Patents by Inventor Kazuhiro Nakajima
Kazuhiro Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240003762Abstract: A functional film includes a strain resistance film provided on one principal surface of a flexible insulating base. The strain resistance film is a chromium nitride thin-film having a thickness of 150 nm or less. In an X-ray diffraction chart with a CuK? ray as an X-ray source, the strain resistance film has an intensity ratio I2/I1 of 0.001 or more, where the intensity ratio I2/I1 is a ratio of the intensity I2 of the second peak in a range in which 2? is 60° to 65° to the intensity I1 of the first peak in a range in which 2? is 43° to 45°. The strain resistance film is less liable to crack due to bending, and has a high gauge factor. The functional film is suitably used for a strain sensor.Type: ApplicationFiled: October 25, 2021Publication date: January 4, 2024Inventors: Satoshi YASUI, Katsunori SHIBUYA, Kazuhiro NAKAJIMA
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Publication number: 20230408244Abstract: A laminated film includes an insulating substrate resin film and a resistance layer in order in a thickness direction. The resistance layer includes chromium nitride. A temperature coefficient of resistance of the resistance layer is ?400 ppm/° C. or more and ?200 ppm/° C. or less.Type: ApplicationFiled: October 28, 2021Publication date: December 21, 2023Inventors: Toshimasa NISHIMORI, Kazuhiro NAKAJIMA, Tomotake NASHIKI, Eiji NIWA
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Publication number: 20220404213Abstract: A conductive film (102) includes: a resin film base (50) having a hard coat layer (6) on one main surface of a resin film (5); an underlying layer (20) on a hard coat layer-formed surface of the resin film base; and a metal thin film (10) on the underlying layer. The underlying layer includes at least one layer of inorganic dielectric thin film. The hard coat layer contains first fine particles having an average primary particle diameter of 10 to 100 nm. In a cross section of the hard coat layer, the proportion of an area occupied by the first fine particles is preferably 10% or more.Type: ApplicationFiled: September 16, 2020Publication date: December 22, 2022Applicant: NITTO DENKO CORPORATIONInventors: Kazuhiro Nakajima, Tomotake Nashiki, Kodai Miyamoto
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Publication number: 20220390290Abstract: An electroconductive film (101) comprises a metal thin-film (10) on a first main surface of a flexible substrate (40) that includes a resin film (5). The thickness of the flexible substrate is 1 mm or less. The absolute value [H2?H1] of the difference between the heating dimensional change rate H1 of the electroconductive film and the heating dimensional change rate H2 of a film obtained by removing the metal thin-film from the electroconductive film is preferably 0.10% or less. There is a tendency that undulation of a temperature sensor film after patterning of the metal thin-film is further suppressed as the value of [H2?H1] decreases.Type: ApplicationFiled: September 16, 2020Publication date: December 8, 2022Applicant: NITTO DENKO CORPORATIONInventors: Satoshi Yasui, Kazuhiro Nakajima, Kodai Miyamoto
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Publication number: 20220364937Abstract: Provided is an electroconductive film having a metal thin-film on a resin film base; and a temperature sensor film which is obtained by patterning the metal thin-film on the resin film base. An electroconductive film (101) which is used for the production of a temperature sensor film comprises a metal thin-film (10) on one principal surface of a resin film base (50), with a chromium oxide thin-film (21) serving as an underlying layer interposed therebetween. A temperature sensor film is obtained by patterning the metal thin-film so as to form a thermometric resistor part and a lead part that is connected to the thermometric resistor part.Type: ApplicationFiled: September 16, 2020Publication date: November 17, 2022Applicant: NITTO DENKO CORPORATIONInventors: Katsunori Shibuya, Kazuhiro Nakajima, Kodai Miyamoto
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Patent number: 10919214Abstract: A manufacturing method of a structure includes, in this order: providing a layer constituted by a support member and a modeling layer by bringing a regulating surface of a regulating member into contact with the modeling layer provided on a surface of an intermediate transfer member, pouring a material for the support member which becomes the support member to fill the periphery of the modeling layer while the regulating surface abutting the modeling layer, and solidifying the material for the support member; removing the regulating member from the layer constituted by the support member and the modeling layer.Type: GrantFiled: August 21, 2017Date of Patent: February 16, 2021Assignee: Canon Kabushiki KaishaInventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 10279546Abstract: In structural body formation, influence of misalignment between an in-process structural body layer and a support member layer on the shape accuracy is reduced. A method for manufacturing a structural body includes: forming a model forming layer from a liquid model forming material on an existing surface formed of at least one of prepared model forming layer and support member; while a defining surface of a defining member defining the upper surface of the model forming layer is in contact therewith; supplying a support material to fill between the existing surface and the defining surface and solidifying the support material into a support member to form a layer of the model forming layer and the support member; removing the defining member; and providing a layer of a model forming layer and a support member on the surface of the layer exposed by removal of the defining member.Type: GrantFiled: June 16, 2014Date of Patent: May 7, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9910545Abstract: The transparent conductive film of the present invention is a transparent conductive film, comprising: a transparent film substrate; a patterned transparent conductive layer formed on one side of the transparent film substrate; and a colored layer provided on at least one of an opposite side of the transparent conductive layer from the transparent film substrate and an opposite side of the transparent film substrate from the transparent conductive layer, wherein the colored layer has an average absorptance of from 35% to 90% for light in the wavelength range of from 380 nm to 780 nm.Type: GrantFiled: July 15, 2009Date of Patent: March 6, 2018Assignee: NITTO DENKO CORPORATIONInventors: Kazuhiro Nakajima, Tomotake Nashiki, Hideo Sugawara
