Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Abstract: A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40° C. or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80° C. of from 1×102 to 1×105 Pa·s and has a plasticity at 25° C. in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.

Abstract: A wafer chuck used in manufacturing processes of integrated semiconductors and liquid crystal panels, more particularly, an electrostatic silicone rubber chuck for ion injectors used in an ion injection process.

Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Abstract: A dustproof covering film-attached wafer support comprising a base, a silicone rubber layer substantially uniform in thickness and integrated with the base and a dustproof covering film, with the dustproof covering film is attached to the silicone rubber layer in a state that the peel strength between the dustproof covering film and the silicone rubber layer is from 5 to 500 g/25 mm, thereby enabling the covering film to be peeled apart as the need arises; and a production method for such a wafer support.

Abstract: Wafer holders disposed in the target chamber of an ion implantation apparatus, with each of the wafer holders comprising a wafer mount and an electrically conductive elastic body that is laid on the wafer mount and has a surface for holding a wafer thereon.

Abstract: A method of insulating a cathode ray tube and an electrical insulator composition for a cathode ray tube enabling an electrical insulator to be produced without material loss and enabling improvement of the bonding strength between a stem and a stem base and the insulation property between stem pins, when attaching to a stem, which is provided at the cathode ray tube and has a tip and stem pins projecting therefrom, an insulating stem base, which comprises a base through which pin through holes are formed and has provided projecting from the front surface thereof a tip holder, in a state with the stem pins inserted through the pin through holes and the tip held in the tip holder, said method comprising the steps of molding an electrical insulator composition comprising an uncured self-adhesive silicone rubber into a predetermined sheet shape by using a transfer mold to obtain an electrical insulator, arranging the electrical insulator in a state extending from the positions of the pin through holes on the bac

Abstract: A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40° C. or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80° C. of from 1×102 to 1×105 Pa.s and has a plasticity at 25° C. in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.

Abstract: An electrostatic silicone rubber chuck for ion injectors, which comprises a metallic substrate, a first insulating layer, a pattern of conductive trace or traces formed as an electrode of single or dual polarity and a second insulating layer: with at least the second insulating layer being produced from cured matter of a thermally conductive silicone rubber composition comprising the following components (A) to (D);

Abstract: A method of insulating a cathode ray tube and enabling an electrical insulator to be produced without material loss and enabling improvement of the bonding strength between a stem and a stem base, which comprises a base through which pin through holes are formed and has provided projecting from the front surface thereof a tip holder, in a state with the stem pins inserted through the pin through holes and the tip held in the tip holder, said method comprising the steps of molding an electrical insulator composition comprising an uncured self-adhesive silicone rubber into a predetermined sheet shape by using a transfer mold to obtain an electrical insulator, arranging the electrical insulator in a state extending from the positions of the pin through holes on the back of the base of the stem base to the tip holder and adhering it to the back of the base, folding the portion of the electrical insulator extending to the tip holder to the inside surface of the tip holder, and attaching the stem base to the stem.

Abstract: An electrostatic chuck comprises a metallic plate, a first insulating layer formed on the metallic plate and composed of a ceramic material, an electrically conductive electrode pattern formed on the first insulating layer, and a second insulating layer formed on the conductive electrode pattern and made of an elastomer. Alternatively, the first and second insulating layers may be each made of a thermally conductive silicone rubber provided that the thermally conductive silicone rubber for the second insulating layer should have a hardness of 85 or below a surface roughness of 5 .mu.m or below.

Abstract: A casing of a fixed disc memory unit consisting of a case body and a covering member jointly forming the casing with an air-tight sealing of a rubbery gasket therebetween can be imparted with very reliable moisture-proofness of sealing by forming the rubbery gasket by the FIPG method using a curable rubber composition comprising: (a) a fluorocarbon-containing organosiloxane polymer containing vinyl groups and consisting of the recurring units each represented by the general formula--[--SiMe.sub.2 --CH.sub.2 CH.sub.2 --Rf--CH.sub.2 CH.sub.2 --SiMe.sub.2 --O--]--,in which Rf is a fluorinated divalent polyether group; (b) an organohydrogenpolysiloxane or a fluorocarbon-containing organohydrogensiloxane having, in a molecule, at least two hydrogen atoms directly bonded to the silicon atoms; and (c) a catalytic compound in an amount sufficient to effect the addition reaction between the components (a) and (b).

Abstract: A cover-gasket assembly for a hard disk device which comprises a gasket applied to a predetermined position of a cover for the hard disk device, wherein the gasket is formed essentially of a cured product of a fluorosilicone rubber composition. The assembly is particularly excellent in sealing property against permeation of water vapor, and can be used extremely effectively for hard disk devices for handy office-automation apparatuses such as laptop or pocket-size personal computers, word processors and the like which are expected to be used under various temperature and humidity conditions.

Abstract: A primer composition comprising (A) a fluorinated alkoxysilane containing an epoxy group, (B) an organic titanium or aluminum compound, and (C) a solvent is effective in bonding fluorinated organic polymers to metal and glass members.

Abstract: An impasto pattern representing a desired character or mark is formed on a stretchable support, typically sportswear fabric by extruding a high viscosity liquid silicone rubber composition to the support through a nozzle of a robotic applicator having a picture drawing function to form a predetermined pattern of impasto extrudate on the support, and curing the extrudate.