Abstract: The object is to provide a technology that can shorten a routing length of a gate wire connecting a control IC that controls driving first and second semiconductor elements that are connected in parallel with each other, to a gate pad of one of the first and second semiconductor elements disposed distant from the control IC. A first semiconductor element and a second semiconductor element are disposed so that a long side of the first semiconductor element faces a side of the second semiconductor element, and a HVIC or a LVIC, the first semiconductor element, and the second semiconductor element are disposed in this order in a direction orthogonal to a first direction, the gate pad is disposed on the first semiconductor element on one side in the first direction, and the gate pad is disposed on the second semiconductor element on the other side in the first direction.

Abstract: A semiconductor device includes: a first terminal inputting a first voltage from outside; a drive unit using the first voltage as a power supply voltage and outputting a drive signal; a switching device driven by the drive signal; a second terminal separated from the first terminal and inputting a second voltage from outside; a comparator using a voltage generated from the second voltage as a power supply voltage and outputting an output signal when a voltage generated from the first voltage is less than or equal to a reference potential; and a shut-off switch shutting off a transmission of the drive signal to the switching device from the drive unit in response to the output signal.

Abstract: An object is to provide a technique capable of improving heat dissipation while maintaining the workability of a product in a semiconductor device. A semiconductor device includes power chips, control chips configured to control the power chips, power side terminals, control side terminals, and a mold resin covering the power chips, the control chips, one ends side of the power side terminals, and one ends side of the control side terminals. An other ends side of the power side terminals and an other ends side of the control side terminals protrude horizontally from a side surface of the mold resin and bend downward at middle parts thereof. Of the power side terminals and the control side terminals, only on the other ends side of the power side terminals, heat dissipation portions protruding in a direction approaching or away from the mold resin from portions bent downward are formed.

Abstract: A semiconductor device includes: a first semiconductor integrated circuit including at least a first terminal and a second terminal; a first lead frame connected to the first terminal; a second lead frame connected to the second terminal; and a mold resin covering the first semiconductor integrated circuit. The mold resin further covers the first lead frame with a portion of the first lead frame being exposed. The mold resin further covers the second lead frame with a tip of the second lead frame opposite to the second terminal being exposed. The mold resin includes a recess, and the recess is opened to expose only the portion and the mold resin.

Abstract: A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

Abstract: A semiconductor device includes: a first semiconductor integrated circuit including at least a first terminal and a second terminal; a first lead frame connected to the first terminal; a second lead frame connected to the second terminal; and a mold resin covering the first semiconductor integrated circuit. The mold resin further covers the first lead frame with a portion of the first lead frame being exposed. The mold resin further covers the second lead frame with a tip of the second lead frame opposite to the second terminal being exposed. The mold resin includes a recess, and the recess is opened to expose only the portion and the mold resin.

Abstract: An object is to provide a technique capable of improving heat dissipation while maintaining the workability of a product in a semiconductor device. A semiconductor device includes power chips, control chips configured to control the power chips, power side terminals, control side terminals, and a mold resin covering the power chips, the control chips, one ends side of the power side terminals, and one ends side of the control side terminals. An other ends side of the power side terminals and an other ends side of the control side terminals protrude horizontally from a side surface of the mold resin and bend downward at middle parts thereof. Of the power side terminals and the control side terminals, only on the other ends side of the power side terminals, heat dissipation portions protruding in a direction approaching or away from the mold resin from portions bent downward are formed.

Abstract: A semiconductor module includes: a control circuit for controlling first and second transistors operating complementarily; and an internal controller receiving a data signal including a set value of an operating characteristic from an external controller to store the data signal in a memory and then transferring the set value of the operating characteristic to the control circuit. The data signal is sent to the internal controller in the order of the set value of the operating characteristic and a specific trigger value. The internal controller transfers the set value of the operating characteristic to the control circuit in timed relation to writing of the specific trigger value into the memory. The control circuit includes first and second drivers. The control circuit changes settings of the first and second drivers to thereby change the operating characteristic of the semiconductor module.

Abstract: A semiconductor module includes: a control circuit for controlling first and second transistors operating complementarily; and an internal controller receiving a data signal including a set value of an operating characteristic from an external controller to store the data signal in a memory and then transferring the set value of the operating characteristic to the control circuit. The data signal is sent to the internal controller in the order of the set value of the operating characteristic and a specific trigger value. The internal controller transfers the set value of the operating characteristic to the control circuit in timed relation to writing of the specific trigger value into the memory. The control circuit includes first and second drivers. The control circuit changes settings of the first and second drivers to thereby change the operating characteristic of the semiconductor module.

Abstract: An object of the invention is to provide the semiconductor module which can predict a life precisely, and the life prediction system for the semiconductor module. The semiconductor module according to the present invention includes IGBTs, diodes, measurement circuits for measuring characteristics of the IGBTs and the diodes, and a memory for storing initial values of predetermined characteristics of the IGBTs and the diodes, measured values of characteristics of the IGBTs and the diodes measured by measurement circuits, and a predetermined determination value for characteristic degradation of the IGBTs and the diodes.

Abstract: An external detection terminal CIN1 is externally connectable outside a package and accepts a voltage signal proportionate to magnitude of a current in a second fixed-potential terminal. A first comparator circuit determines whether magnitude of the current in the second fixed-potential terminal indicated by the voltage signal from the external detection terminal is within a permissible range or beyond the permissible range. A second comparator circuit determines whether magnitude of a current in a sense terminal detected by using an internal detection terminal is within a permissible range or beyond the permissible range. A driving signal generator is prohibited from generating an ON signal as a driving signal if at least one of the first comparator circuit and the second comparator circuit determines that the current magnitude is beyond the permissible range.

Abstract: An external detection terminal CIN1 is externally connectable outside a package and accepts a voltage signal proportionate to magnitude of a current in a second fixed-potential terminal. A first comparator circuit determines whether magnitude of the current in the second fixed-potential terminal indicated by the voltage signal from the external detection terminal is within a permissible range or beyond the permissible range. A second comparator circuit determines whether magnitude of a current in a sense terminal detected by using an internal detection terminal is within a permissible range or beyond the permissible range. A driving signal generator is prohibited from generating an ON signal as a driving signal if at least one of the first comparator circuit and the second comparator circuit determines that the current magnitude is beyond the permissible range.

Abstract: A service system offers information of an invitation of a public contribution and/or a prize contest by using a cellular phone, a personal digital assistant or a computer terminal machine. A user can easily participate in the system. The user is individually provided with proper information of the invitation of public contribution and/or the prize contest, and can apply for the information, by on-line registering basic information of the user through a cellular phone, a personal digital assistant, or a computer terminal machine connectable to the Internet, by carrying out a referring process on-line by using the proper information. The user is permitted access to a plurality of information of invitation of public contributions and/or prize contests on the Internet.