Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.

Abstract: A motor-driven compressor includes an inverter device. The inverter device includes a common mode choke coil. The common mode choke coil includes an annular core, two windings wound around the core, and an annular conductor that covers the two windings. The conductor is divided into a first metal plate and a second metal plate, which are combined to form an annular shape such that induced current flows in a circumferential direction of the conductor so as to hinder changes in leakage magnetic flux from the core. The second metal plate is thermally connected to the housing. The first metal plate is thermally connected to the second metal plate. At least one of an electrical resistance value or a thermal resistance value in a current path of the induced current is lower in the second metal plate than in the first metal plate.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: The present invention provides a compound having a dihydropyran structure, a method of producing a compound having a dihydropyran structure, a method of producing Pre-SMTP, a method of producing a group of SMTPs, and a pharmaceutical composition. The compound having a dihydropyran structure can be a useful intermediate in the chemically producing a group of Pre-SMTP and SMTP. Specifically, the compound having a dihydropyran structure is represented by the following formula (1), wherein: R3Si is a silyl group selected from TMS: trimethylsilyl, TES: triethysilyl, TBS (TBDMS): tert-butyldimethylsil, TIPS: triisopropylsilyl, TBDPS: tert-butyldiphenylsilyl, X is selected from COOH, CHO, and —CH?C(CH3)—(CH2)2—CH?C(CH3)2.

Abstract: According to one aspect, a balloon-equipped treatment tool for an endoscope includes a balloon, and a sheath connected to a proximal end side of the balloon and configured to introduce fluid to the balloon. The balloon includes a body portion having a first wall thickness, a cylindrical tail portion arranged on a proximal end side of the body portion and connected to the sheath, a cone portion located between the body portion and the tail portion, and a thick portion forming a second wall thickness larger than the first wall thickness. The thick portion whose distal end is arranged in the cone portion and whose proximal end is arranged in the tail portion.

Abstract: The present invention provides a compound having a dihydropyran structure, a method of producing a compound having a dihydropyran structure, a method of producing Pre-SMTP, a method of producing a group of SMTPs, and a pharmaceutical composition. The compound having a dihydropyran structure can be a useful intermediate in the chemically producing a group of Pre-SMTP and SMTP. Specifically, the compound having a dihydropyran structure is represented by formula (1), wherein: R3Si is a silyl group selected from TMS: trimethylsilyl, TES: triethysilyl, TBS (TBDMS): tert-butyldimethylsil, TIPS: triisopropylsilyl, TBDPS: tert-butyldiphenylsilyl, X is selected from COOH, CHO, and —CH?C(HCH3)—(CH2)2—CH?C(CH3)2.

Abstract: A microwave reduction furnace including a reaction furnace provided with a refractory chamber of silica or silicon carbide for storing a material therein, a supply section for supplying the material into the refractory chamber, the material being a mixture of a silica powder and a graphite powder or a mixture of a silica powder, a silicon carbide powder and a graphite powder, a discharge section for discharging molten silicon, obtained through reduction, out of the chamber, and a microwave oscillator for outputting microwave toward the refractory chamber in the reaction furnace with a degree of directionality by virtue of a helical antenna or a waveguide.

Abstract: The present invention addresses the problem of providing a heating furnace that sufficiently exhibits the microwave effect produced by microwave heating and allows economical heating taking advantage of the characteristics of each heating method. The provided microwave composite heating furnace (1) is equipped with: a housing (10); a heating container (11) for accommodating and heating an object to be heated; a heating means (12) for heating the heating container (11) from the outside; a microwave irradiation device (13); a to-be-heated object supplying device (14) that supplies the object to be heated to the inside of the heating container (11); a gas introducing means (15) for introducing gas into the heating container (11); and a gas recovery means (16) for recovering the gas generated when heating the object to be heated.

Abstract: A microwave reduction furnace including a reaction furnace provided with a refractory chamber of silica or silicon carbide for storing a material therein, a supply section for supplying the material into the refractory chamber, the material being a mixture of a silica powder and a graphite powder or a mixture of a silica powder, a silicon carbide powder and a graphite powder, a discharge section for discharging molten silicon, obtained through reduction, out of the chamber, and a microwave oscillator for outputting microwave toward the refractory chamber in the reaction furnace with a degree of directionality by virtue of a helical antenna or a waveguide.

Abstract: A method for producing silicon using microwave and a microwave reduction furnace for use therewith are disclosed, with which it is possible to quickly reduce silica to quickly produce silicon. A material of a mixture of a silica powder and a graphite powder of a mixture of a silica powder, a silicon carbide powder and a graphite powder is set in a refractory chamber. Then, the material set in the chamber is irradiated with microwave. The graphite powder absorbs a microwave energy to increase the temperature, after which silica and graphite react with each other to further increase the temperature while producing silicon carbide, and the heated silica and silicon carbide react with each other. SiO produced through this reaction and silicon carbide are allowed to react with each other, thereby producing high-purity silicon.

Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.

Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.

Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.

Abstract: Certain embodiments provide a camera module including a blur correcting lens, a lens holder, a solid state imaging chip, and a distortion correction processing chip. The lens holder is arranged on a mounting substrate and includes the blur correcting lens inside the lens holder. The solid state imaging chip is arranged on the mounting substrate so as to be covered by the lens holder, and includes a logic circuit and a pixel unit having a plurality of pixels. The distortion correction processing chip is arranged on the mounting substrate inside the lens holder, and corrects an image signal output from the solid state imaging chip to correct distortion of the image formed by the image signal.

Abstract: According to one embodiment, a solid state imaging device has a color mixture correction circuit. The color mixture correction circuit is provided with an adjustment circuit. The adjustment circuit adjusts a relationship between a signal level and a wavelength of light of each color component from an image sensor based on a first correction coefficient. The first correction coefficient is a correction coefficient for color mixture correction. A second correction coefficient is a correction coefficient corresponding to a sensitivity difference among color pixels. The adjustment circuit adjusts the signal level of each of the color components based on the second correction coefficient, which has been read according to a distance from center of an image.

Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.

Abstract: According to one embodiment, an image stabilizer includes a lens drive controller. The lens drive controller performs a first control and a second control. The lens drive controller controls the driving of a correction lens according to the amount of shake in the first control. In the second control, the lens drive controller controls the driving of the correction lens so that a first area is in focus and a second area is not in focus.

Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.