Patents by Inventor Kazuhiro Miura

Kazuhiro Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5662755
    Abstract: A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: September 2, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura, Akihiko Miyoshi
  • Patent number: 5547530
    Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: August 20, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Nakamura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Kazuhiro Miura
  • Patent number: 5525402
    Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
    Type: Grant
    Filed: February 24, 1995
    Date of Patent: June 11, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Nakamura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Kazuhiro Miura
  • Patent number: 5503777
    Abstract: A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: April 2, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minehiro Itagaki, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano
  • Patent number: 5496619
    Abstract: Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: March 5, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minehiro Itagaki, Kazuyuki Okano, Suzushi Kimura, Seiichi Nakatani, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura
  • Patent number: 5407473
    Abstract: Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.
    Type: Grant
    Filed: December 29, 1993
    Date of Patent: April 18, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura, Akihiko Miyoshi
  • Patent number: 5370759
    Abstract: A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material.
    Type: Grant
    Filed: May 14, 1993
    Date of Patent: December 6, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiko Hakotani, Seiichi Nakatani, Tsuneharu Katada, Satoru Yuhaku, Kazuhiro Miura, Yoshifumi Nakamura
  • Patent number: 5227113
    Abstract: A process for the high speed production of fiber reinforced plastic moldings forms several preforms which are solidified with chopped fibers, resin powders and a binder and are held between two preheating plates. Each plate is formed of a thin metal plate and will preheat the preforms to a temperature higher than the melting point of the resin. While the preforms are held between the preheating plates, the preforms are cold-pressed in a mold maintained at a temperature lower than the melting point of the resin for simultaneous impregnation and cooling of the resin. In addition, a preforming mold is placed in a vacuum chamber and precut chopped fibers are positioned in a tank. The preforming mold is placed into the tank and an exhauster is actuated to vacuumize both the vacuum chamber and the preforming mold, thereby adsorbing the chopped fibers in the tank onto the preforming mold and forming on the surface of the preforming mold an unsolidified preform comprising the chopped fibers.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: July 13, 1993
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Kenji Hamabe, Tomohiro Sakuraba, Hiroshi Kiyomoto, Kazuhiro Miura, Masato Ishibashi, Keiichi Satoh, Masataka Kumata