Abstract: Above a substrate holder 1, an ordinary fluid jet nozzle 2 which is capable of injecting drops of a solution having ordinary particle diameters, a fine fluid jet nozzle 3 which is capable of injecting drops of a solution having fine particle diameters which are smaller than the ordinary particle diameters, and a regular reflection laser displacement gauge 4 are disposed. These are attached on the same plate, thereby forming a head 10. The head 10 freely moves in directions X, Y and Z, as an X-axis drive portion 41, Y-axis drive portions 42 and 43 and a Z-axis drive portion 44 operate in accordance with operation commands received from a controller 50 which controls the apparatus as a whole. It is therefore possible to set the head 10 to a predetermined position on a substrate S which is held by the substrate holder 1. Thus, the respective nozzles supply the solutions to any desired positions the substrate S.

Abstract: A high-speed production method of a printed circuit board comprising the steps of, melting and jet-spraying a solid ink on an insulating substrate to be patterned, leaving portions corresponding to an image part unsprayed, coating a side of the insulating substrate patterned with a conductive layer, and removing solid ink portions by solving, wherein the solid ink comprises a wax as a main component, and wherein the melted solid ink is jet-sprayed for patterning in accordance with data from a computer.

Abstract: An ultrafine fluid jet apparatus comprising a substrate arranged near a distal end of an ultrafine-diameter nozzle to which a solution is supplied, and an optional-waveform voltage is applied to the solution in the nozzle to eject an ultrafine-diameter fluid droplet onto a surface of the substrate; wherein an electric field intensity near the distal end of the nozzle according to a diameter reduction of the nozzle is sufficiently larger than an electric field acting between the nozzle and the substrate; and wherein Maxwell stress and an electro-wetting effect being utilized, a conductance is decreased by a reduction in the nozzle diameter or the like, and controllability of an ejection rate by a voltage is improved; and wherein landing accuracy is exponentially improved by moderation of evaporation by a charged droplet and acceleration of the droplet by an electric field.

Abstract: An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.

Abstract: An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.

Abstract: A power assisted, manually operated vehicle wherein the amount of energy required for the assist is reduced and the riders sensation is improved by continuing the application of power during times when manual power is still being exerted but no manual power is transmitted to the propulsion device because of the geometry of the transmission system so that the cyclic variations and amplitude of the power assist are reduced.

Abstract: An object of the present invention is to provide an apparatus and method for determining a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes the steps of: measuring an actual size of the bonding portion of the circuit electrode at the first temperature; comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature; and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.

Abstract: A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 &mgr;m to 100 &mgr;m and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.

Abstract: An electronic parts mounting apparatus for divisionally recognizing an electronic part (2) even when the apparatus is arranged in such that the relative positional relation between a recognition camera (4) and a nozzle (1) cannot be varied. The electronic part (2) is vacuum-clamped by a nozzle (1), the posture of the nozzle (1) or the posture of the electronic part (2) is changed a plurality of times by a rotary driving member (3), and a part of the electronic part (2) imaged by the recognition camera (4) every time the posture of the electronic part (2) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part (2) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

Abstract: The invention provides an electronic parts mounting machine and an electronic parts packaging method wherein even when a system does not include driving means, such as an XY robot, for driving a mounting head, there is no possibility of causing a decrease in measurement accuracy or a need to allocate a larger space for the installation and movement of a test unit of a lead misalignment tester. When a lead misalignment test is conducted on each lead of an electronic part, a suction nozzle is rotated and, at the same time, the test unit is moved such that the test point of the test unit scans each lead of the electronic part sucked by the suction nozzle while said test point crosses said lead.