Patents by Inventor Kazuhiko Ooga

Kazuhiko Ooga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220127498
    Abstract: Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.
    Type: Application
    Filed: March 16, 2020
    Publication date: April 28, 2022
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko OOGA, Takeshi KAWAMOTO, Kai SUZUKI, Ryunosuke YAMAMOTO
  • Patent number: 11044807
    Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: June 22, 2021
    Assignee: NIPPON POLYTECH CORP.
    Inventors: Kazuhiko Ooga, Naoki Murata, Kai Suzuki
  • Patent number: 10889729
    Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: January 12, 2021
    Assignee: NIPPON POLYTECH CORP.
    Inventors: Kazuhiko Ooga, Naoki Murata, Kai Suzuki
  • Publication number: 20180368253
    Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).
    Type: Application
    Filed: December 13, 2016
    Publication date: December 20, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko OOGA, Naoki MURATA, Kai SUZUKI
  • Publication number: 20180355195
    Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.
    Type: Application
    Filed: November 17, 2016
    Publication date: December 13, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko OOGA, Naoki MURATA, Kai SUZUKI
  • Publication number: 20150079379
    Abstract: Provided are: a polymerizable composition; a polymer obtained by polymerizing the composition (including an optical adhesive sheet); an image display device using the polymer; and a method for manufacturing the image display device. The polymerizable composition includes: (1) at least one chosen from the group consisting of a compound including a (meth)acrylol group with a polyolefin structural unit, a compound including a (meth)acrylol group with a hydrogenated polyolefin structural unit, a compound including a (meth)acrylol group with a (poly)ester structural unit, and a compound including a (meth)acrylol group with a (poly)carbonate structural unit; (2) a liquid compound including a (meth)acrylol group other than constituent (1); (3) at least one chosen from the group consisting of liquid hydrogenated polybutadiene polyol, liquid hydrogenated polyisoprene polyol, and hydrogenated dimer diol; and (4) a photopolymerization initiator.
    Type: Application
    Filed: June 14, 2013
    Publication date: March 19, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Kai Suzuki, Hiroto Kouka, Kazuhiko Ooga
  • Publication number: 20150050432
    Abstract: A polymerizable composition is disclosed wherein the polymerizable composition includes a first component selected from the group composed of compounds produced by an ester exchange reaction between a hydrogenated polyolefin polyol and an acrylic acid ester, compounds produced by an ester exchange reaction between a hydrogenated polyolefin polyol and a methacrylic acid ester, compounds produced by a dehydration condensation reaction between a hydrogenated polyolefin polyol and an acrylic acid, and compounds produced by a dehydration condensation reaction between a hydrogenated polyolefin polyol and a methacrylic acid, a second component selected from the group composed of compounds containing a hydrocarbon group with a carbon number more than or equal to 6 and an acryloyl group and compounds containing a hydrocarbon group with a carbon number more than or equal to 6 and a methacryloyl group, and a third component selected from the group composed of photopolymerization initiators.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 19, 2015
    Inventors: Kazuhiko Ooga, Hiroto Kouka, Kai Suzuki, Kenichi Nakanishi
  • Publication number: 20150030836
    Abstract: In relation to a polymerizable composition for forming a transparent optical resin layer to be interposed between an image display section of an image display device and a light-transmissive protective section thereof, the present invention provides a polymerizable composition that does not give rise to display defects caused by the deformation of the image display section, enables high-luminance, high-contrast image displaying, has excellent heat resistance, and also has a low dielectric constant. This polymerizable composition comprises: (1) a urethane (meth)acrylate obtained by reacting a hydrogenated polyolefin polyol and a compound having an isocyanato group and a (meth)acryloyl group; (2) a (meth)acryloyl-group-containing compound having a hydrocarbon group with a carbon number of 6 or greater; and (3) a photopolymerization initiator.
    Type: Application
    Filed: February 28, 2013
    Publication date: January 29, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko Ooga, Hiroto Kouka, Kenichi Nakanishi, Daigo Ito, Kazuhiro Sasaki, Yuta Takeuchi
  • Publication number: 20150005406
    Abstract: Provided is a photocurable moisture-proof insulating coating material which places little burden on the environment and has excellent surface curability with low irradiation. In addition, this photocurable moisture-proof insulating coating material is hydrophobic and exhibits high adhesion to a substrate material. Also provided is a novel urethane (meth)acrylate which is used for this moisture-proof insulating coating material. A urethane (meth)acrylate of the present invention is obtained by reacting (a) a polyester polyol that has a structural unit derived from a hydrogenated dimer acid and a structural unit derived from a hydrogenated dimer diol, (b) a polyisocyanate compound and (c) a hydroxyl group-containing (meth)acrylate. A moisture-proof insulating coating material of the present invention contains this urethane (meth)acrylate and a (meth)acryloyl group-containing compound that does not contain a silicon atom.
    Type: Application
    Filed: February 1, 2013
    Publication date: January 1, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko Ooga, Hiroto Kouka, Kai Suzuki
  • Publication number: 20140309326
    Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko OOGA, Ritsuko AZUMA
  • Publication number: 20140287167
    Abstract: Provided is a polymerizable composition for providing a thin image-display device that does not exhibit display problems due to deformation of an image-display unit, allows high-brightness, high-contrast image display, and tolerates heat well. A polymerizable composition for forming a polymer layer interposed between an image-display unit in an image-display device and a light-transmitting protective part. Said polymerizable composition is characterized by containing the following: (1) a (meth)acryloyl group-containing compound that has a structural unit derived from a (poly)ester polyol and/or a structural unit derived from a (poly)carbonate polyol; (2) a (meth)acryloyl group-containing compound that has a C9+ hydrocarbon group; and (3) a photopolymerization initiator.
    Type: Application
    Filed: December 26, 2012
    Publication date: September 25, 2014
    Applicant: Showa Denko K.K.
    Inventor: Kazuhiko Ooga
  • Patent number: 8674017
    Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: March 18, 2014
    Assignee: Showa Denko K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino
  • Patent number: 8669306
    Abstract: It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): ?-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: March 11, 2014
    Assignee: Showa Denko K.K.
    Inventors: Kazuhiko Ooga, Kazuya Kimura, Atsushi Umino, Ritsuko Azuma
  • Publication number: 20130331531
    Abstract: According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.
    Type: Application
    Filed: August 12, 2013
    Publication date: December 12, 2013
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroshi UCHIDA, Kazuhiko OOGA, Toshio FUJITA, Masanao HARA
  • Patent number: 8541508
    Abstract: According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: September 24, 2013
    Assignee: Showa Denko K.K.
    Inventors: Hiroshi Uchida, Kazuhiko Ooga, Toshio Fujita, Masanao Hara
  • Publication number: 20130178578
    Abstract: Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.
    Type: Application
    Filed: October 17, 2011
    Publication date: July 11, 2013
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma
  • Publication number: 20120305295
    Abstract: It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.
    Type: Application
    Filed: February 3, 2010
    Publication date: December 6, 2012
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuya Kimura, Kazuhiko Ooga, Kiichiro Miura
  • Publication number: 20120232183
    Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.
    Type: Application
    Filed: December 6, 2010
    Publication date: September 13, 2012
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma
  • Publication number: 20110272183
    Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.
    Type: Application
    Filed: January 20, 2010
    Publication date: November 10, 2011
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino
  • Publication number: 20110272182
    Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a) that includes an organic residue derived from a dimer diol, a polyisocyanate (b) and a carboxyl group-containing polyol (c).
    Type: Application
    Filed: January 20, 2010
    Publication date: November 10, 2011
    Applicant: Showa Denko K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino