Abstract: An object of the present invention is to provide a soft magnetic material exhibiting excellent magnetic characteristics regardless of the frequency to be applied and a dust core produced from the soft magnetic material. The means for solving the invention is a soft magnetic material that comprises metal magnetic particles 10 containing iron and oxygen. The ratio of oxygen contained in metal magnetic particles 10 is more than 0 and less than 0.05% by mass. A dust core produced using such a soft magnetic material has a coercive force of 2.0×102 A/m or less.

Abstract: The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of silicon. A method of manufacturing the package of the present invention is featured by mounting the silicon wafer on the insulating substrate.

Abstract: A method for making soft magnetic material includes: a first heat treatment step applying a temperature of at least 400 deg C. and less than 900 deg C. to metal magnetic particles (10); a step for forming a plurality of compound magnetic particles (30) in which said metal magnetic particles (10) are surrounded by insulation film (20); and a step for forming a shaped body by compacting a plurality of compound magnetic particles (30). This provides a method for making soft magnetic material that provides desired magnetic properties.

Abstract: The present invention provides a soft magnetic material and a powder magnetic core having desired magnetic characteristics. A soft magnetic material contains a metal magnetic powder 10. The metal magnetic powder 10 is formed from crystals 1 with an average size, as determined from X-ray diffraction, of at least 30 nm. It would be preferable, in the metal magnetic particles 10, for crystal grains 2 to have an average size of at least 10 microns.

Abstract: A soft magnetic material includes a plurality of composite magnetic particles. Each of the plurality of composite magnetic particles has: a metal magnetic particle including iron; a lower film surrounding the surface of the metal magnetic particle and including a nonferrous metal; and an insulating upper film surrounding the surface of the lower film and including at least one of oxygen and carbon. The nonferrous metal has an affinity with the at least one of oxygen and carbon included in the upper film that is larger than such affinity of iron; or the nonferrous metal has a diffusion coefficient with respect to the at least one of oxygen and carbon included in the upper film that is smaller than such diffusion coefficient of iron. This configuration provides desirable magnetic properties.

Abstract: An aluminum nitride sintered body produced by sintering under pressure of a powder composition comprising aluminum nitride and 5 to 30% by weight of at least one sintering aid selected from the group consisting of Nd, Sm, Eu, Er, Dy, Gd, Pr and Yb, per 100% by weight of the powders of aluminum nitride and the sintering aid, wherein the amount of the sintering aid is a conversion value as oxides of the elements, the sintering body that has been subjected to mirror-polishing having a surface roughness R max of 0.2 ?m or less and a thermal conductivity of 200 (W/mK) or more.

Abstract: A chip mounting substrate for bonding a semiconductor chip to a substrate, comprises a solder layer on the substrate, the solder layer being connectable to a semiconductor chip, wherein the solder layer comprises a layer including ?-phase crystal grains of an Au—Sn alloy at a surface of the solder layer. The solder layer comprising a layer including ?-phase crystal grains of an Au—Sn alloy is formed at a surface of the solder layer. On mounting a semiconductor chip on the substrate, the substrate and the solder layer are heated and an image of the solder layer is shot to perform an image evaluation to detect the timing of mounting the semiconductor chip on the solder layer of the substrate and a position of the chip.

Abstract: An optical element-mounting substrate that makes it easy to optically couple the optical semiconductor element to the optical fiber or to the lens and that can be highly integrated while suppressing deterioration in the high-frequency signals. The optical element-mounting substrate for optically coupling the optical semiconductor element to the optical fiber through the lens, comprises an insulating film formed on the surface of the optical element-mounting substrate, grooves formed on the substrate for installing the optical fiber and the lens, a thin-film electrode formed on the insulating film, a thin-film capacitor and a thin-film temperature sensor arranged maintaining a distance from the thin-film electrode, and a solder film formed on the insulating film in a region where the optical semiconductor element is mounted so as to be electrically connected to the thin-film electrode.

