Patents by Inventor Kazuhiro Masuda

Kazuhiro Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060043452
    Abstract: A ferroelectric memory includes a base member, a dielectric layer formed above the base member, a contact hole that penetrates the dielectric layer, a plug formed inside the contact hole, a barrier layer formed above the plug, and including a first portion with a portion formed in the contact hole and a second portion formed integrally with the first portion and above the dielectric layer, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 2, 2006
    Inventors: Mamoru Ueda, Kazuhiro Masuda, Shinichi Fukada
  • Publication number: 20060046318
    Abstract: A ferroelectric memory includes a base member, a first dielectric layer formed above the base member, a second dielectric layer formed above the first dielectric layer, a contact hole that penetrates the first and second dielectric layers, a plug formed in the contact hole, and a barrier layer formed above the plug, and a ferroelectric capacitor formed from a lower electrode, a ferroelectric layer and an upper electrode successively laminated in a region including above the plug. The second dielectric layer has a property that is more difficult to be polished than the plug and the first dielectric layer.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 2, 2006
    Inventors: Mamoru Ueda, Kazuhiro Masuda, Shinichi Fukada
  • Publication number: 20050271863
    Abstract: A protective layer transfer film and an intermediate transfer recording medium are disclosed, which can impart excellent fastness properties (durability), particularly excellent fastness to plasticizers and abrasion, to an image formed on an object. The protective layer transfer film includes a substrate film and a transfer part provided separably on the substrate film. The transfer part includes at least a plasticizer-resistant layer and a receptive layer on which an image is to be formed. The intermediate transfer recording medium is adapted for the transfer of the transfer part onto an object after the formation of an image on the receptive layer. The plasticizer-resistant layer is formed of an acrylic copolymer resin.
    Type: Application
    Filed: May 3, 2005
    Publication date: December 8, 2005
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventor: Kazuhiro Masuda
  • Patent number: 6942907
    Abstract: The present invention provides a protective layer thermal transfer sheet in which: a protective layer having a thermal transferring property is placed on at least one portion of one of the faces of a substrate sheet and the protective layer is formed by successively laminating at least a peeling layer, a plasticizer resistant layer and a heat adhesive resin layer on the substrate sheet, and in this structure, the heat adhesive resin layer is made from a polyester-urethane resin; and a printed article with the protective layer transferred thereto.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: September 13, 2005
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhiro Masuda, Masahiro Yuki, Makoto Hashiba, Kazutoshi Awano
  • Publication number: 20050142297
    Abstract: The present invention provides a thermosetting and photocurable coating composition comprising: (A) at least one compound selected from the group consisting of radical-polymerizable unsaturated monomers, resins containing radical-polymerizable unsaturated groups, and resins containing radical-polymerizable unsaturated groups and thermosetting functional groups; (B) a hydroxyl-containing polyester resin produced by esterifying a polybasic acid (a) and a polyhydric alcohol (b), wherein an alicyclic polybasic acid (a1) and/or an alicyclic polyhydric alcohol (b1) are included in a ratio of 20% or more based on the total weight of polybasic acid (a) and polyhydric alcohol (b); (C) a crosslinking agent; and (D) a photopolymerization initiator; and a method of forming a coating film using the coating composition.
    Type: Application
    Filed: February 18, 2003
    Publication date: June 30, 2005
    Applicant: Kansai Paint co., Ltd.
    Inventors: Kazutoshi Sugiura, Kazuhiro Masuda, Hiromi Katoh, Kenichi Nagai, Yoshizumi Matsuno
  • Publication number: 20050079341
    Abstract: The present invention provides a protective layer transfer sheet, which has excellent folding resistance, plasticizer resistance, scratch resistance, transparency, layer transferability and other properties, and a print using the same. The protective layer transfer sheet comprises: a substrate sheet; and a thermally transferable resin layer provided separably on at least a part of one side of the substrate sheet. The thermally transferable resin layer comprises at least a thermally transferable protective layer and a heat-sensitive adhesive resin layer stacked in that order from the substrate sheet side. The thermally transferable protective layer comprises a layer comprising submicron particles of a layered inorganic material dispersed in a binder resin. The print is formed using the thermally transferable protective layer.
    Type: Application
    Filed: September 21, 2004
    Publication date: April 14, 2005
    Inventors: Kazuhiro Masuda, Makoto Hashiba
  • Publication number: 20050079366
    Abstract: The present invention provides a method of forming a coating film on a substrate comprising the steps of: (i) coating the substrate with a thermosetting and photocurable coating composition to form a wet coating film, (ii) heating the wet coating film to semicure the coating film, and (iii) irradiating the semicured coating film with light to cure the coating film.
    Type: Application
    Filed: January 20, 2003
    Publication date: April 14, 2005
    Applicant: Kansai Paint Co., Ltd.
    Inventors: Kenji Seko, Kazuhiro Masuda, Yoshizumi Matsuno
  • Publication number: 20050064155
    Abstract: The present invention provides a protective layer thermal transfer sheet in which: a protective layer having a thermal transferring property is placed on at least one portion of one of the faces of a substrate sheet and the protective layer is formed by successively laminating at least a peeling layer, a plasticizer resistant layer and a heat adhesive resin layer on the substrate sheet, and in this structure, the heat adhesive resin layer is made from a polyester-urethane resin; and a printed article with the protective layer transferred thereto.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 24, 2005
    Inventors: Kazuhiro Masuda, Masahiro Yuki, Makoto Hashiba, Kazutoshi Awano
  • Publication number: 20050001326
    Abstract: A method of manufacturing a semiconductor device having a connection terminal and a substrate on which a circuit section and an electrode are stacked in this order, the circuit section having a multilayer interconnect structure, the electrode being conductively connected to the circuit section, and the connection terminal penetrating the substrate and being conductively connected to the electrode. Part of the connection terminal is formed simultaneously with an interconnect in an interconnect layer of the circuit section.
