Patents by Inventor Kazuhiro Minegishi
Kazuhiro Minegishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11833620Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: GrantFiled: January 16, 2019Date of Patent: December 5, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Yutaka Hashimoto, Kazuyori Takagi, Tomoko Nagai, Nanako Miyagi, Kazuya Kitazawa, Akiko Takaki, Kazuhiro Minegishi, Teppei Otsuki, Rina Horikoshi, Ryuichi Tsuda, Hiroyoshi Kawasaki, Masato Shiratori
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Patent number: 11826860Abstract: A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.Type: GrantFiled: February 17, 2021Date of Patent: November 28, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Kazuhiro Minegishi, Yuji Kawamata
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Publication number: 20230113712Abstract: A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.Type: ApplicationFiled: February 17, 2021Publication date: April 13, 2023Inventors: Hiroyoshi KAWASAKI, Masato SHIRATORI, Kazuhiro MINEGISHI, Yuki KAWAMATA
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Publication number: 20230089879Abstract: A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced, temperature cycle reliability is excellent, and scattering due to heating during reflow can be suppressed.Type: ApplicationFiled: February 17, 2021Publication date: March 23, 2023Inventors: Hiroyoshi KAWASAKI, Masato SHIRATORI, Kazuhiro MINEGISHI, Yuji KAWAMATA
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Patent number: 10987764Abstract: It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.Type: GrantFiled: October 11, 2018Date of Patent: April 27, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Ko Inaba, Hiroaki Kawamata, Kazuhiro Minegishi
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Publication number: 20210060715Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: ApplicationFiled: January 16, 2019Publication date: March 4, 2021Inventors: Yutaka HASHIMOTO, Kazuyori TAKAGI, Tomoko NAGAI, Nanako MIYAGI, Kazuya KITAZAWA, Akiko TAKAKI, Kazuhiro MINEGISHI, Teppei OTSUKI, Rina HORIKOSHI, Ryuichi TSUDA, Hiroyoshi KAWASAKI, Masato SHIRATORI
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Publication number: 20210031311Abstract: It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.Type: ApplicationFiled: October 11, 2018Publication date: February 4, 2021Applicant: Senju Metal Industry Co., Ltd.Inventors: Hiroyoshi KAWASAKI, Masato SHIRATORI, Ko INABA, Hiroaki KAWAMATA, Kazuhiro MINEGISHI
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Publication number: 20170355042Abstract: The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a glycol-ether-based solvent, an organic acid, and a thixotropic agent, wherein the solvent is a glycol-based solvent having a low boiling point that is not more than 200 degrees C., content of the solvent having the low boiling point is not less than 20 weight % to not more than 40 weight %. The solder paste is obtained by mixing this flux with solder alloy powder. When the solvent having a high boiling point that is more than 200 degrees C. is further contained, the solvent having the low boiling point of not less than 60 weight % in relation to the whole of the solvent is contained.Type: ApplicationFiled: December 21, 2015Publication date: December 14, 2017Inventors: Mamoru Kakuishi, Kazuhiro Minegishi