Abstract: A light-emitting unit includes a light source and a lens body disposed in front of the light source, and the lens body includes a projection lens part configured to project a graphic pattern toward a road surface by light emission of the light source, and a light emission lens part configured to cause surrounding of the projection lens part emit light by light emitted from the light source.

Abstract: To make it possible to grasp the road surface condition more reliably when the road surface on which the irradiation pattern is formed is captured by a camera. A controller for lighting control installed in a vehicle that is equipped with a camera that captures the surroundings of the vehicle, a monitor that displays images captured by the camera, and an irradiation unit capable of irradiating light on a road surface within a range that can be captured by the camera, and in which the controller performs operation control of the irradiation unit, where the controller performs operation control of the irradiation unit so that it prevents the irradiation unit from performing light irradiation during each intermittently occurring capturing period of the camera, and causes the irradiation unit to irradiate light during a non-capturing period between the capturing periods.

Abstract: A light-emitting device module can include a plurality of light-emitting devices arranged in line so as to form a luminance distribution for preventing horizontal stripes from being generated in a light distribution pattern. The light-emitting device can include a rectangular light-transmitting substrate, an underlayer semiconductor layer formed on the rectangular light-transmitting substrate, a plurality of first electrodes formed on the underlayer semiconductor layer in an island shape, a light-emitting semiconductor layer including a light-emitting layer formed on the underlayer semiconductor layer, the light-emitting semiconductor layer configured to surround and separate the respective first electrodes, and a second electrode formed on the light-emitting semiconductor layer. The first electrodes can be arranged to form a plurality of electrode rows parallel with one side of the rectangular light-transmitting substrate.

Abstract: The present invention relates to a method for manufacturing a thin film of a rare earth complex polymer with low solubility in an organic solvent and to an organic EL device including a thin film of a rare earth complex polymer obtained using this method, the thin film used as a light-emitting layer. A method for manufacturing a rare earth complex polymer thin film includes a step (1) in which a micelle-containing solvent (A) that includes a rare-earth complex and a ferrocenyl surfactant and a micelle-containing solvent (B) that includes a polydentate ligand and a ferrocenyl surfactant are mixed to form a mixed micelle-containing solvent, and a step (2) in which electrolysis is performed using the mixed micelle-containing solvent as an electrolyte, and formed on a positive electrode surface is a thin film of a rare earth complex polymer that includes the rare earth complex and polydentate ligand.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Abstract: There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin 13? is dropped on either one or both of a light emitting element 11 and a tabular member 14 in such an amount that the resin is maintained on them by surface tension, the light emitting element 11 and the tabular member 14 are piled up with the uncured resin 13? maintained between them and on a side of the light emitting element by surface tension of the uncured resin 13? to form an uncured resin layer 13? having an inclined side 130, and then the resin layer 13 is cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.

Abstract: An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include a wavelength conversion material mixed therein, the transparent resin portion formed in such a manner as to surround the LED chip, wherein the LED chip is positioned offset toward one side in the transparent resin portion, and wherein the wavelength conversion material mixed in the transparent resin portion has a higher density around the LED chip within the transparent resin portion.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The device can include a board, a frame located on the board, at least one light-emitting chip mounted on the board, the wavelength converting layer located between an optical plate and an outside surface of the chips so that a density of a peripheral region is lower than that of a middle region, and a reflective material layer disposed at least between the frame and a side surface of the wavelength-converting layer. The device can have the reflective material layer form each reflector and can use a wavelength converting layer having different densities, and therefore can emit a wavelength-converted light having a high light-emitting efficiency and a uniform color tone from various small light-emitting surfaces.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Abstract: There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin 13? is dropped on either one or both of a light emitting element 11 and a tabular member 14 in such an amount that the resin is maintained on them by surface tension, the light emitting element 11 and the tabular member 14 are piled up with the uncured resin 13? maintained between them and on a side of the light emitting element by surface tension of the uncured resin 13? to form an uncured resin layer 13? having an inclined side 130, and then the resin layer 13 is cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.

