electric insulation property.

Abstract: An ultrasonic endoscope capable of suppressing temperature rise of an insertion part without increase in diameter. The ultrasonic endoscope includes: an ultrasonic transducer part having plural ultrasonic transducers; an exterior member for holding the ultrasonic transducer part; an opening formed in the exterior member; a heat conducting member arranged inside of the exterior member and connected to the ultrasonic transducer part; and a heat radiating member provided on an outer surface of the exterior member and connected to the heat conducting member via the opening. For example, a part of the heat radiating member is located within the opening and the part is connected to the heat conducting member. The heat radiating member is electrically insulated from the ultrasonic transducer part.

Abstract: A laser apparatus includes: one or more semiconductor lasers emitting one or more laser beams; an optical fiber; an optical condensing system which makes the one or more laser beams enter the optical fiber from a light-entrance end of the optical fiber; and a package which fixedly contains the optical condensing system and the one or more semiconductor lasers, and fixedly holds the optical fiber in such a manner that the light-entrance end faces the optical condensing system. The one or more semiconductor lasers are directly or indirectly fixed to the package with solder, and the one or more optical components are directly or indirectly fixed to the package with a thin layer of adhesive having a thickness of less than or equal to 1 micrometer, and preferably a thickness within a range of 0.2 micrometers to 1 micrometer after being dried.

Abstract: An ultrasonic endoscope having a small size and a slight temperature rise even when the transmission output is increased. The ultrasonic endoscope includes: an ultrasonic transducer part; a Peltier element having a cooling surface coupled to the ultrasonic transducer part and a radiating surface; a flexing part for supporting the ultrasonic transducer part and the Peltier element; a coupling part for coupling the flexing part to an operation part; a covering material for covering the flexing part and the coupling part; a thermal insulating material provided inside of the covering material, for thermally insulating a part from the radiating surface of the Peltier element to the operation part from outside; and a heat-conducting member provided inside of the thermal insulating material and coupled to the radiating surface of the Peltier element, for transferring heat generated in the ultrasonic transducer part to the operation part.

Abstract: An ultrasonic endoscope having a small size and a slight temperature rise of an insertion part even when the transmission output of an ultrasonic transducer part is increased or an imaging device is attached thereto. The ultrasonic endoscope includes: an ultrasonic transducer part having plural ultrasonic transducers for transmitting and receiving ultrasonic waves; a flexing part for flexibly supporting the ultrasonic transducer part; a coupling part for coupling the flexing part to an operation part; a covering material for covering at least the flexing part and the coupling part; and a heat-conducting member provided inside of the covering material and coupled to the ultrasonic transducer part, for transferring heat generated in the ultrasonic transducer part to the operation part.

Abstract: In a method for stabilizing an optical output of a semiconductor laser: the semiconductor laser is heated with a heater when the semiconductor laser is not in operation; and the heating of the semiconductor laser is stopped, or the amount of heat supplied to the semiconductor laser is lowered, almost simultaneously with startup of the semiconductor laser.

Abstract: A method for assembling a laser apparatus which condenses a laser beam and couples the laser beam to an optical fiber. After the optical fiber is fixed to a package, the whole or a part of an optical condensing system is fixed to the package through a fixing structure having at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to the core axis of the optical fiber, by moving the whole or the part of the optical condensing system along the at least one guide surface to a predetermined position with respect to the core axis, and fixing the whole or the part of the optical condensing system to the fixing structure at the predetermined position.

Abstract: In a laser apparatus: an adhesion surface and a first reference surface making a first predetermined angle with the adhesion surface are formed on an attachment part, and a mounting surface and a second reference surface making a second predetermined angle with the mounting surface are formed on a fixing member which is directly or indirectly fixed to a main body and arranged to adhesively hold the attachment part. In a method for assembling the laser apparatus: a first angle between the second reference surface and a reference direction is measured; the orientation of the attachment part is adjusted while measuring a second angle between the first reference surface and the reference direction; and the attachment part is adhesively fixed to the fixing member when the second angle is equal to an angle predetermined based on the first angle and the first and second predetermined angles.

Abstract: In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 ?g/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 ?g/g or less at 150° C.

Abstract: A laser unit containing a laser package, in which a laser element has been hermetically sealed, is connected with a converging optical system unit containing a converging optical system. The laser unit is provided with a laser package holder, which comprises a holder main body for supporting the laser package and a connecting member. The converging optical system unit is provided with a converging optical system holder, which comprises a holder main body for supporting the converging optical system and a connecting member having been welded to the connecting member of the laser package holder. A thermal conductivity of the holder main body of the laser package holder is set to be larger than the thermal conductivities of the connecting member of the laser package holder and the connecting member of the converging optical system holder.

Abstract: In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm and whose life is 5500 hours or more, optical components whose organic volatile gas generation measured by GC/MS is 10 ?g/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 300 ?g/g or less at 15° C.

Abstract: A laser module includes: one or more semiconductor laser elements which emit one or more divergent laser beams; one or more collimator lenses which collimate the one or more divergent laser beams; a condensing lens which condenses the one or more collimated laser beams, and make the one or more collimated laser beams converge at a convergence position; an optical fiber which is arranged in such a manner that the convergence position is located on the light-entrance end face; and a package which contains the one or more semiconductor laser elements and the one or more collimator lenses, does not contain the condensing lens and the light-entrance end face, and is hermetically sealed.

Abstract: In a laser module in which laser beams emitted from semiconductor laser elements are collimated by collimator lenses, and condensed by an optical condensing system so that the laser beams converge at a light-entrance end face of an optical fiber. The semiconductor laser elements and the collimator lenses are contained in a hermetically sealed, first package which includes a front wall having a window arranged for passage of the laser beams, and a portion of the optical condensing system and the light-entrance end face are contained in a hermetically sealed, second package which is fixed to the front wall. The cross section of the second package perpendicular to the optical axis of the optical fiber at the light-entrance end face is smaller than the cross section of the first package parallel to the cross section of the second package.

Abstract: An optical wiring substrate fabrication method capable of simple formation, by maskless exposure, of an inclined face shape at an end portion of a core layer structuring an optical waveguide. Using an exposure apparatus, image exposure is carried out with a light beam which is modulated by a spatial modulation element in accordance with image information. A predetermined area of a photosensitive material (a photoresist), which is coated on the core layer which is a material of the optical wiring substrate, is exposed by a light beam (UV) and patterned to form an etching mask. A region corresponding to the inclined face, which is to be formed at the end portion of the core layer, is exposed and patterned by the light beam, exposure amounts of which are controlled in accordance with the inclined form of the inclined face, such that an end portion of the etching mask has an inclined face structure.