Patents by Inventor Kazuhiro Matsushita

Kazuhiro Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945923
    Abstract: Disclosed is a method for producing an electrolytic capacitor, the method including the steps of preparing an anode foil that includes a dielectric layer, a cathode foil, and a fiber structure; preparing a conductive polymer dispersion liquid that contains a conductive polymer component and a dispersion medium; producing a separator by applying the conductive polymer dispersion liquid to the fiber structure and then removing at least a portion of the dispersion medium; and producing a capacitor element by sequentially stacking the anode foil, the separator, and the cathode foil. The dispersion medium contains water. The fiber structure contains a synthetic fiber in an amount of 50 mass % or more. The fiber structure has a density of 0.2 g/cm3 or more and less than 0.45 g/cm3.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: April 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Daisuke Kubo, Hiroyuki Arima, Tomoyuki Tashiro, Kazuhiro Takatani, Kenta Chashiro, Shumpei Matsushita
  • Patent number: 11912989
    Abstract: An objective of the present invention is to provide target tissue-specific antigen-binding molecules, antigen-binding molecules whose antigen-binding activity varies depending on the concentration of an unnatural compound, libraries comprising a plurality of the antigen-binding molecules which are different from one another, pharmaceutical compositions comprising the antigen-binding molecules, methods of screening for the antigen-binding molecules, and methods for producing the antigen-binding molecules. The present inventors created antigen-binding domains whose antigen-binding activity varies depending on the concentration of a small molecule compound or antigen-binding molecules containing an antigen-binding domain, and libraries comprising a plurality of the antigen-binding domains which are different from one another or antigen-binding domains, and demonstrated that the above-noted objective could be achieved by using the libraries.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: February 27, 2024
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Tomoyuki Igawa, Shigero Tamba, Shun Shimizu, Kanako Tatsumi, Shojiro Kadono, Hiroki Kawauchi, Kazuhiro Ohara, Masayuki Matsushita, Takashi Emura, Masaki Kamimura
  • Publication number: 20230210257
    Abstract: A music score plate support structure for a musical instrument, includes: a music score plate; and a support mechanism portion configured to movably support the music score plate with respect to a front plate of a main body of the musical instrument. The support mechanism portion includes: a connecting portion, a first pivot portion connecting the connecting portion and the front plate of the main body to each other so as to be pivotable relative to each other, and a second pivot portion connecting the connecting portion and the music score plate to each other so as to be pivotable relative to each other.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 6, 2023
    Inventor: Kazuhiro MATSUSHITA
  • Patent number: 10203048
    Abstract: An automatic drain discharge utilizing a vertically movable float to activate a diaphragm of a pilot valve to drive a drain plug. The inner diameter at the bottom of a case is gradually decreased from upper to lower positions. A bottom surface of a communication hole of a drain housing provided in an opening of the case has an inclined surface inclined toward a drain discharge hole. An outer marginal portion which is positioned at the uppermost position in the bottom surface of the communication hole is in the same plane as or lower than a marginal portion which is positioned at the lowermost position in an inner circumferential surface of the case and adjacent to the opening.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 12, 2019
    Assignee: SMC CORPORATION
    Inventor: Kazuhiro Matsushita
  • Publication number: 20180045326
    Abstract: The inner diameter at the bottom of a case is gradually decreased from upper to lower positions. A bottom surface of a communication hole of a drain housing provided in an opening of the case has an inclined surface inclined toward a drain discharge hole. An outer marginal portion which is positioned at the uppermost position in the bottom surface of the communication hole is in the same plane as or lower than a marginal portion which is positioned at the lowermost position in an inner circumferential surface of the case and adjacent to the opening.
