Patents by Inventor Kazuhiro Ootaka

Kazuhiro Ootaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transducer for a bonding apparatus
    Patent number: 6758383
    Abstract: A transducer for, for instance, a flip-chip bonding apparatus. The transducer has a passage that communicates between a piping attachment and a suction holding port that suction-holds an object to be processed (bonded); and in this transducer, an air pressure piping used for the suction is fastened to the piping attachment with a connecting member in between, and this connecting member made of foam styrol suppresses effects of reaction force of the air pressure piping.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: July 6, 2004
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Shinichi Nishiura, Kazuhiro Ootaka
  • Transducer for a bonding apparatus
    Publication number: 20030080173
    Abstract: A transducer for, for instance, a flip-chip bonding apparatus. The transducer has a passage that communicates between a piping attachment and a suction holding port that suction-holds an object to be processed (bonded); and in this transducer, an air pressure piping used for the suction is fastened to the piping attachment with a connecting member in between, and this connecting member made of foam styrol suppresses effects of reaction force of the air pressure piping.
    Type: Application
    Filed: October 30, 2002
    Publication date: May 1, 2003
    Applicant: Kabushiki Kaisha Shinkawa
    Inventors: Shinichi Nishiura, Kazuhiro Ootaka