Patents by Inventor Kazuhiko Ooga
Kazuhiko Ooga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220127498Abstract: Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.Type: ApplicationFiled: March 16, 2020Publication date: April 28, 2022Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko OOGA, Takeshi KAWAMOTO, Kai SUZUKI, Ryunosuke YAMAMOTO
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Patent number: 11044807Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).Type: GrantFiled: December 13, 2016Date of Patent: June 22, 2021Assignee: NIPPON POLYTECH CORP.Inventors: Kazuhiko Ooga, Naoki Murata, Kai Suzuki
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Patent number: 10889729Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.Type: GrantFiled: November 17, 2016Date of Patent: January 12, 2021Assignee: NIPPON POLYTECH CORP.Inventors: Kazuhiko Ooga, Naoki Murata, Kai Suzuki
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Publication number: 20180368253Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).Type: ApplicationFiled: December 13, 2016Publication date: December 20, 2018Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko OOGA, Naoki MURATA, Kai SUZUKI
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Publication number: 20180355195Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.Type: ApplicationFiled: November 17, 2016Publication date: December 13, 2018Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko OOGA, Naoki MURATA, Kai SUZUKI
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Publication number: 20150079379Abstract: Provided are: a polymerizable composition; a polymer obtained by polymerizing the composition (including an optical adhesive sheet); an image display device using the polymer; and a method for manufacturing the image display device. The polymerizable composition includes: (1) at least one chosen from the group consisting of a compound including a (meth)acrylol group with a polyolefin structural unit, a compound including a (meth)acrylol group with a hydrogenated polyolefin structural unit, a compound including a (meth)acrylol group with a (poly)ester structural unit, and a compound including a (meth)acrylol group with a (poly)carbonate structural unit; (2) a liquid compound including a (meth)acrylol group other than constituent (1); (3) at least one chosen from the group consisting of liquid hydrogenated polybutadiene polyol, liquid hydrogenated polyisoprene polyol, and hydrogenated dimer diol; and (4) a photopolymerization initiator.Type: ApplicationFiled: June 14, 2013Publication date: March 19, 2015Applicant: SHOWA DENKO K.K.Inventors: Kai Suzuki, Hiroto Kouka, Kazuhiko Ooga
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Publication number: 20150050432Abstract: A polymerizable composition is disclosed wherein the polymerizable composition includes a first component selected from the group composed of compounds produced by an ester exchange reaction between a hydrogenated polyolefin polyol and an acrylic acid ester, compounds produced by an ester exchange reaction between a hydrogenated polyolefin polyol and a methacrylic acid ester, compounds produced by a dehydration condensation reaction between a hydrogenated polyolefin polyol and an acrylic acid, and compounds produced by a dehydration condensation reaction between a hydrogenated polyolefin polyol and a methacrylic acid, a second component selected from the group composed of compounds containing a hydrocarbon group with a carbon number more than or equal to 6 and an acryloyl group and compounds containing a hydrocarbon group with a carbon number more than or equal to 6 and a methacryloyl group, and a third component selected from the group composed of photopolymerization initiators.Type: ApplicationFiled: February 26, 2013Publication date: February 19, 2015Inventors: Kazuhiko Ooga, Hiroto Kouka, Kai Suzuki, Kenichi Nakanishi
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Publication number: 20150030836Abstract: In relation to a polymerizable composition for forming a transparent optical resin layer to be interposed between an image display section of an image display device and a light-transmissive protective section thereof, the present invention provides a polymerizable composition that does not give rise to display defects caused by the deformation of the image display section, enables high-luminance, high-contrast image displaying, has excellent heat resistance, and also has a low dielectric constant. This polymerizable composition comprises: (1) a urethane (meth)acrylate obtained by reacting a hydrogenated polyolefin polyol and a compound having an isocyanato group and a (meth)acryloyl group; (2) a (meth)acryloyl-group-containing compound having a hydrocarbon group with a carbon number of 6 or greater; and (3) a photopolymerization initiator.Type: ApplicationFiled: February 28, 2013Publication date: January 29, 2015Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko Ooga, Hiroto Kouka, Kenichi Nakanishi, Daigo Ito, Kazuhiro Sasaki, Yuta Takeuchi
