Patents by Inventor Kazuhiko Tsuchiya

Kazuhiko Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210288410
    Abstract: A folded antenna includes: a substrate including a dielectric base material and a ground disposed on a first surface of the dielectric base material; and an antenna element including a bent portion bent in a direction perpendicular to the substrate, and a folded portion further bent in a direction parallel to the substrate from the bent portion and capacitively coupled to the ground via the dielectric base material. An impedance of the folded antenna is adjusted by adjusting an area of the folded portion by changing a width dimension of the folded portion without changing a height dimension of the bent portion.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 16, 2021
    Applicant: Yazaki Corporation
    Inventor: Kazuhiko TSUCHIYA
  • Patent number: 9039458
    Abstract: A connector is provided, which can seek miniaturization by suppressing external form dimensions of an inner housing. The connector includes, as means for engaging and uniting housing division bodies 20 and 30 that constitute the inner housing 10, engagement pieces 22 equipped on one side of the housing division bodies and inserted between adjacent terminal accommodation portions 13 in the other side of the housing division bodies, and locking portions equipped between the terminal accommodation portions 13 in the other side of the housing division bodies and engaged with the inserted engagement pieces to make the housing division bodies 20 and 30 in a connection state.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: May 26, 2015
    Assignee: YAZAKI CORPORATION
    Inventor: Kazuhiko Tsuchiya
  • Patent number: 8979584
    Abstract: An object is to provide a board-mounted connector which has an assembly fitting opening provided on the attachment surface side of an external shield shell onto a circuit board such that a housing assembly can be fit from the assembly fitting opening into the external shield shell, and is capable of improving the ease of assembling the housing assembly. In a board-mounted connector 1A, a housing assembly 21A to be fit from an assembly fitting opening 34 provided at an external shield shell 11A into the external shield shell 11A is made by integrally forming an internal housing 23 that accommodates a plurality of connection terminal members 22 and an external housing 26 that covers the outer circumference of the internal housing 23 and accommodates and holds the internal shield shell 25.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: March 17, 2015
    Assignee: Yazaki Corporation
    Inventor: Kazuhiko Tsuchiya
  • Patent number: 8915755
    Abstract: An object is to provide a board-mounted connector which has an assembly fitting opening provided on the attachment surface side of an external shield shell onto a circuit board such that a housing assembly can be fit from the assembly fitting opening into the external shield shell, and is capable of improving the ease of assembling the housing assembly. In a board-mounted connector 1A, a housing assembly 21A to be fit from an assembly fitting opening 34 provided at an external shield shell 11A into the external shield shell 11A is made by integrally forming an internal housing 23 that accommodates a plurality of connection terminal members 22 and an external housing 26 that covers the outer circumference of the internal housing 23 and accommodates and holds the internal shield shell 25.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: December 23, 2014
    Assignee: Yazaki Corporation
    Inventor: Kazuhiko Tsuchiya
  • Publication number: 20140321060
    Abstract: An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite material having high heat conductivity; an ultrahigh pressure method is expensive; and electric current pressure sintering provides relatively high heat conductivity, a low cost, but insufficient heat resistance. A Cu-diamond based solid phase sintered body contains 2 vol % or more and 6 vol % or less of Cr, and 30 vol % or more and 80 vol % or less of diamond particles containing 20 vol % or more of a high crystallinity diamond component.
    Type: Application
    Filed: April 9, 2014
    Publication date: October 30, 2014
    Applicant: FUJI DIE CO., LTD.
    Inventors: Masayuki Ishii, Saki Suzuki, Kozo Kitamura, Kazuhiko Tsuchiya, Minoru Saito, Osamu Terada, Koji Hayashi
  • Patent number: 8475940
    Abstract: According to the invention, there is provided a compound represented by a formula (1) below: wherein X represents a residue derived from an aryl ring or a heteroaryl ring, or a single bond, Ar1 and Ar2 respectively represent a phenyl group or heteroaryl group, Ar3 represents a group having 60 or less carbon atoms, the group represents a structure in which six or less aryl or heteroaryl groups which may have one or more substituents are conjugatedly linked, or the same group as a substituent at the ninth or tenth position on the anthracene ring, and n represents an integer of 0 or 1.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 2, 2013
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Yuichi Ito, Kazuhiko Tsuchiya, Toshinobu Shinnai, Junpei Takahashi
  • Publication number: 20130149902
    Abstract: An object is to provide a board-mounted connector which has an assembly fitting opening provided on the attachment surface side of an external shield shell onto a circuit board such that a housing assembly can be fit from the assembly fitting opening into the external shield shell, and is capable of improving the ease of assembling the housing assembly. In a board-mounted connector 1A, a housing assembly 21A to be fit from an assembly fitting opening 34 provided at an external shield shell 11A into the external shield shell 11A is made by integrally forming an internal housing 23 that accommodates a plurality of connection terminal members 22 and an external housing 26 that covers the outer circumference of the internal housing 23 and accommodates and holds the internal shield shell 25.
