Abstract: There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water-resistant reliability. This resin composition includes an arylene ether compound having a weight average molecular weight of 30000 or higher and a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray.

Abstract: There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

Abstract: There is provided a resin composition including (a) an acrylic polymer having a tensile modulus of 200 MPa or less, (b) a resin that is solid at 25° C., (c) a resin that is liquid at 25° C. and crosslinkable with at least one of the component (a) or the component (b), and (d) a polymerization initiator. The content of the component (a) is 35 parts by weight or more and 93 parts by weight or less, the content of the component (b) is 3 parts by weight or more and 60 parts by weight or less, and the content of the component (c) is 1 part by weight or more and 25 parts by weight or less, based on 100 parts by weight of the total amount of the component (a), the component (b), and the component (c).