Abstract: A vehicle test device is to test performance of a vehicle or a part of the vehicle by rotating a wheel placed on a rotating body in order to reproduce an actually running state of the vehicle by controlling rotational speed of the wheel so as to make the rotational speed equal to a target value accurately, and a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value.

Abstract: A vehicle testing system includes: an actuator for operating a vehicle or a part of a vehicle in a predetermined algorithm; an operating conditions calculating unit that calculates operating conditions being applied to a component of the vehicle or a component of the part of the vehicle during the operation of the vehicle or the part of the vehicle by the actuator; and a component testing device that connects to the component, in which the component testing device operates and applies to the component the operating conditions calculated by the operating conditions calculating unit.

Abstract: A vehicle test system according to the present invention intends to comprehensively manage and operate multiple types of test apparatuses to smoothly perform vehicle development, problem correction, and the like. For this purpose, the vehicle test system includes an actual running data acquisition apparatus that acquires actual running data that is data related to states inside and outside of a vehicle in running on a road; multiple types of test apparatuses each of which performs a drive test or an operation test of a vehicle or a part of the vehicle in accordance with set test conditions; and a test condition data generation apparatus that from the actual running data, generates test condition data indicating test conditions necessary to reproduce a part or all of the running states indicated by the actual running data in a test apparatus specified from among the multiple types of test apparatuses.

Abstract: A vehicle test device is to test performance of a vehicle or a part of the vehicle by rotating a wheel placed on a rotating body in order to reproduce an actually running state of the vehicle by controlling rotational speed of the wheel so as to make the rotational speed equal to a target value accurately, and a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value.

Abstract: A vehicle testing system includes: an actuator for operating a vehicle or a part of a vehicle in a predetermined algorithm; an operating conditions calculating unit that calculates operating conditions being applied to a component of the vehicle or a component of the part of the vehicle during the operation of the vehicle or the part of the vehicle by the actuator; and a component testing device that connects to the component, in which the component testing device operates and applies to the component the operating conditions calculated by the operating conditions calculating unit.

Abstract: A vehicle test system according to the present invention intends to comprehensively manage and operate multiple types of test apparatuses to smoothly perform vehicle development, problem correction, and the like. For this purpose, the vehicle test system includes an actual running data acquisition apparatus that acquires actual running data that is data related to states inside and outside of a vehicle in running on a road; multiple types of test apparatuses each of which performs a drive test or an operation test of a vehicle or a part of the vehicle in accordance with set test conditions; and a test condition data generation apparatus that from the actual running data, generates test condition data indicating test conditions necessary to reproduce a part or all of the running states indicated by the actual running data in a test apparatus specified from among the multiple types of test apparatuses.

Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.

Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.

Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.

Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.

Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.

Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.

Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.

Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.

Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.

Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.

Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.

Abstract: A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package.

Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.

Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.