Patents by Inventor Kazuhiro Otsuka
Kazuhiro Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973321Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.Type: GrantFiled: May 31, 2023Date of Patent: April 30, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Kazuhiro Sakai, Daisuke Iguchi, Takeshi Minamiru, Yoshinori Shirakawa, Tomoaki Sakita, Tsutomu Otsuka
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Patent number: 11936164Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.Type: GrantFiled: May 31, 2023Date of Patent: March 19, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Kazuhiro Sakai, Daisuke Iguchi, Takeshi Minamiru, Yoshinori Shirakawa, Tomoaki Sakita, Tsutomu Otsuka
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Patent number: 11925180Abstract: In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder.Type: GrantFiled: November 1, 2022Date of Patent: March 12, 2024Assignee: IBIDEN CO., LTD.Inventors: Katsutoshi Horino, Kozo Takada, Kazuhiro Ito, Kohei Otsuka, Kiyotaka Tsukada
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Patent number: 11475911Abstract: In communication performed among multiple participants, at least one of a participant who will start speaking next and a timing thereof is estimated. An estimation apparatus includes a head motion information generation unit that acquires head motion information representing head motions of communication participants in a time segment corresponding to an end time of an utterance segment and synchronization information for head motions between the communication participants, and an estimation unit that estimates at least one of the speaker of the next utterance segment following the utterance segment and the next utterance start timing following the utterance segment based on the head motion information and the synchronization information for the head motions between the communication participants.Type: GrantFiled: February 5, 2019Date of Patent: October 18, 2022Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Ryo Ishii, Ryuichiro Higashinaka, Junji Tomita, Shiro Kumano, Kazuhiro Otsuka
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Publication number: 20210174702Abstract: A communication skill evaluation system including: an audio input device; a measurement device; an utterance period detection unit that, based on the audio information input by the audio input device, detects an utterance period and a participant who spoke in each utterance period; a participatory role assignment unit that assigns a participatory role to each participant in accordance with whether or not each participant spoke in each utterance pair composed of two utterances obtained in chronological order from each utterance period; a feature quantity extraction unit that, based on the measurement results by the measurement device, extracts a non-verbal feature quantity for each participant, relating to the non-verbal action at the end of the utterance in each utterance period; and an estimation unit that estimates communication skill for each participant based on a combination, in each utterance period, of the participatory role and the non-verbal feature quantity.Type: ApplicationFiled: November 7, 2018Publication date: June 10, 2021Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Ryo ISHII, Ryuichiro HIGASHINAKA, Junji TOMITA, Shiro KUMANO, Kazuhiro OTSUKA
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Publication number: 20210035600Abstract: In communication performed among multiple participants, at least one of a participant who will start speaking next and a timing thereof is estimated. An estimation apparatus includes a head motion information generation unit that acquires head motion information representing head motions of communication participants in a time segment corresponding to an end time of an utterance segment and synchronization information for head motions between the communication participants, and an estimation unit that estimates at least one of the speaker of the next utterance segment following the utterance segment and the next utterance start timing following the utterance segment based on the head motion information and the synchronization information for the head motions between the communication participants.Type: ApplicationFiled: February 5, 2019Publication date: February 4, 2021Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Ryo ISHII, Ryuichiro HIGASHINAKA, Junji TOMITA, Shiro KUMANO, Kazuhiro OTSUKA
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Patent number: 9270252Abstract: A SAW device (1) has a substrate (3) configured to propagate acoustic waves; an IDT electrode (15) on a first main surface (3a) of a substrate (3); and an electrode pad (13) on the first main surface (3a) electrically connected to the IDT electrode (15). The SAW device (1) also has a terminal with a pillar-shape (column part (7z)) setted up on the electrode pad (13); a third conductive layer (39) extending from a side surface of the column part (7z); and a cover (5) forming a vibration space (S) above the IDT electrode (15) and covering the side surface of the column part (7z), and the third conductive layer (39).Type: GrantFiled: March 19, 2010Date of Patent: February 23, 2016Assignee: KYOCERA CorporationInventors: Junya Nishii, Tsuyoshi Nakai, Kazuhiro Otsuka
