Patents by Inventor Kazuhiro Shiomi

Kazuhiro Shiomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10006834
    Abstract: A vehicle testing system includes: an actuator for operating a vehicle or a part of a vehicle in a predetermined algorithm; an operating conditions calculating unit that calculates operating conditions being applied to a component of the vehicle or a component of the part of the vehicle during the operation of the vehicle or the part of the vehicle by the actuator; and a component testing device that connects to the component, in which the component testing device operates and applies to the component the operating conditions calculated by the operating conditions calculating unit.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: June 26, 2018
    Assignee: Horiba, Ltd.
    Inventors: Kei Tanaka, Kazuhiro Shiomi, Yoshifumi Sugihara, Yoku Hirose, Kazuki Furukawa
  • Patent number: 9945759
    Abstract: A vehicle test system according to the present invention intends to comprehensively manage and operate multiple types of test apparatuses to smoothly perform vehicle development, problem correction, and the like. For this purpose, the vehicle test system includes an actual running data acquisition apparatus that acquires actual running data that is data related to states inside and outside of a vehicle in running on a road; multiple types of test apparatuses each of which performs a drive test or an operation test of a vehicle or a part of the vehicle in accordance with set test conditions; and a test condition data generation apparatus that from the actual running data, generates test condition data indicating test conditions necessary to reproduce a part or all of the running states indicated by the actual running data in a test apparatus specified from among the multiple types of test apparatuses.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: April 17, 2018
    Assignee: Horiba, Ltd.
    Inventors: Mineyuki Komada, Yasuyuki Sado, Kazuhiro Shiomi, Katsumi Uratani
  • Publication number: 20170191902
    Abstract: A vehicle test device is to test performance of a vehicle or a part of the vehicle by rotating a wheel placed on a rotating body in order to reproduce an actually running state of the vehicle by controlling rotational speed of the wheel so as to make the rotational speed equal to a target value accurately, and a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value.
    Type: Application
    Filed: February 22, 2016
    Publication date: July 6, 2017
    Applicant: HORIBA, Ltd.
    Inventors: Mineyuki KOMADA, Kazuhiro SHIOMI
  • Publication number: 20150338313
    Abstract: A vehicle testing system includes: an actuator for operating a vehicle or a part of a vehicle in a predetermined algorithm; an operating conditions calculating unit that calculates operating conditions being applied to a component of the vehicle or a component of the part of the vehicle during the operation of the vehicle or the part of the vehicle by the actuator; and a component testing device that connects to the component, in which the component testing device operates and applies to the component the operating conditions calculated by the operating conditions calculating unit.
    Type: Application
    Filed: May 19, 2015
    Publication date: November 26, 2015
    Inventors: Kei TANAKA, Kazuhiro SHIOMI, Yoshifumi SUGIHARA, Yoku HIROSE, Kazuki FURUKAWA
  • Publication number: 20150332520
    Abstract: A vehicle test system according to the present invention intends to comprehensively manage and operate multiple types of test apparatuses to smoothly perform vehicle development, problem correction, and the like. For this purpose, the vehicle test system includes an actual running data acquisition apparatus that acquires actual running data that is data related to states inside and outside of a vehicle in running on a road; multiple types of test apparatuses each of which performs a drive test or an operation test of a vehicle or a part of the vehicle in accordance with set test conditions; and a test condition data generation apparatus that from the actual running data, generates test condition data indicating test conditions necessary to reproduce a part or all of the running states indicated by the actual running data in a test apparatus specified from among the multiple types of test apparatuses.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 19, 2015
    Inventors: Mineyuki KOMADA, Yasuyuki SADO, Kazuhiro SHIOMI, Katsumi URATANI
  • Publication number: 20120006884
    Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro SHIOMI, Masaaki ISHIO
  • Patent number: 7830001
    Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: November 9, 2010
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Masayuki Yokota, Kazuhiro Shiomi, Fumiaki Kikui, Masaaki Ishio
  • Patent number: 7776452
    Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: August 17, 2010
    Assignee: Neomax Materials Co. Ltd.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Tsuyoshi Hasegawa
  • Patent number: 7754973
    Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: July 13, 2010
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
  • Publication number: 20090283573
    Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.
    Type: Application
    Filed: July 24, 2009
    Publication date: November 19, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro SHIOMI, Toshiaki FUJITA, Masaaki ISHIO
  • Publication number: 20090272577
    Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.
    Type: Application
    Filed: April 25, 2007
    Publication date: November 5, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio
  • Publication number: 20090045506
    Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
    Type: Application
    Filed: May 23, 2006
    Publication date: February 19, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masayuki Yokota, Kazuhiro Shiomi, Fumiaki Kikui, Masaaki Ishio
  • Publication number: 20080169020
    Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
    Type: Application
    Filed: May 18, 2005
    Publication date: July 17, 2008
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
  • Publication number: 20070062574
    Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.
    Type: Application
    Filed: May 19, 2004
    Publication date: March 22, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Toshiaki Fujita, Masaaki Ishio
  • Patent number: 7166497
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: January 23, 2007
    Assignees: Neomax Materials Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Iizuka, Yoshikiyo Ogasawara
  • Publication number: 20060244125
    Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
    Type: Application
    Filed: July 27, 2005
    Publication date: November 2, 2006
    Applicant: NEOMAX MATERIALS CO., LTD
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Tsuyoshi Hasegawa
  • Patent number: 6921970
    Abstract: A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: July 26, 2005
    Assignees: Neomax Materials Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio
  • Publication number: 20050087862
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Application
    Filed: November 16, 2004
    Publication date: April 28, 2005
    Applicants: Neomax Co., Ltd., DAISHINKU CORPORATION
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Ilzuka, Yoshikiyo Ogasawara
  • Patent number: 6849939
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: February 1, 2005
    Assignees: Neomax Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Iizuka, Yoshikiyo Ogasawara
  • Publication number: 20040207071
    Abstract: A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package.
    Type: Application
    Filed: March 23, 2004
    Publication date: October 21, 2004
    Inventors: Kazuhiro Shiomi, Masaaki Ishio