Abstract: A tread (11) of a tire (10) is provided with a plurality of blocks (12) to (15). The blocks (12) to (15) are provided symmetrically about an equator plane (E). Each of the blocks (12) to (15) is provided regularly in a circumferential direction. Each of the blocks (12) to (15) is formed to take a solid shape specified by a long side dimension (W), a short side dimension (L) and a high side dimension (H). The blocks (12) to (15) include recesses (21), (24), (27) and (28) respectively. Each of the recesses (21), (24), (27) and (28) is specified by a long side dimension (WR), a short side dimension (LR) and a deep side dimension (HR). The dimensions have a relationship of WR/W=0.33 to 0.87, LR/L=0.2 to 0.8 and HR/H=0.15 to 0.85. A ratio of a block volume (BT) to a recess volume (RT) is set to be RT/BT=0.08 to 0.25.

Abstract: The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of silicon. A method of manufacturing the package of the present invention is featured by mounting the silicon wafer on the insulating substrate.

Abstract: An optical bench for mounting an optical element includes a silicon substrate, a first dielectric substrate and a second dielectric substrate which are arranged on the silicon substrate, on the first substrate, there are arranged mounting sections of a laser diode, a wiring, and a mounting section of the photodiode, and on the silicon substrate, there is arranged a mounting section of a lens or an optical fiber, obtaining an optical bench, which is not easily curved with temperature, for mounting an optical element.

Abstract: The method of manufacturing soft magnetic articles comprises a step of preparing a melt solution containing soft magnetic materials and a step of forming soft magnetic particles from the melt solution in a magnetic field by an atomization rapid solidification method.

Abstract: An aluminum nitride sintered body produced by sintering under pressure of a powder composition comprising aluminum nitride and 5 to 30% by weight of at least one sintering aid selected from the group consisting of Nd, Sm, Eu, Er, Dy, Gd, Pr and Yb, per 100% by weight of the powders of aluminum nitride and the sintering aid, wherein the amount of the sintering aid is a conversion value as oxides of the elements, the sintering body that has been subjected to mirror-polishing having a surface roughness R max of 0.2 &mgr;m or less and a thermal conductivity of 200 (W/mK) or more.

Abstract: An optical element-mounting substrate that makes it easy to optically couple the optical semiconductor element to the optical fiber or to the lens and that can be highly integrated while suppressing deterioration in the high-frequency signals. The optical element-mounting substrate for optically coupling the optical semiconductor element to the optical fiber through the lens, comprises an insulating film formed on the surface of the optical element-mounting substrate, grooves formed on the substrate for installing the optical fiber and the lens, a thin-film electrode formed on the insulating film, a thin-film capacitor and a thin-film temperature sensor arranged maintaining a distance from the thin-film electrode, and a solder film formed on the insulating film in a region where the optical semiconductor element is mounted so as to be electrically connected to the thin-film electrode.

Abstract: A radial tire for motorcycle has a belt layer of cords with modulus of elasticity of 600 kg/mm.sup.2 or more wound spirally on a carcass nearly parallel to the tire equator, and a bead apex rubber disposed on a bead core between a carcass main portion extending from a tread to a bead core and a carcass turned up portion. The bead apex rubber consists of a soft apex part SA with JISA hardness of 50 to 60 degrees extending radially outward from the bead core, and a hard apex part HA with JISA hardness of 70 to 95 degrees extending radially outward from the soft apex part SA. A height h1 the soft apex part SA from a bead base is 0.20 to 0.40 times a height h0 of the tread end, and a height h2 of the hard apex part HA is 0.50 to 1.25 times the height h0 of the tread end.

Abstract: In a mode switching type electronic timepiece of the type wherein time correction is made under a correction mode, where the same data is displayed over a predetermined period in the correction mode, the operation of the timepiece is automatically transferred from the correction mode in which power is consumed for the time display to a nondisplay mode in which no power is consumed for the time display or a specific mode in which less power is consumed.