Abstract: An object of the present invention is to provide a water-developable flexographic printing plate precursor which has excellent water developability and exhibits excellent printing durability in a case of being made into a flexographic printing plate, a flexographic printing plate, and a photosensitive resin composition. The water-developable flexographic printing plate precursor of the present invention includes a photosensitive layer, in which the photosensitive layer contains a monomer, a polymerization initiator, a base polymer, and water-dispersible particles, the water-dispersible particles have carbon-carbon double bonds, and an amount of the carbon-carbon double bonds on a surface of the water-dispersible particles is 21 or less.

Abstract: An object of the present invention is to provide a water-developable flexographic printing plate precursor, a flexographic printing plate, and a photosensitive resin composition, which can maintain good water developability and can suppress adhesion and aggregation of dispersion in the developer in a case of repeated use and disposal of the aqueous developer. The water-developable flexographic printing plate precursor of the present invention is a water-developable flexographic printing plate precursor including a photosensitive layer, in which the photosensitive layer contains water-dispersible particles, and the water-dispersible particles have a core containing a polymer and having a glass transition temperature of 0° C. or lower and have a shell containing a polymer and having a glass transition temperature of 10° C. or higher.

Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

Abstract: The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

Abstract: The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract: As a temporary bonding layer for production of semiconductor device, which not only can temporarily support a member to be processed (for example, a semiconductor wafer) firmly and easily when the member to be processed is subjected to a mechanical or chemical processing, but also can easily release the temporary support for the member processed without imparting damage to the member processed, a stack and a production method of semiconductor device, a temporary bonding layer for production of semiconductor device including (A) a release layer and (B) an adhesive layer, wherein the release layer is a layer containing a hydrocarbon resin is provided.

Abstract: The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray or radiation to pattern exposure of the adhesive layer to provide a high adhesive region and a low adhesive region in the adhesive layer, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching the first surface of the treated member from the adhesive layer of the adhesive support.

Abstract: A resin including (i) a main chain portion containing a nitrogen atom, (ii) a group X that has a functional group having a pKa of 14 or less and is bonded to a nitrogen atom present in the main chain portion, and (iii) an oligomer chain or polymer chain Y having a number average molecular weight of from 500 to 1,000,000 in a side chain.

Abstract: The invention provides a dye-containing negative curable composition containing at least: (A) an organic solvent-soluble dye; (B) a photo-polymerization initiator; (C) a photo-polymerizable compound; (D) an amino group-containing alkali-soluble resin having, in a side chain thereof, a structure represented by the following Formula (1); and (E) an organic solvent. In Formula (1), R1 and R2 each independently represent a hydrogen atom or a monovalent organic group, and R1 and R2 may be linked with each other to form a ring structure.

Abstract: A pigment-dispersed composition includes (a) a high-molecular compound containing at least one kind of repeating unit selected from repeating units each represented by the following Formula (I) or (II), (b) a pigment, and (c) an organic solvent, wherein, in Formulae (I) and (II), R1 to R6 each represent a hydrogen atom or another group; X1 and X2 each represent —CO—, —C(?O)O—, —CONH—, —OC(?O)—, or a phenylene group; L1 and L2 each represent a single bond or a divalent organic linking group; A1 and A2 each represent a monovalent organic group; m and n each represent an integer of from 2 to 8; and p and q each represent an integer of from 1 to 100. Also disclosed is a pigment-dispersed composition containing (A) a graft high-molecular polymer in which acrylic acid is copolymerized at a proportion of from 5% by mass to 30% by mass in the main chain thereof, (B) a pigment, and (C) an organic solvent.

Abstract: Provided are a processed pigment excellent in dispersibility and dispersion stability, a pigment-dispersed composition excellent in dispersibility and dispersion stability of a pigment that uses the processed pigment, a colored photosensitive composition using the pigment-dispersed composition, and a color filter having improved color properties that uses the colored photosensitive composition, in which a pigment is covered with at least one of a specific polymer compound selected from the following (SP-1) to (SP-3); (SP-1) A polymer compound having a heterocycle on a side chain, (SP-2) A graft polymer compound having a weight average molecular weight of from 1,000 to 100000, (SP-3) A polymer compound represented by the following formula (3-1), wherein, RC, RD, A1 and P1 respectively represent an organic linkage group, a single bond or a divalent organic linkage group, a monovalent organic group containing such as an organic dye structure, and a polymer skeleton.

Abstract: A dispersion composition is provided in which the dispersibility of titanium black is high, the sedimentation of titanium black over time is suppressed, and overall dispersibility and storage stability are high. Further, a polymerizable composition is provided in which favorable coating property on a substrate and even film thickness can be obtained, generation of residue in an unexposed region when a pattern is formed can be suppressed, and favorable pattern shape having any steps after exposure/development can be obtained. The dispersion composition contains (A) titanium black, (B) a graft copolymer and (C) a solvent.

Abstract: The present invention provides: a pigment dispersion composition including (A) an organic pigment, (B) a pigment derivative represented by Formula (I) below and (C) a polymer compound having a pigment-adsorptive functional group; a curable color composition including the pigment dispersion composition, a polymerizable compound and a polymerization initiator; and a color filter having a color region formed using the curable color composition and a method for producing the same. Q represents an organic colorant residue; A represents an ethylene group or the like; and R represents a hydroxyl group or a group represented by —NH-A-Z; Z represents —SO3H, —COOH or a salt thereof; and n represents an integer of from 1 to 4. When R represents —NH-A-Z, the structures represented by the two —NH-A-Zs bonded to the triazine ring contained in each of the n partial structures bonded to Q may be the same as each other or different from each other.

Abstract: The invention provides a dye-containing negative curable composition containing at least: (A) an organic solvent-soluble dye; (B) a photo-polymerization initiator; (C) a photo-polymerizable compound; (D) an amino group-containing alkali-soluble resin having, in a side chain thereof, a structure represented by the following Formula (1); and (E) an organic solvent. In Formula (1), R1 and R2 each independently represent a hydrogen atom or a monovalent organic group, and R1 and R2 may be linked with each other to form a ring structure.