Patents by Inventor Kazuhiko Ota

Kazuhiko Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8768817
    Abstract: With respect to one order information piece in security transaction, processing of reception, transaction condition confirmation, transaction settlement and result transmission is executed serially. A transaction system is configured so as to divide a transaction including a plurality of transaction requests into predetermined units and execute resultant processing units in parallel. When such division is conducted, the sequential property is ensured. For example, the progress situation of processing is stored in a database every processing and every step. Issues, terminals, markets and servers are included as predetermined units.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: July 1, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Shuuzou Takeo, Shintaro Yamabe, Tadashi Kanazawa, Hideyuki Kato, Yasuo Aihara, Kiyoshi Yamada, Shigeru Tachikawa, Kazuhiko Ota
  • Publication number: 20070192208
    Abstract: With respect to one order information piece in security transaction, processing of reception, transaction condition confirmation, transaction settlement and result transmission is executed serially. A transaction system is configured so as to divide a transaction including a plurality of transaction requests into predetermined units and execute resultant processing units in parallel. When such division is conducted, the sequential property is ensured. For example, the progress situation of processing is stored in a database every processing and every step. Issues, terminals, markets and servers are included as predetermined units.
    Type: Application
    Filed: January 24, 2007
    Publication date: August 16, 2007
    Inventors: Shuuzou Takeo, Shintaro Yamabe, Tadashi Kanazawa, Hideyuki Kato, Yasuo Aihara, Kiyoshi Yamada, Shigeru Tachikawa, Kazuhiko Ota
  • Patent number: 6655990
    Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: December 2, 2003
    Assignee: Fujitsu Limited
    Inventors: Hideaki Terauchi, Fumio Aoki, Kazuhiko Ota, Yasuhiro Teshima
  • Publication number: 20020076979
    Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.
    Type: Application
    Filed: April 24, 2000
    Publication date: June 20, 2002
    Inventors: Hideaki Terauchi, Fumio Aoki, Kazuhiko Ota, Yasuhiro Teshima
  • Publication number: 20020013159
    Abstract: In a portable telephone, a main body case and a cover case are connected rotatably by a hinge portion. Further, the main body case is made of a resin material, metal, or a material including metal, and the cover case is made of a metal material. Further, when the portable telephone is used, the cover case is positioned on a side surface of an antenna. Therefore, the current becomes easy to flow, and the current flowing in the main body decreases. Accordingly, the disturbance of the current distribution in case that the main body case is held by the user's hand decreases, so that it is possible to reduce the deterioration of antenna gain.
    Type: Application
    Filed: July 12, 2001
    Publication date: January 31, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsukasa Takahashi, Masayoshi Hirai, Kenichi Yamada, Kazuhiko Ota, Yoshio Koyanagi
  • Patent number: 6081998
    Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C.sub.1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is reroved from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.
    Type: Grant
    Filed: April 9, 1998
    Date of Patent: July 4, 2000
    Assignee: Fujitsu Limited
    Inventors: Hideaki Terauchi, Fumio Aoki, Kazuhiko Ota, Yasuhiro Teshima
  • Patent number: 5163501
    Abstract: Split dies include an upper die and a lower die for casting small segments constituting tread pattern forming portions of a tire mold. The lower mold includes a telescopic die having an upper surface forming a die bottom wall having a configuration corresponding to the tread pattern forming portions of the small segments. The lower mold further includes a main die having a cavity for receiving the telescopic die and having side walls surrounding the cavity to form die inner walls whose configuration corresponds to side walls of the small segments.
    Type: Grant
    Filed: September 18, 1991
    Date of Patent: November 17, 1992
    Assignee: Bridgestone Corporation
    Inventors: Hideaki Tanaka, Kazuhiko Ota, Shirou Katsumata, Sachiko Kamata