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Publication number: 20150005406Abstract: Provided is a photocurable moisture-proof insulating coating material which places little burden on the environment and has excellent surface curability with low irradiation. In addition, this photocurable moisture-proof insulating coating material is hydrophobic and exhibits high adhesion to a substrate material. Also provided is a novel urethane (meth)acrylate which is used for this moisture-proof insulating coating material. A urethane (meth)acrylate of the present invention is obtained by reacting (a) a polyester polyol that has a structural unit derived from a hydrogenated dimer acid and a structural unit derived from a hydrogenated dimer diol, (b) a polyisocyanate compound and (c) a hydroxyl group-containing (meth)acrylate. A moisture-proof insulating coating material of the present invention contains this urethane (meth)acrylate and a (meth)acryloyl group-containing compound that does not contain a silicon atom.Type: ApplicationFiled: February 1, 2013Publication date: January 1, 2015Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko Ooga, Hiroto Kouka, Kai Suzuki
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Publication number: 20140309326Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.Type: ApplicationFiled: June 27, 2014Publication date: October 16, 2014Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko OOGA, Ritsuko AZUMA
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Publication number: 20140287167Abstract: Provided is a polymerizable composition for providing a thin image-display device that does not exhibit display problems due to deformation of an image-display unit, allows high-brightness, high-contrast image display, and tolerates heat well. A polymerizable composition for forming a polymer layer interposed between an image-display unit in an image-display device and a light-transmitting protective part. Said polymerizable composition is characterized by containing the following: (1) a (meth)acryloyl group-containing compound that has a structural unit derived from a (poly)ester polyol and/or a structural unit derived from a (poly)carbonate polyol; (2) a (meth)acryloyl group-containing compound that has a C9+ hydrocarbon group; and (3) a photopolymerization initiator.Type: ApplicationFiled: December 26, 2012Publication date: September 25, 2014Applicant: Showa Denko K.K.Inventor: Kazuhiko Ooga
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Patent number: 8674017Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.Type: GrantFiled: January 20, 2010Date of Patent: March 18, 2014Assignee: Showa Denko K.K.Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino
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Patent number: 8669306Abstract: It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): ?-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.Type: GrantFiled: December 18, 2009Date of Patent: March 11, 2014Assignee: Showa Denko K.K.Inventors: Kazuhiko Ooga, Kazuya Kimura, Atsushi Umino, Ritsuko Azuma
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Publication number: 20130331531Abstract: According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.Type: ApplicationFiled: August 12, 2013Publication date: December 12, 2013Applicant: SHOWA DENKO K.K.Inventors: Hiroshi UCHIDA, Kazuhiko OOGA, Toshio FUJITA, Masanao HARA
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Patent number: 8541508Abstract: According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.Type: GrantFiled: August 7, 2009Date of Patent: September 24, 2013Assignee: Showa Denko K.K.Inventors: Hiroshi Uchida, Kazuhiko Ooga, Toshio Fujita, Masanao Hara
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Publication number: 20130178578Abstract: Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.Type: ApplicationFiled: October 17, 2011Publication date: July 11, 2013Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko Ooga, Ritsuko Azuma
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Publication number: 20120305295Abstract: It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.Type: ApplicationFiled: February 3, 2010Publication date: December 6, 2012Applicant: SHOWA DENKO K.K.Inventors: Kazuya Kimura, Kazuhiko Ooga, Kiichiro Miura
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Publication number: 20120232183Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof.Type: ApplicationFiled: December 6, 2010Publication date: September 13, 2012Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko Ooga, Ritsuko Azuma
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Publication number: 20110272183Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.Type: ApplicationFiled: January 20, 2010Publication date: November 10, 2011Applicant: SHOWA DENKO K.K.Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino
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Publication number: 20110272182Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a) that includes an organic residue derived from a dimer diol, a polyisocyanate (b) and a carboxyl group-containing polyol (c).Type: ApplicationFiled: January 20, 2010Publication date: November 10, 2011Applicant: Showa Denko K.K.Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino