Patents by Inventor Kazuhiro Shinozaki

Kazuhiro Shinozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEAD FRAME AND MANUFACTURING METHOD THEREOF
    Publication number: 20240145356
    Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
    Type: Application
    Filed: September 1, 2022
    Publication date: May 2, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masahiro NAGATA, Kazuhiro SHINOZAKI, Masahiro YAMADA, Daisuke OKUYAMA, Chiaki HATSUTA, Kentarou SEKI, Hideto MATSUI, Kazunori OOUCHI
  • LEAD FRAME AND MANUFACTURING METHOD THEREOF
    Publication number: 20240030114
    Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masahiro NAGATA, Kazuhiro SHINOZAKI, Masahiro YAMADA, Daisuke OKUYAMA, Chiaki HATSUTA, Kentarou SEKI, Hideto MATSUI, Kazunori OOUCHI
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Patent number: 7644497
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: January 12, 2010
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Publication number: 20080163486
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 10, 2008
    Applicant: Dai Nippon Printing Co., Ltd
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Patent number: 7345888
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: March 18, 2008
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Publication number: 20070195511
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Application
    Filed: April 19, 2007
    Publication date: August 23, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Wiring board incorporating components and process for producing the same
    Patent number: 7242591
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: July 10, 2007
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Wiring board incorporating components and process for producing the same
    Publication number: 20060154496
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Application
    Filed: October 6, 2003
    Publication date: July 13, 2006
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura