Patents by Inventor Kazuhiro Sawai

Kazuhiro Sawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Piezoelectric resonator
    Patent number: 6448690
    Abstract: An energy-trap type piezoelectric resonator utilizes a fundamental wave of a thickness shear vibration mode and includes resonance electrodes provided on both main surfaces of a substantially rectangular piezoelectric plate so as to face each other with the piezoelectric plate disposed therebetween. An energy trap vibration portion including a portion of the piezoelectric plate where the resonance electrodes overlap each other is asymmetrical with respect to the center in the longitudinal direction of the piezoelectric plate.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: September 10, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiro Sawai, Ryuhei Yoshida
  • Piezoelectric resonator
    Publication number: 20010009343
    Abstract: An energy-trap type piezoelectric resonator utilizes a fundamental wave of a thickness shear vibration mode and includes resonance electrodes provided on both main surfaces of a substantially rectangular piezoelectric plate so as to face each other with the piezoelectric plate disposed therebetween. An energy trap vibration portion including a portion of the piezoelectric plate where the resonance electrodes overlap each other is asymmetrical with respect to the center in the longitudinal direction of the piezoelectric plate.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 26, 2001
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiro Sawai, Ryuhei Yoshida
  • Rubber-modified phenolic resin composition and method of manufacturing the same
    Patent number: 5216077
    Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: June 1, 1993
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Chemical Corporation
    Inventors: Akira Yoshizumi, Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata, Shinji Murakami, Shigeyuki Kouchiyama
  • Rubber-modified phenolic resin composition and method of manufacturing the same
    Patent number: 4916174
    Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
    Type: Grant
    Filed: September 13, 1988
    Date of Patent: April 10, 1990
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Chemical Corporation
    Inventors: Akira Yoshizumi, Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata, Shinji Murakami, Shigeyuki Kouchiyama