    Type: Application
    Filed: July 31, 2017
    Publication date: February 15, 2018
    Applicant: SMC CORPORATION
    Inventor: Kazuhiro MATSUSHITA
  • Patent number: 9334975
    Abstract: A flow-through condition of a pressure fluid between first through third ports formed in a body of a residual pressure release valve is switched by a valve plug of a valve mechanism. Between an operating unit for driving the valve mechanism and the body, a converter is disposed for converting rotational movement of the operating unit into linear movement and transferring the linear movement to the valve plug. The converter includes a cylindrical shaped cam ring including a pin inserted through the valve plug, and inclined grooves for guiding the pin. The cam ring includes two divided bodies separable from each other in a radial direction.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: May 10, 2016
    Assignee: SMC KABUSHIKI KAISHA
    Inventors: Masayuki Okitsu, Kazuhiro Matsushita
  • Patent number: 8888932
    Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 18, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Patent number: 8845826
    Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: September 30, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20140224355
    Abstract: A flow-through condition of a pressure fluid between first through third ports formed in a body of a residual pressure release valve is switched by a valve plug of a valve mechanism. Between an operating unit for driving the valve mechanism and the body, a converter is disposed for converting rotational movement of the operating unit into linear movement and transferring the linear movement to the valve plug. The converter includes a cylindrical shaped cam ring including a pin inserted through the valve plug, and inclined grooves for guiding the pin. The cam ring includes two divided bodies separable from each other in a radial direction.
    Type: Application
    Filed: September 4, 2012
    Publication date: August 14, 2014
    Applicant: SMC KABUSHIKI KAISHA
    Inventors: Masayuki Okitsu, Kazuhiro Matsushita
  • Patent number: 8082012
    Abstract: The present invention provides a semiconductor integrated circuit device and a non-contact type IC card and a portable information terminal which uses the semiconductor integrated circuit device. The semiconductor integrated circuit device includes antenna terminals LA, LB which are connected to an antenna L1, a power source circuit B5 which has a rectifier/smoothing circuit B1 which obtains a DC voltage by rectifying and smoothing an AC signal which is supplied to the antenna terminal from the antenna and a shunt regulator B6 and a series regulator B7 which stabilize the DC voltage, and an internal circuit B8 which is operated upon the supply of the DC voltage from the power source circuit. The series regulator operates and the shunt regulator stops in a stage that a signal is transmitted to a reader/writer. The shunt regulator operates and the series regulator stops in a stage other than the stage that the signal is transmitted to the reader/writer.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: December 20, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuki Watanabe, Kazuhiro Matsushita, Masaru Kubota
  • Publication number: 20100307823
    Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
    Type: Application
    Filed: July 17, 2008
    Publication date: December 9, 2010
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Patent number: D700286
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: February 25, 2014
    Assignee: SMC Corporation
    Inventors: Masayuki Okitsu, Kazuhiro Matsushita
  • Patent number: D704582
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: May 13, 2014
    Assignee: Shimadzu Corporation
    Inventors: Hiroshi Muraoka, Kazuhiro Matsushita
  • Patent number: D849195
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: May 21, 2019
    Assignee: SMC CORPORATION
    Inventor: Kazuhiro Matsushita
  • Patent number: D851213
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: June 11, 2019
    Assignee: SMC CORPORATION
    Inventor: Kazuhiro Matsushita
  • Patent number: D924361
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: July 6, 2021
    Assignee: SMC CORPORATION
    Inventors: Kazuhiro Matsushita, Tomokazu Ueno
  • Patent number: D926933
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: August 3, 2021
    Assignee: SMC CORPORATION
    Inventors: Kazuhiro Matsushita, Tomokazu Ueno
  • Patent number: D926934
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: August 3, 2021
    Assignee: SMC CORPORATION
    Inventors: Kazuhiro Matsushita, Tomokazu Ueno
  • Patent number: D926935
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: August 3, 2021
    Assignee: SMC CORPORATION
    Inventors: Kazuhiro Matsushita, Tomokazu Ueno
  • Patent number: D927646
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: August 10, 2021
    Assignee: SMC CORPORATION
    Inventors: Kazuhiro Matsushita, Tomokazu Ueno