Abstract: A vehicle wheel bearing apparatus has an outer member (2, 30) formed with double row outer raceway surfaces (2a, 2b) on its inner circumferential surface. Inner members (1, 20, 29, 35, 38) are each formed with double row inner raceway surfaces (4a, 5a, 31a) on its outer circumferential surface arranged opposite to the double row outer raceway surfaces (2a, 2b). Double row ball groups (3) are freely rollably contained between the outer raceway surfaces (2a, 2b) and inner raceway surfaces (4a, 5a, 31a) of the inner members (1, 20, 29, 35, 38) and the outer member (2, 30). A pitch circle diameter (PCDo) of a ball group (3) near a wheel mounting flange (6) is larger than a pitch circle diameter (PCDi) of a ball group (3) away from the wheel mounting flange (6). Each corner of the shoulders of the outer and inner raceway surfaces (2a, 2b, 4a, 5a, 31a) is rounded as a smooth circular arc.

Abstract: A sensor equipped wheel support bearing assembly for supporting a vehicle wheel rotatably relative to a vehicle body, including an outer member; an inner member; a plurality of rows of rolling elements interposed between the outer and inner member; a strain sensor unit, made up of a strain generating member and a sensor element fitted to the strain generating member for detecting strains induced in the strain generating member, is fitted to one of the outer and inner members, that serves as a stationary member; and a covering member that covers at least the sensor element sealingly, provided on a mounting surface of the strain generating member of the strain sensor unit, on which the sensor element is mounted, the covering member being made of a resin which is over-molded or an elastomer bonded by vulcanization.

Abstract: A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

Abstract: A sensor equipped wheel support bearing assembly for supporting a vehicle wheel rotatably relative to a vehicle body, including an outer member; an inner member; a plurality of rows of rolling elements interposed between the outer and inner member; a strain sensor unit, made up of a strain generating member and a sensor element fitted to the strain generating member for detecting strains induced in the strain generating member, is fitted to one of the outer and inner members, that serves as a stationary member; and a covering member that covers at least the sensor element sealingly, provided on a mounting surface of the strain generating member of the strain sensor unit, on which the sensor element is mounted, the covering member being made of a resin which is over-molded or an elastomer bonded by vulcanization.

Abstract: To provide a sensor equipped wheel support bearing assembly, in which a load sensor can be installed compactly in an automotive vehicle, maintaining a high sensitivity while damage and/or malfunction caused by the external environments and/or the electromagnetic noises are avoided, with low manufacturing cost. This bearing assembly includes outer and inner members having respective rolling surfaces and a plurality of rows of rolling elements interposed between those rolling surfaces. A strain sensor unit including a sensor element is fitted to one of the outer and inner members, which is a stationary member, for example, the outer member. A sensor mounting surface of the strain sensor unit fitted with the sensor element has a covering member made of a resin, which is over-molded, or an elastomer bonded by vulcanization, so as to cover the sensor element sealingly.

Abstract: A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

Abstract: A vehicle wheel bearing apparatus has a pitch circle diameter of an outer side ball group that is larger than a pitch circle diameter of an inner side ball group. Each corner portion of the outer circumferential surfaces of the inner member is rounded as a smooth circular arc.

Abstract: A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

Abstract: A vehicle wheel bearing apparatus has an outer member with a body flange and double row outer raceway surfaces. An inner member includes a wheel hub and an inner ring. They include inner raceway surfaces arranged opposite to the double row outer raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces. Outer side rolling elements of the double row rolling elements are balls and inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side tapered rollers is set smaller than that of the outer side balls. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends to at least near the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range.

Abstract: An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.

Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

Abstract: To provide a sensor equipped wheel support bearing assembly, in which a load sensor can be installed compactly in an automotive vehicle, maintaining a high sensitivity while damage and/or malfunction caused by the external environments and/or the electromagnetic noises are avoided, with low manufacturing cost. This bearing assembly includes outer and inner members having respective rolling surfaces and a plurality of rows of rolling elements interposed between those rolling surfaces. A strain sensor unit including a sensor element is fitted to one of the outer and inner members, which is a stationary member, for example, the outer member. A sensor mounting surface of the strain sensor unit fitted with the sensor element has a covering member made of a resin, which is over-molded, or an elastomer bonded by vulcanization, so as to cover the sensor element sealingly.

Abstract: A vehicle wheel bearing apparatus has an outer member and inner member. The inner member includes a wheel hub and inner ring. The outer member and inner member include respective raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces, respectively, of the outer member and the inner member. At least the inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side rolling elements is set smaller than a pitch circle diameter of the outer side rolling elements. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends near to a shaft shaped portion beyond the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range.

Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

Abstract: A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 ?m and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23?5 (3) D150?2.5 (4) (D?65/D150)?3.0 (5) H23?140 (6) (H?65/H150)?2.3.

Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

Abstract: A vehicle wheel bearing apparatus has an outer member and inner member. The inner member includes a wheel hub and inner ring. The outer member and inner member include respective raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces, respectively, of the outer member and the inner member. At least the inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side rolling elements is set smaller than a pitch circle diameter of the outer side rolling elements. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends near to a shaft shaped portion beyond the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range.

Abstract: A vehicle wheel bearing apparatus has an outer member with a body flange and double row outer raceway surfaces. An inner member includes a wheel hub and an inner ring. They include inner raceway surfaces arranged opposite to the double row outer raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces. Outer side rolling elements of the double row rolling elements are balls and inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side tapered rollers is set smaller than that of the outer side balls. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends to at least near the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range.

Abstract: A semiconductor device mounting board, a method of manufacturing the same, a method of inspecting the same, and a semiconductor package are provided. The semiconductor device mounting board is capable of implementing a high-density and fine structure corresponding to a narrowing pitch and has high mounting reliability. A semiconductor device mounting board includes a wiring construction film including an insulating layer and a wiring layer, and a first electrode pattern disposed on one surface of the wiring construction film in which a periphery of a side surface of the electrode pattern is in contact with the insulating layer. At least a rear surface of the first electrode pattern is not in contact with the insulating layer.

Abstract: A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 ?m and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23?5 (3) D150?2.5 (4) (D?65/D150)?3.0 (5) H23?140 (6) (H?65/H150)?2.