Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 32 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

Abstract: In a displacement amplification mechanism for a piezoelectric element comprising a pair of lever arms for transmitting and amplifying the displacement of the piezoelectric element, and a bridge-shaped beam member held at ends of the lever arms with rivets and working as a further means for amplifying the displacement of the piezoelectric element, a semi-elliptical rib is formed in a central flat portion of the beam member to thereby increse the rigidity in the central flat portion.

Abstract: In a mechanical amplification mechanism for piezoelectric elements, a pair of lever arms, base block and a pair of fulcrum portions connecting therebetween are structured with a lamination of thin metal plates of a predetermined number. Each of thin metal plate has the thickness smaller than the width of the fulcrum portions and they are laminated such that the total thickness is larger than the width of the fulcrum portions. The lamination strength of thin metal sheets is improved by either caulking predetermined positions or inserting a bonding material between every thin metal plates.