    Type: Application
    Filed: August 31, 2011
    Publication date: June 13, 2013
    Applicant: YAZAKI CORPORATION
    Inventor: Kazuhiko Tsuchiya
  • Publication number: 20130109247
    Abstract: A connector is provided, which can seek miniaturization by suppressing external form dimensions of an inner housing. The connector includes, as means for engaging and uniting housing division bodies 20 and 30 that constitute the inner housing 10, engagement pieces 22 equipped on one side of the housing division bodies and inserted between adjacent terminal accommodation portions 13 in the other side of the housing division bodies, and locking portions equipped between the terminal accommodation portions 13 in the other side of the housing division bodies and engaged with the inserted engagement pieces to make the housing division bodies 20 and 30 in a connection state.
    Type: Application
    Filed: August 31, 2011
    Publication date: May 2, 2013
    Applicant: YAZAKI CORPORATION
    Inventor: Kazuhiko Tsuchiya
  • Patent number: 8360808
    Abstract: A circuit board mounted connector includes an exterior shield shell and a housing assembly. The exterior shield shell has a first face to be mounted on a circuit board to define an electromagnetic shielding space and a second face which is orthogonal to the first face and is opened for installation of a mating connector. The housing assembly is fitted in the exterior shield shell so that the mating connector is connected thereto. The housing assembly includes a connecting terminal member, an interior housing, an interior shield shell, and an exterior housing. The exterior shield shell includes an assembly mounting opening through which the housing assembly is installed into the exterior shield shell, in the first face of the exterior shield shell.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: January 29, 2013
    Assignee: Yazaki Corporation
    Inventor: Kazuhiko Tsuchiya
  • Publication number: 20120248973
    Abstract: According to the invention, there is provided a compound represented by a formula (1) below: wherein X represents a residue derived from an aryl ring or a heteroaryl ring, or a single bond, Ar1 and Ar2 respectively represent a phenyl group or heteroaryl group, Ar3 represents a group having 60 or less carbon atoms, the group represents a structure in which six or less aryl or heteroaryl groups which may have one or more substituents are conjugatedly linked, or the same group as a substituent at the ninth or tenth position on the anthracene ring, and n represents an integer of 0 or 1.
    Type: Application
    Filed: June 13, 2012
    Publication date: October 4, 2012
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Yuichi ITO, Kazuhiko Tsuchiya, Toshinobu Shinnai, Junpei Takahashi
  • Publication number: 20120003873
    Abstract: A circuit board mounted connector includes an exterior shield shell and a housing assembly. The exterior shield shell has a first face to be mounted on a circuit board to define an electromagnetic shielding space and a second face which is orthogonal to the first face and is opened for installation of a mating connector. The housing assembly is fitted in the exterior shield shell so that the mating connector is connected thereto. The housing assembly includes a connecting terminal member, an interior housing, an interior shield shell, and an exterior housing. The exterior shield shell includes an assembly mounting opening through which the housing assembly is installed into the exterior shield shell, in the first face of the exterior shield shell.
    Type: Application
    Filed: July 1, 2011
    Publication date: January 5, 2012
    Applicant: YAZAKI CORPORATION
    Inventor: Kazuhiko TSUCHIYA
  • Publication number: 20120000692
    Abstract: There is provided a shielded cable connecting structure comprising a shielding layer removed portion where a plurality of covered wires are exposed for connection of connecting terminals to a shield connector and a conductive heat-shrinkable tube which is fittingly mounted on an end portion of an electromagnetic shielding layer which lies adjacent to the shielding layer removed portion and the shielding layer removed portion so as to bind together the plurality of covered wires through heat shrinkage.
