Abstract: A control unit of an image reading device is configured to execute image correction control after performing a first reading operation of reading a medium while transporting the medium in a first direction, and the image correction control includes a second reading operation of reading the medium while transporting the medium in a second direction opposite to the first direction, and a combination process for combining a first area serving as a part of image data acquired through the first reading operation with a second area serving as a part of image data acquired through the second reading operation to acquire image data of one page.

Abstract: This flat conductive plate provided with an insulating film includes a flat conductive plate which is a punched product, and an insulating film which coats at least a part of the flat conductive plate, the insulating film is an electrodeposited film, the insulating film includes a polyamide-imide resin and a fluorine-based resin, an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less, a relative permittivity at 25° C. is in a range of 2.2 or more and 2.8 or less, and an average film thickness is in a range of 5 ?m or more and 100 ?m or less.

Abstract: The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.

Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.

Abstract: A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.

Abstract: Production method for metal oxide fine particles includes: a step of mixing a fatty acid represented by CnH2nO2 (n=5 to 14) and a metal source consisting of a metal, metal oxide, or metal hydroxide of at least two metal elements selected from the group consisting of Zn, In, Sn, and Sb to obtain a mixture; a step of heating the mixture at a temperature that is equal to or higher than a melting temperature of the fatty acid and lower than a decomposition temperature of the fatty acid to obtain a metal soap which is a precursor of metal oxide fine particles; and a step of heating the precursor at a temperature that is equal to or higher than a melting temperature of the precursor and lower than a decomposition temperature of the precursor to obtain metal oxide fine particles having an average particle diameter of 80 nm or less.

Abstract: The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer (30) to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 ?m or more and 500 ?m or less.

Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.

Abstract: An insulating film of the present invention includes a resin formed of polyimide, polyamide-imide, or a mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more, in which the ceramic particles form aggregated particles and a content of the ceramic particles is in a range of 5 vol % or more and 60 vol % or less.

Abstract: Production method for metal oxide fine particles includes: a step of mixing a fatty acid represented by CnH2nO2 (n=5 to 14) and a metal source consisting of a metal, metal oxide, or metal hydroxide of at least two metal elements selected from the group consisting of Zn, In, Sn, and Sb to obtain a mixture; a step of heating the mixture at a temperature that is equal to or higher than a melting temperature of the fatty acid and lower than a decomposition temperature of the fatty acid to obtain a metal soap which is a precursor of metal oxide fine particles; and a step of heating the precursor at a temperature that is equal to or higher than a melting temperature of the precursor and lower than a decomposition temperature of the precursor to obtain metal oxide fine particles having an average particle diameter of 80 nm or less.

Abstract: An insulating film includes: a resin consisting of a polyimide, a polyamide-imide, or a mixture thereof; and ?-alumina single crystal particles having an average particle diameter in a range of 0.3 ?m or more and 1.5 ?m or less, in which an amount of the ?-alumina single crystal particles is in a range of 8% by volume or more and 80% by volume or less. An insulated conductor includes: a conductor; and an insulating film provided on a surface of the conductor, in which the insulating film consists of the insulating film. A metal base substrate includes a metal substrate, an insulating film, and a metal foil which are laminated in this order, in which the insulating film consists of the insulating film.

Abstract: The silver-coated silicone rubber particles according to the present invention are each formed by providing a first coating layer comprising silicon or a silicon compound on the surface of a silicone rubber particle and further providing a second coating layer comprising silver on the surface of the first coating layer. In a conductive paste containing the silver-coated silicone rubber particles, the silver-coated silicone rubber particles are dispersed evenly.

Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.

Abstract: This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

Abstract: This sintered porous silver film is obtained by sintering silver particles, wherein a crystallite size is 60 nm to 150 nm, a ratio of a detected amount of C3H7+ ions to a detected amount of Ag+ ions which are measured by time-of-flight secondary ion mass spectrometry is 0.10 to 0.35, and a ratio of a detected amount of C2H? ions to the detected amount of Ag? ions which are measured by time-of-flight secondary ion mass spectrometry is 0.9 to 3.7.

Abstract: A metal base substrate includes a metal substrate (10), an insulating layer (20), and a metal foil (40) which are laminated in this order, wherein the metal base substrate further includes an adhesive layer (30) between the insulating layer (20) and the metal foil (40), and the adhesive layer (30) satisfies Expressions (1) to (3), in which E represents a Young's modulus at 25° C. having a unit of GPa, T represents a thickness having a unit of ?m, and ? represents a thermal conductivity in a thickness direction having a unit of W/mK, E?1??(1) 5?T/E??(2) T/?<20.

Abstract: A power module substrate with a heat sink (10) includes a power module substrate (20) provided with an insulating substrate (21), a circuit layer (22) provided on one surface of the insulating substrate (21) and a metal layer (23) provided on the other surface of the insulating substrate (21); and a heat sink (40) bonded via a bonding layer (30) to a surface on an opposite side to the insulating substrate (21) of the metal layer (23) of the power module substrate (20), in which the bonding layer (30) is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and has a thickness in a range of 10 ?m or more and 500 ?m or less.

Abstract: This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

Abstract: A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.