Patents by Inventor Kazuhiko Shimodaira
Kazuhiko Shimodaira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10749533Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.Type: GrantFiled: June 6, 2019Date of Patent: August 18, 2020Assignee: SEIKO EPSON CORPORATIONInventors: Manabu Kondo, Kazuhiko Shimodaira, Kenji Hayashi
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Publication number: 20190379325Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.Type: ApplicationFiled: June 6, 2019Publication date: December 12, 2019Applicant: SEIKO EPSON CORPORATIONInventors: Manabu KONDO, Kazuhiko SHIMODAIRA, Kenji HAYASHI
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Patent number: 10027308Abstract: A vibration device which is possible to secure the fixing of a vibrating element and to reduce deterioration in characteristics of the vibrating element includes a substrate, a plurality of elastic members each of which includes a connection portion connected to a first surface of the substrate, and a support portion extending from the connection portion to a position separated from the connection portion, and a vibrating element that is supported at the support portion, in which the vibrating element is supported by the plurality of elastic members via three or more support portions.Type: GrantFiled: July 30, 2015Date of Patent: July 17, 2018Assignee: SEIKO EPSON CORPORATIONInventor: Kazuhiko Shimodaira
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Patent number: 9800224Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: GrantFiled: February 2, 2016Date of Patent: October 24, 2017Assignee: SEIKO EPSON CORPORATIONInventors: Kazuhiko Shimodaira, Kyo Horie
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Patent number: 9543497Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.Type: GrantFiled: January 28, 2013Date of Patent: January 10, 2017Assignee: SEIKO EPSON CORPORATIONInventor: Kazuhiko Shimodaira
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Publication number: 20160156330Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: ApplicationFiled: February 2, 2016Publication date: June 2, 2016Applicant: SEIKO EPSON CORPORATIONInventors: Kazuhiko SHIMODAIRA, Kyo HORIE
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Patent number: 9287881Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: GrantFiled: June 12, 2014Date of Patent: March 15, 2016Assignee: SEIKO EPSON CORPORATIONInventors: Kazuhiko Shimodaira, Kyo Horie
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Publication number: 20160036411Abstract: A vibration device which is possible to secure the fixing of a vibrating element and to reduce deterioration in characteristics of the vibrating element includes a substrate, a plurality of elastic members each of which includes a connection portion connected to a first surface of the substrate, and a support portion extending from the connection portion to a position separated from the connection portion, and a vibrating element that is supported at the support portion, in which the vibrating element is supported by the plurality of elastic members via three or more support portions.Type: ApplicationFiled: July 30, 2015Publication date: February 4, 2016Inventor: Kazuhiko SHIMODAIRA
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Publication number: 20140368283Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: ApplicationFiled: June 12, 2014Publication date: December 18, 2014Inventors: Kazuhiko SHIMODAIRA, Kyo HORIE
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Patent number: 8804316Abstract: A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.Type: GrantFiled: July 2, 2012Date of Patent: August 12, 2014Assignee: Seiko Epson CorporationInventors: Manabu Shiraki, Tadanori Yamada, Kazumi Hara, Kazuhiko Shimodaira
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Patent number: 8760231Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.Type: GrantFiled: March 16, 2009Date of Patent: June 24, 2014Assignee: Seiko Epson CorporationInventor: Kazuhiko Shimodaira
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Publication number: 20130010412Abstract: A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.Type: ApplicationFiled: July 2, 2012Publication date: January 10, 2013Applicant: SEIKO EPSON CORPORATIONInventors: Manabu SHIRAKI, Tadanori YAMADA, Kazumi HARA, Kazuhiko SHIMODAIRA
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Patent number: 8080921Abstract: A piezoelectric device includes: a base substrate; an electronic component provided on a first surface of the base substrate; and a piezoelectric resonator that is provided on the first surface of the base substrate without planarly overlapping with the electronic component and have a package base, a mounting surface of the package base having one of a recessed part and a cutout part. In the device, the base substrate includes a resonator-disposing section disposed in a region of the one of the recessed part and the cutout part of the piezoelectric resonator and the resonator-disposing section is a part of the base substrate in plan view and is coupled to a bottom surface of the one of the recessed part and the cutout part.Type: GrantFiled: March 5, 2009Date of Patent: December 20, 2011Assignee: Epson Toyocom CorporationInventor: Kazuhiko Shimodaira
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Patent number: 7969072Abstract: An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.Type: GrantFiled: September 28, 2009Date of Patent: June 28, 2011Assignee: Epson Toyocom CorporationInventors: Juichiro Matsuzawa, Kazuhiko Shimodaira
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Publication number: 20100079035Abstract: An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.Type: ApplicationFiled: September 28, 2009Publication date: April 1, 2010Applicant: EPSON TOYOCOM CORPORATIONInventors: Juichiro MATSUZAWA, Kazuhiko SHIMODAIRA
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Publication number: 20090230486Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.Type: ApplicationFiled: March 16, 2009Publication date: September 17, 2009Applicant: EPSON TOYOCOM CORPORATIONInventor: Kazuhiko SHIMODAIRA
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Publication number: 20090224635Abstract: A piezoelectric device includes: a base substrate; an electronic component provided on a first surface of the base substrate; and a piezoelectric resonator that is provided on the first surface of the base substrate without planarly overlapping with the electronic component and have a package base, a mounting surface of the package base having one of a recessed part and a cutout part. In the device, the base substrate includes a resonator-disposing section disposed in a region of the one of the recessed part and the cutout part of the piezoelectric resonator and the resonator-disposing section is a part of the base substrate in plan view and is coupled to a bottom surface of the one of the recessed part and the cutout part.Type: ApplicationFiled: March 5, 2009Publication date: September 10, 2009Applicant: EPSON TOYOCOM CORPORATIONInventor: Kazuhiko SHIMODAIRA
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Patent number: 7576476Abstract: A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof; an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.Type: GrantFiled: March 23, 2007Date of Patent: August 18, 2009Assignee: Epson Toyocom CorporationInventors: Yugo Koyama, Kazuhiko Shimodaira
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Patent number: 7429814Abstract: The invention provides a piezoelectric resonator device having excellent frequency accuracy and aging characteristics. The piezoelectric resonator element can be packaged in an exclusive hollow space formed in the package in advance to packaging an IC chip. After mounting a lid on the opening of the hollow space while the hollow space is in communication with an external atmosphere, the external conduit is shut in vacuum and the hollow space for packaging the resonator element is tightly sealed, and an IC chip is packaged after an optimality discrimination treatment of the piezoelectric resonator element. The piezoelectric resonator element is formed into a tuning fork type resonator element, and the lid is made of a glass. The conduit to the external atmosphere is shielded by embedding with a gold base material to capture the materials scattered by frequency adjustment of the piezoelectric resonator element.Type: GrantFiled: October 24, 2002Date of Patent: September 30, 2008Assignee: Seiko Epson CorporationInventor: Kazuhiko Shimodaira
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Patent number: 7408291Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.Type: GrantFiled: June 21, 2006Date of Patent: August 5, 2008Assignee: Seiko Epson CorporationInventors: Yugo Koyama, Katsuhiko Miyazaki, Kazuhiko Shimodaira, Yukari Nakajima