Patents by Inventor Kazuhiro Furugoori

Kazuhiro Furugoori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8446736
    Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: May 21, 2013
    Assignee: Panasonic Corporation
    Inventors: Takayuki Kita, Masaaki Katsumata, Tadashi Nakamura, Kota Fukasawa, Kazuhiro Furugoori
  • Publication number: 20090175017
    Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
    Type: Application
    Filed: May 28, 2008
    Publication date: July 9, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Takayuki Kita, Masaaki Katsumata, Tadashi Nakamura, Kota Fukasawa, Kazuhiro Furugoori