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Patent number: 8552622Abstract: An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess.Type: GrantFiled: June 29, 2009Date of Patent: October 8, 2013Assignee: Kyocera CorporationInventors: Daisuke Makibuchi, Kazuhiro Otsuka
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Publication number: 20120032759Abstract: A SAW device (1) has a substrate (3) configured to propagate acoustic waves; an IDT electrode (15) on a first main surface (3a) of a substrate (3); and an electrode pad (13) on the first main surface (3a) electrically connected to the IDT electrode (15). The SAW device (1) also has a terminal with a pillar-shape (column part (7z)) setted up on the electrode pad (13); a third conductive layer (39) extending from a side surface of the column part (7z); and a cover (5) forming a vibration space (S) above the IDT electrode (15) and covering the side surface of the column part (7z), and the third conductive layer (39).Type: ApplicationFiled: March 19, 2010Publication date: February 9, 2012Applicant: KYOCERA CORPORATIONInventors: Junya Nishii, Tsuyoshi Nakai, Kazuhiro Otsuka
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Publication number: 20110115339Abstract: An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess.Type: ApplicationFiled: June 29, 2009Publication date: May 19, 2011Applicant: KYOCERA CORPORATIONInventors: Daisuke Makibuchi, Kazuhiro Otsuka
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Patent number: 7579928Abstract: A surface acoustic wave device includes front stage and rear stage surface acoustic wave elements, a signal wiring connecting between the front stage and rear stage surface acoustic wave elements, a reference potential wiring connected with the rear stage surface acoustic wave element and a capacitor made of an insulator interposed between the signal wiring and the reference potential wiring. A surface acoustic wave device includes a front stage surface acoustic wave resonator, a rear stage surface acoustic wave element, a signal wiring connecting between the front stage surface acoustic wave resonator and the rear stage surface acoustic wave element, a reference potential wiring connected with the rear stage surface acoustic wave element and a capacitor made of an insulator interposed between the signal wiring and the reference potential wiring. A communication device includes the surface acoustic wave device described above, a receiver circuit or a transmitter circuit.Type: GrantFiled: March 30, 2007Date of Patent: August 25, 2009Assignee: Kyocera CorporationInventors: Kazuhiro Otsuka, Tsuyoshi Nakai, Hiroyuki Tanaka
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Publication number: 20090123612Abstract: Provided is a packaged tea beverage which has good flavor and is compositionally excellent in storage stability. The packaged tea beverage comprises a tea extract having a ratio of gallate-type catechins in non-polymer catechins of less than 50% by mass added to a tea extract liquid, and (A) 0.072 to 0.4% by mass of non-polymer catechins and (B) 21 to 150 ppm of gallic acid, wherein a ratio of gallate-type catechins in non-polymer catechins is 0 to 50% by mass and a ratio of epi-type catechins in non-polymer catechins is 30 to 60% by mass.Type: ApplicationFiled: May 8, 2007Publication date: May 14, 2009Applicant: KAO CORPORATIONInventors: Hideyuki Takatsu, Makoto Sato, Kazuhiro Otsuka
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Patent number: 7518470Abstract: A surface acoustic wave element 1 comprises a piezoelectric substrate 19, IDT electrodes 3, 4, 5 of an odd number not less than three formed along a propagation direction of surface acoustic waves that propagates on the piezoelectric substrate, wherein IDT electrodes 3, 5 of the odd number of IDT electrodes 3, 4, 5 disposed on both sides of an IDT electrode 4 that is located at the center are connected to first and second reference potential terminals 14, 15, respectively, and the first and second reference potential terminals 14 and 15 are formed asymmetrically with respect to a virtual central axis A that passes through the center of the IDT electrode 4 located at the center and provided in a direction perpendicular to the propagation direction.Type: GrantFiled: November 30, 2006Date of Patent: April 14, 2009Assignee: Kyocera CorporationInventors: Daisuke Makibuchi, Kazuhiro Otsuka, Kiyohiro Iioka
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Patent number: 7513022Abstract: A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C.Type: GrantFiled: June 1, 2006Date of Patent: April 7, 2009Assignee: Kyocera CorporationInventors: Mitsutaka Shimada, Yoshifumi Yamagata, Kazuhiro Otsuka, Masafumi Hisataka, Akira Oikawa, Michihiko Kuwahata, Masaru Yamano
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Patent number: 7504911Abstract: A plurality of IDT electrodes 2 to 7 each having a large number of electrode fingers extending in a direction perpendicular to a propagation direction of a surface acoustic wave propagating on a piezoelectric substrate 1 are arranged on the piezoelectric substrate 1 along the propagation direction, and each of the two adjacent IDT electrodes out of the plurality of IDT electrodes 2 to 7 comprises a variable pitch section and a fixed pitch section. The electrode finger pitch in the variable pitch section gradually decreases toward the boundary between the two adjacent IDT electrodes, and the minimum electrode finger pitch portion in the two variable pitch sections is on one side spaced apart from the boundary. There can be provided a surface acoustic wave apparatus having a large pass bandwidth, having a low insertion loss, and having improved flatness in a pass band.Type: GrantFiled: May 25, 2006Date of Patent: March 17, 2009Assignee: Kyocera CorporationInventors: Kazuhiro Otsuka, Daisuke Makibuchi, Tsuyoshi Nakai, Atsuomi Fukuura, Hiroyuki Tanaka, Ikuo Obara, Kiyohiro Iioka