    Type: Application
    Filed: July 1, 2011
    Publication date: January 5, 2012
    Applicant: YAZAKI CORPORATION
    Inventor: Kazuhiko TSUCHIYA
  • Publication number: 20080188670
    Abstract: Provided are a novel compound that is mesogenic or liquid crystalline and has a high charge mobility, liquid crystal compositions comprising the compound, charge transport materials containing the same, and various elements using the charge transport materials. The novel compound is a 1,4-dithienylbenzene derivatives represented by the following general formula (I): wherein R1 and R2 each independently represent a hydrogen atom or a hydrocarbyl group having 1 to 20 carbon atoms, provided that R1 and R2 are not simultaneously a hydrogen atom; and A represents an optionally substituted benzene ring.
    Type: Application
    Filed: February 28, 2005
    Publication date: August 7, 2008
    Applicants: NAT. INST. OF ADVANCED INDUSTRIAL SCI. AND TECH., Kanto Kagaku Kabushiki Kaisha
    Inventors: Yo Shimizu, Hirosato Mononobe, Kazuma Oikawa, Kazuhiko Tsuchiya, Junpei Takahashi
  • Publication number: 20030046192
    Abstract: A distribution management system in which a host server and portable terminals are arranged in such a manner as to be able to exchange information with each other. The host server has a section for receiving information relating to distribution from each of the portable terminals, and a section for transmitting, to each of the portable terminals, predetermined information such as information indicating a distribution state or history of a distribution article. This makes it possible to transmit, in real time, predetermined information such as information indicating a distribution state or history of a distribution article from the host server to a transmission source portable terminal.
    Type: Application
    Filed: February 21, 2002
    Publication date: March 6, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Koji Eguchi, Toshiharu Inui, Kazuhiko Tsuchiya, Takayuki Fujii, Ryoji Shirouzu
  • Patent number: 6169617
    Abstract: An information card includes a card body having a plurality of surfaces and a plurality of optical communication interface sections provided respectively at different surfaces. A read/write device for the information card includes: a case having surfaces each processed into a prescribed shape; a main board which is provided in the case and has connectors provided respectively at positions corresponding to the surfaces; and a user interface board having a user interface section which can be joined to the main board via the connector and is fit to the prescribed shape when joined to the main board.
    Type: Grant
    Filed: February 3, 1998
    Date of Patent: January 2, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazuhiko Tsuchiya, Yuichi Kato
  • Patent number: 6007739
    Abstract: A liquid crystal compound of the present invention is represented by the following general Formula I: ##STR1## wherein R.sub.1 and R.sub.2 are independently a linear or branched alkyl group or alkoxy group having 1 to 14 carbon atoms, provided that at least one of R.sub.1 and R.sub.2 is an alkyl group; --Y-- is a group represented by the following Formula (II) or (III); and X.sub.1, X.sub.2, X.sub.3, and X.sub.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: December 28, 1999
    Assignees: Sharp Kabushiki Kaisha, Kanto Kagaku Kabushiki Kaisha
    Inventors: Akira Sakaigawa, Aya Miyazaki, Mitsuhiro Koden, Kazuhiko Tsuchiya, Kenji Suzuki
  • Patent number: 5397504
    Abstract: A new biphenyl compound which is chemically stable and possesses practically excellent properties as a component for preparing ferroelectric smetic liquid crystalline compositions as well as a new liquid crystalline composition containing this compound.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: March 14, 1995
    Assignee: Kanto Kagaku Kabushiki Kaisha
    Inventors: Kazuhiko Tsuchiya, Kenji Suzuki, Atsushi Sugiura, Tsunenori Fujii
  • Patent number: 5271867
    Abstract: A ferroelectric liquid crystal composition comprising a specific fluorophenyl compound (I) and a specific pyrimidine compound (II) and optionally a specific benzoate compound (III), which exhibits a high-speed response in room temperature and is useful for liquid crystal display devices of large capacity.
    Type: Grant
    Filed: January 27, 1992
    Date of Patent: December 21, 1993
    Assignees: Sharp Kabushiki Kaisha, Kanto Kagaku Kabushiki Kaisha Corporation
    Inventors: Mitsuhiro Koden, Tomoaki Kuratate, Makoto Shiomi, Fumiaki Funada, Hiromi Inoue, Kazuhiko Tsuchiya, Atsushi Sugiura, Tsunenori Fujii