Abstract: A light-emitting device module can include a plurality of light-emitting devices arranged in line so as to form a luminance distribution for preventing horizontal stripes from being generated in a light distribution pattern. The light-emitting device can include a rectangular light-transmitting substrate, an underlayer semiconductor layer formed on the rectangular light-transmitting substrate, a plurality of first electrodes formed on the underlayer semiconductor layer in an island shape, a light-emitting semiconductor layer including a light-emitting layer formed on the underlayer semiconductor layer, the light-emitting semiconductor layer configured to surround and separate the respective first electrodes, and a second electrode formed on the light-emitting semiconductor layer. The first electrodes can be arranged to form a plurality of electrode rows parallel with one side of the rectangular light-transmitting substrate.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The device can include a board, a frame located on the board, at least one light-emitting chip mounted on the board, the wavelength converting layer located between an optical plate and an outside surface of the chips so that a density of a peripheral region is lower than that of a middle region, and a reflective material layer disposed at least between the frame and a side surface of the wavelength-converting layer. The device can have the reflective material layer form each reflector and can use a wavelength converting layer having different densities, and therefore can emit a wavelength-converted light having a high light-emitting efficiency and a uniform color tone from various small light-emitting surfaces.

Abstract: The disclosed subject matter includes light sources that have high use efficiency and a favorable bright distribution, and includes vehicle lamps that have both a favorable light distribution pattern and a capability of being simply composed by using the LED light sources. The light source can include a base board, at least one die bonding pad and wire bonding pad on the base board, at least one LED chip mounted on the die bonding pad and connected to respective bonding pads, and an encapsulating resin over the LED chip. The at least one LED chip can emit a uniform light with a distribution electrode on a top surface thereof and can form a favorable light distribution using a shield electrode on the top surface. The vehicle lamp can include the light source and an optical lens selected according to a kind and/or design of a vehicle lamp.

Abstract: The wafer processing apparatus 100 included in an etching apparatus selectively etches the peripheral portion of a wafer 200. The wafer processing apparatus 100 includes a lower electrode 112 as a stage on which the wafer 200 is placed, a process gas introducing duct 120 supplying therethgouh a process gas etching the peripheral portion, an etching-interfering gas introducing duct 118 supplying therethrough an etching-interfering gas interfering supply of the process gas to the center portion of the wafer, and a movable alignment mechanism 102 aligning the wafer on the lower electrode 112. The etching-interfering gas introducing duct 118 and the process gas introducing duct 120 can be provided in an upper electrode 106.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Abstract: A semiconductor light emitting apparatus for emitting a desired colored light by coating the top surface thereof with a wavelength conversion member prevents the color unevenness from occurring due to the unevenness of the coating thickness of the wavelength conversion member. The semiconductor light emitting apparatus can include a semiconductor layer having a light emitting layer with a light emitting surface having at least one corner area, a supporting substrate configured to support the semiconductor layer, and a wavelength conversion material layer formed on top of the semiconductor layer, the wavelength conversion layer having a thickness thinner from a center portion of the semiconductor layer to an outer peripheral portion. The at least one corner area can include a non-emitting portion where light cannot be projected. The non-emitting portion can be a light shielding portion, a non-light emission portion or a current confined portion.

Abstract: In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, and at least one conductive leaf spring adapted to fix the optical semiconductor device to the mounting substrate and supply power to the optical semiconductor device, the leaf spring is formed by a plurality of rectangularly-shaped terminals, and natural frequencies of at least two of the rectangularly-shaped terminals are different from each other.

Abstract: An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include a wavelength conversion material mixed therein, the transparent resin portion formed in such a manner as to surround the LED chip, wherein the LED chip is positioned offset toward one side in the transparent resin portion, and wherein the wavelength conversion material mixed in the transparent resin portion has a higher density around the LED chip within the transparent resin portion.

Abstract: A white LED light source device and an LED backlight using the white LED light source can produce, among other features, white light with sufficient luminous intensity, uniform color tone, and high luminous utilization efficiency. A light path for producing white light with favorable color mixture can be shortened. The white LED light source device can be configured to include a bluish green LED lamp which can emit bluish green light by the combination of a blue LED device and a green phosphor material and a purple LED lamp which can emit purple light by the combination of a blue LED device and a red phosphor material. The bluish green light from the bluish green LED lamp and the purple light from the purple LED lamp are subjected to additive color mixture to produce white light with a spectrum containing three primary color wavelength components.