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Patent number: 7323205Abstract: A process is described for the production of a packaged green tea beverage containing non-polymer catechins at a concentration of 0.05 to 0.5 wt. %. According to the process, an aluminosilicate which has an iron release rate of not greater than 0.8 mg/kg to a catechin-containing solution is brought into contact with a green tea mixture of a green tea extract and a concentrate of green tea extract. The present invention can provide beverages, which contain catechins at high concentration and inhibit the formation of dregs during long-term storage.Type: GrantFiled: March 3, 2006Date of Patent: January 29, 2008Assignee: Kao CorporationInventors: Kazuhiro Otsuka, Wataru Mizuno, Koji Hanaoka, Yuji Matsui, Hideyuki Takatsu
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Publication number: 20070290770Abstract: A surface acoustic wave device includes front stage and rear stage surface acoustic wave elements, a signal wiring connecting between the front stage and rear stage surface acoustic wave elements, a reference potential wiring connected with the rear stage surface acoustic wave element and a capacitor made of an insulator interposed between the signal wiring and the reference potential wiring. A surface acoustic wave device includes a front stage surface acoustic wave resonator, a rear stage surface acoustic wave element, a signal wiring connecting between the front stage surface acoustic wave resonator and the rear stage surface acoustic wave element, a reference potential wiring connected with the rear stage surface acoustic wave element and a capacitor made of an insulator interposed between the signal wiring and the reference potential wiring. A communication device includes the surface acoustic wave device described above, a receiver circuit or a transmitter circuit.Type: ApplicationFiled: March 30, 2007Publication date: December 20, 2007Applicant: Kyocera CorporationInventors: Kazuhiro Otsuka, Tsuyoshi Nakai, Hiroyuki Tanaka
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Patent number: 7253219Abstract: A functional composite material characterized by being molded by solidifying by a resin base material a martensite-phase shape memory alloy wire produced by cold drawing a shape memory alloy which changes between an austenite phase and a martensite phase via a phase transformation temperature. The material enables a smooth motion memorized in the shape memory alloy.Type: GrantFiled: March 20, 2002Date of Patent: August 7, 2007Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Ya Xu, Kazuhiro Otsuka, Nobuyuki Toyama, Byungkoog Jang, Teruo Kishi
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Publication number: 20070120626Abstract: A surface acoustic wave element 1 comprises a piezoelectric substrate 19, IDT electrodes 3, 4, 5 of an odd number not less than three formed along a propagation direction of surface acoustic waves that propagates on the piezoelectric substrate, wherein IDT electrodes 3, 5 of the odd number of IDT electrodes 3, 4, 5 disposed on both sides of an IDT electrode 4 that is located at the center are connected to first and second reference potential terminals 14, 15, respectively, and the first and second reference potential terminals 14 and 15 are formed asymmetrically with respect to a virtual central axis A that passes through the center of the IDT electrode 4 located at the center and provided in a direction perpendicular to the propagation direction.Type: ApplicationFiled: November 30, 2006Publication date: May 31, 2007Applicant: KYOCERA CORPORATIONInventors: Daisuke MAKIBUCHI, Kazuhiro Otsuka, Kiyohiro Iioka
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Publication number: 20070024397Abstract: A plurality of IDT electrodes 2 to 7 each having a large number of electrode fingers extending in a direction perpendicular to a propagation direction of a surface acoustic wave propagating on a piezoelectric substrate 1 are arranged on the piezoelectric substrate 1 along the propagation direction, and each of the two adjacent IDT electrodes out of the plurality of IDT electrodes 2 to 7 comprises a variable pitch section and a fixed pitch section. The electrode finger pitch in the variable pitch section gradually decreases toward the boundary between the two adjacent IDT electrodes, and the minimum electrode finger pitch portion in the two variable pitch sections is on one side spaced apart from the boundary. There can be provided a surface acoustic wave apparatus having a large pass bandwidth, having a low insertion loss, and having improved flatness in a pass band.Type: ApplicationFiled: May 25, 2006Publication date: February 1, 2007Inventors: Kazuhiro Otsuka, Daisuke Makibuchi, Tsuyoshi Nakai, Atsuomi Fukuura, Hiroyuki Tanaka, Ikuo Obara, Kiyohiro Iioka