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Publication number: 20170341298Abstract: A manufacturing method of a structure includes, in this order: providing a layer constituted by a support member and a modeling layer by bringing a regulating surface of a regulating member into contact with the modeling layer provided on a surface of an intermediate transfer member, pouring a material for the support member which becomes the support member to fill the periphery of the modeling layer while the regulating surface abutting the modeling layer, and solidifying the material for the support member; removing the regulating member from the layer constituted by the support member and the modeling layer.Type: ApplicationFiled: August 21, 2017Publication date: November 30, 2017Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9770870Abstract: A manufacturing method of a structure includes, in this order: providing a layer constituted by a support member and a modeling layer by bringing a regulating surface of a regulating member into contact with the modeling layer provided on a surface of an intermediate transfer member, pouring a material for the support member which becomes the support member to fill the periphery of the modeling layer while the regulating surface abutting the modeling layer, and solidifying the material for the support member; removing the regulating member from the layer constituted by the support member and the modeling layer.Type: GrantFiled: June 17, 2014Date of Patent: September 26, 2017Assignee: Canon Kabushiki KaishaInventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Publication number: 20170203510Abstract: A manufacturing method of a structure includes providing a stack of a first material layer to be a part of the structure and a restricting member wherein the first material layer is provided on a surface of the structure in the process of formation, and a part of the restricting member is provided on a surface of the first material layer in reverse of the surface of the structure in the process of formation, providing a support member between the restricting member and the surface of the structure in the process of formation, removing the restricting member, and providing a second material layer to be a part of the structure on surfaces of the first material layer and the support member exposed by removing the restricting member.Type: ApplicationFiled: March 31, 2017Publication date: July 20, 2017Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9636897Abstract: A manufacturing method of a structure includes providing a stack of a first material layer to be a part of the structure and a restricting member wherein the first material layer is provided on a surface of the structure in the process of formation, and a part of the restricting member is provided on a surface of the first material layer in reverse of the surface of the structure in the process of formation, providing a support member between the restricting member and the surface of the structure in the process of formation, removing the restricting member, and providing a second material layer to be a part of the structure on surfaces of the first material layer and the support member exposed by removing the restricting member.Type: GrantFiled: June 17, 2013Date of Patent: May 2, 2017Assignee: Canon Kabushiki KaishaInventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9604437Abstract: A method for manufacturing a structural body includes a lamination step of, while an in-process structural body is supported by a support member, laminating a plurality of times, a layer which is provided on a surface of a transfer member and which is to be formed into the structural body on the in-process structural body or at least a part of a surface formed of the in-process structural body and the support member, and in the lamination step, the support member is moved by changing the state thereof.Type: GrantFiled: December 12, 2013Date of Patent: March 28, 2017Assignee: Canon Kabushiki KaishaInventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9513747Abstract: The present invention provides a transparent conductive film in which the difference in visibility between the pattern portion and the pattern opening portion is kept small even when a transparent conductive layer is patterned. The transparent conductive film has a first dielectric layer, a second dielectric layer, and a transparent conductive layer in this order on a transparent film substrate, a thickness d21 of the first dielectric layer is larger than a thickness d22 of the second dielectric layer, the thickness d21 of the first dielectric layer is 8 to 40 nm and the thickness d22 of the second dielectric layer is 5 to 25 nm, and a difference between the thickness d21 of the first dielectric layer and the thickness d22 of the second dielectric layer, d21-d22, is 3 to 30 nm.Type: GrantFiled: October 12, 2011Date of Patent: December 6, 2016Assignee: NITTO DENKO CORPORATIONInventors: Kazuhiro Nakajima, Tomotake Nashiki, Hideo Sugawara
