Patents by Inventor Kazuhiro Setoguchi

Kazuhiro Setoguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9662948
    Abstract: A knuckle bracket includes a cylindrical bracket main body that is fixed by welding to an outer periphery of an outer tube of a shock absorber and a pair of gripping pieces that extend along an axial direction of the bracket main body and stand up toward the outside from the bracket main body opposing each other. The bracket main body has a cut-away part formed on one side end and a compression part, the compression part being configured to abut a misassembly detection pin of a misassembly prevention device, the misassembly prevention device being configured to identify a type of the knuckle bracket.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 30, 2017
    Assignee: KYB Corporation
    Inventors: Shotaro Asaoka, Kazuhiro Setoguchi, Yuta Hoshino
  • Publication number: 20150375587
    Abstract: A knuckle bracket includes a cylindrical bracket main body that is fixed by welding to an outer periphery of an outer tube of a shock absorber and a pair of gripping pieces that extend along an axial direction of the bracket main body and stand up toward the outside from the bracket main body opposing each other. The bracket main body has a cut-away part formed on one side end and a compression part, the compression part being configured to abut a misassembly detection pin of a misassembly prevention device, the misassembly prevention device being configured to identify a type of the knuckle bracket.
    Type: Application
    Filed: March 25, 2014
    Publication date: December 31, 2015
    Applicant: KAYABA INDUSTRY CO., LTD.
    Inventors: Shotaro ASAOKA, Kazuhiro SETOGUCHI, Yuta HOSHINO
  • Patent number: 5966580
    Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron uses a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent. In the method, the metal paste is coated on a substrate, dried and sintered.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: October 12, 1999
    Assignee: Vacuum Metallurgical Co., Ltd.
    Inventors: Kazuhiro Watanabe, Michihiro Oshima, Kazuhiro Setoguchi, Masaaki Oda
  • Patent number: 5750194
    Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron uses a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent. In the method, the metal paste is coated on a substrate, dried and sintered.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: May 12, 1998
    Assignee: Vacuum Metallurgical Co., Ltd.
    Inventors: Kazuhiro Watanabe, Michihiro Oshima, Kazuhiro Setoguchi, Masaaki Oda
  • Patent number: 5587111
    Abstract: A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent.A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated.A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron. A metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent is coated on a substrate, dried and sintered.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: December 24, 1996
    Assignee: Vacuum Metallurgical Co., Ltd.
    Inventors: Kazuhiro Watanabe, Michihiro Oshima, Kazuhiro Setoguchi, Masaaki Oda