    Type: Application
    Filed: May 3, 2004
    Publication date: January 6, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Kazuhiro Masuda
  • Publication number: 20040251554
    Abstract: A semiconductor device includes a semiconductor device body section having a substrate and an electrode formed on the substrate. A through-hole is formed through the electrode and the substrate in a stacking direction of the electrode and the substrate, and a conductive member is inserted into the through-hole. An insulating material which faces at least the through-hole is formed on the electrode. The conductive member is formed over the insulating material from the through-hole and is connected with the electrode.
    Type: Application
    Filed: March 15, 2004
    Publication date: December 16, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Kazuhiro Masuda
  • Patent number: 6818995
    Abstract: A Cu wiring member containing Cu as the main component is embedded in an interlayer dielectric film among multiple wiring layers accompanied with a coating of a barrier metal and an upper diffusion barrier layer formed thereon. The interlayer dielectric film is composed of a first dielectric film that forms a major part thereof and a second dielectric film that is provided adjacent to the first dielectric film and forms side walls of the Cu wiring member. The first dielectric film and the second dielectric film have mutually different etching selection ratios. When a wiring layer in an upper layer is connected to the Cu wiring member through the via hole VH formed in the first dielectric film by etching, a substantial matching margin can be expected.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: November 16, 2004
    Assignee: Seiko Epson Corporation
    Inventor: Kazuhiro Masuda
  • Publication number: 20040207089
    Abstract: A semiconductor device has a substrate and an electrode layer formed on the substrate, and the electrode layer includes a plurality of conductive layers and an insulating layer which are stacked, the insulating layer being interposed between two of the conductive layers adjacent each other, a through-hole being formed in each of the conductive layers lower than an uppermost conductive layer among the conductive layers, and the through-hole being filled with an insulating material.
    Type: Application
    Filed: March 15, 2004
    Publication date: October 21, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Kazuhiro Masuda
  • Patent number: 6803936
    Abstract: An image formation method and a thermal transfer sheet for use in the image formation method are provided. According to the image formation method and the thermal transfer sheet, an intermediate transfer recording medium comprising a substrate film and a transfer part, comprising at least a receptive layer, provided separably on the substrate film is used, and, at the time of the transfer of the transfer part in the intermediate transfer recording medium onto an object, the transfer of the transfer part onto the object in its nontransfer region, onto which the transfer part should not be transferred, can be avoided without installing any special ancillary tool on an image forming apparatus. In the method for image formation, a thermal transfer sheet comprising a substrate and at least a peel-off layer provided on the substrate is provided.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: October 12, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Kenji Sakamoto, Katsuyuki Oshima, Tatsuya Kita, Kazuhiro Masuda
  • Publication number: 20030178640
    Abstract: A Cu wiring member containing Cu as the main component is embedded in an interlayer dielectric film among multiple wiring layers accompanied with a coating of a barrier metal and an upper diffusion barrier layer formed thereon. The interlayer dielectric film is composed of a first dielectric film that forms a major part thereof and a second dielectric film that is provided adjacent to the first dielectric film and forms side walls of the Cu wiring member. The first dielectric film and the second dielectric film have mutually different etching selection ratios. When a wiring layer in an upper layer is connected to the Cu wiring member through the via hole VH formed in the first dielectric film by etching, a substantial matching margin can be expected.
    Type: Application
    Filed: January 16, 2003
    Publication date: September 25, 2003
    Inventor: Kazuhiro Masuda
  • Publication number: 20030174197
    Abstract: An image formation method and a thermal transfer sheet for use in the image formation method are provided. According to the image formation method and the thermal transfer sheet, an intermediate transfer recording medium comprising a substrate film and a transfer part, comprising at least a receptive layer, provided separably on the substrate film is used, and, at the time of the transfer of the transfer part in the intermediate transfer recording medium onto an object, the transfer of the transfer part onto the object in its nontransfer region, onto which the transfer part should not be transferred, can be avoided without installing any special ancillary tool on an image forming apparatus. In the method for image formation, a thermal transfer sheet comprising a substrate and at least a peel-off layer provided on the substrate is provided.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 18, 2003
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Tsuaki Odaka, Kenji Sakamoto, Katsuyuki Oshima, Tatsuya Kita, Kazuhiro Masuda
  • Patent number: 3954511
    Abstract: Surface treatment of weather-resistant steel by applying a liquid composition comprising 5 to 50% of Fe.sub.3 O.sub.4 + Fe.sub.2 O.sub.3, 0.01 to 5% of phosphoric acid, 0.01 to 10% of at least one selected from the consisting of Pb, Ni, Cu, P, Zn, Cr and their compounds, 3 to 30% of butyral resin, the balance being solvent by spraying or brushing. The surface treatment is effective for preventing the occurence of the initial rust formation of the steel and promoting a stable and dense protective rust against subsequent corrosion of the steel.
    Type: Grant
    Filed: November 7, 1974
    Date of Patent: May 4, 1976
    Assignee: Nippon Steel Corporation
    Inventors: Satoshi Kado, Tsuneyasu Watanabe, Kazuhiro Masuda