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Patent number: 9392685Abstract: The present invention provides a transparent conductive film in which occurrence of scratches during sliding is suppressed even when transparent conductive layer forming surfaces are so arranged as to face each other. Provided is a transparent conductive film comprising a transparent film base; at least one dielectric layer formed on a first main surface of the transparent film base; and a transparent conductive layer formed on the dielectric layer, wherein the transparent conductive layer is patterned; and the surface on the first main surface of the transparent conductive film has an arithmetical mean roughness Ra of 22 nm or more, and has 140/mm2 or more of protrusions having heights of 250 nm or higher at a pattern-opening part in which the transparent conductive layer is not formed.Type: GrantFiled: December 1, 2011Date of Patent: July 12, 2016Assignee: NITTO DENKO CORPORATIONInventors: Kazuhiro Nakajima, Tomotake Nashiki, Hideo Sugawara
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Publication number: 20160121552Abstract: In structural body formation, influence of misalignment between an in-process structural body layer and a support member layer on the shape accuracy is reduced. A method for manufacturing a structural body includes: forming a model forming layer from a liquid model forming material on an existing surface formed of at least one of prepared model forming layer and support member; while a defining surface of a defining member defining the upper surface of the model forming layer is in contact therewith; supplying a support material to fill between the existing surface and the defining surface and solidifying the support material into a support member to form a layer of the model forming layer and the support member; removing the defining member; and providing a layer of a model forming layer and a support member on the surface of the layer exposed by removal of the defining member.Type: ApplicationFiled: June 16, 2014Publication date: May 5, 2016Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9207482Abstract: A capacitive touch sensor laminate for use in a display panel device includes: a dielectric central substrate structure made of a transparent resin material and formed to have flat surfaces, respectively, on opposite sides thereof; a at least one-layer structured coat layer made of a transparent material, formed on each of the flat surfaces, and including at least one refractive index adjusting layer for suppressing visibility of an electrode pattern formed by the transparent electrically conductive layer; and a transparent electrically conductive layer formed on and in adjacent relation to the coat layer. The at least one-layer structured coat layers formed on respective ones of the flat surfaces are configured such that thicknesses of corresponding layers therein on respective opposite sides of the dielectric central substrate structure are set to allow the corresponding layers to become mutually symmetrical across the dielectric central substrate structure.Type: GrantFiled: November 30, 2011Date of Patent: December 8, 2015Assignee: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Kazuhiro Nakajima, Hideo Sugawara, Tsuyoshi Chiba, Hiroaki Kishioka, Mayumi Kishioka, Tomohide Banba, Masahiro Ooura
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Publication number: 20150314578Abstract: A method for manufacturing a structural body includes a lamination step of, while an in-process structural body is supported by a support member, laminating a plurality of times, a layer which is provided on a surface of a transfer member and which is to be formed into the structural body on the in-process structural body or at least a part of a surface formed of the in-process structural body and the support member, and in the lamination step, the support member is moved by changing the state thereof.Type: ApplicationFiled: December 12, 2013Publication date: November 5, 2015Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima
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Patent number: 9116380Abstract: A display panel device has a window, a touch panel laminate and a display panel. The touch panel laminate has: a transparent first substrate layer; a first transparent conductive layer laminated to the first substrate layer through a first undercoat layer; a transparent second substrate layer; and a second transparent conductive layer laminated to the second substrate layer through a second undercoat layer. The second conductive layer faces the first conductive layer through at least the first substrate layer and the first undercoat layer. The first conductive layer is closer to the window than the first substrate layer. A polarizing film layer is bonded to the window, and a ?/4 retardation film layer is disposed between the polarizing film layer and the touch panel laminate. The display panel is disposed on a side opposite to the window with respect to the touch panel laminate.Type: GrantFiled: November 29, 2011Date of Patent: August 25, 2015Assignee: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Kazuhiro Nakajima, Hideo Sugawara, Tsuyoshi Chiba, Tomohide Banba, Masahiro Ooura, Mayumi Kishioka
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Publication number: 20140374958Abstract: A manufacturing method of a structure includes, in this order: providing a layer constituted by a support member and a modeling layer by bringing a regulating surface of a regulating member into contact with the modeling layer provided on a surface of an intermediate transfer member, pouring a material for the support member which becomes the support member to fill the periphery of the modeling layer while the regulating surface abutting the modeling layer, and solidifying the material for the support member; removing the regulating member from the layer constituted by the support member and the modeling layer.Type: ApplicationFiled: June 17, 2014Publication date: December 25, 2014Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima