Patents by Inventor Kazuhiro Imada

Kazuhiro Imada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6589647
    Abstract: In a thermoplastic elastomer having a matrix phase of a thermoplastic resin and a domain phase of rubber particles at least a part of which is crosslinked, use is made of rubber particles at least a part of which is conductive to provide a conductive thermoplastic elastomer composition having a volume resistivity that can be controlled over a wide range of from a conductive region (104 ((&OHgr;·cm) or less) to an insulting region (1013 (&OHgr;·cm) or more).
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: July 8, 2003
    Assignee: The Yokohama Rubber Company, Ltd.
    Inventors: Osamu Ozawa, Kazuhiro Imada
  • Patent number: 4818453
    Abstract: A novel manufacturing process of mold containing continuous holes and used for filter materials, gas dispersive materials, and mold materials. By this invention, the epoxy resin mixture including an epoxy compound having one or more epoxy groups in each mole, a hardener which reacts with and hardens the epoxy compound, emulsifiers, water or water-surface active agent, and fillers respectively is used as the molding material. As the emulsifier, at least two kinds of three different kinds of nonionic emulsifiers of 4-8, 8-17, and 11-15.6 HLB respectively are used together.The molding material is cured to a desired shape to prepare a mold containing continuous holes and for molding, conventional methods such as hardening after casting, for example, are adopted.
    Type: Grant
    Filed: September 1, 1987
    Date of Patent: April 4, 1989
    Assignees: Inax Corp., I-N Technical Lab, Ltd.
    Inventors: Saihachi Inoue, Shigeru Kiriyama, Kazuhiro Imada
  • Patent number: 4783489
    Abstract: The first invention relates to a novel manufacturing process of mold containing continuous holes and used for filter materials, gas dispersive materials, and mold materials. By this invention, the epoxy resin mixture including an epoxy compound having one or more epoxy groups in each molecule, a hardener which reacts with and hardens the epoxy compound, emulsifiers, water or water-surface active agent, and fillers respectively is used as the molding material. As the emulsifier, at least two kinds of three different kinds of nonionic emulsifiers of 4-8, 8-17, and 11-15.6 HLB respectively are used together. This is the primary feature of the invention and no molding materials including such emulsifiers are known so far. The molding material is cured to a desired shape to prepare a mold containing continuous holes and for molding, conventional methods such as hardening after casting, for example, are adopted.The second invention relates to a novel casting mold suitable be for slip discharge casting.
    Type: Grant
    Filed: February 6, 1986
    Date of Patent: November 8, 1988
    Assignees: Inax Corp., IN Technical Lab Co., Ltd.
    Inventors: Saihachi Inoue, Shigeru Kiriyama, Kazuhiro Imada