Abstract: [Problem] To provide an antibody that can bind specifically to EphA4 and detect EphA4 at high detection sensitivity, and a method and a kit for detecting or quantifying EphA4 characterized by the antibody. [Solution] Provided are an antibody having a specific heavy chain CDR sequence and light chain CDR sequence and an antigen binding fragment thereof, and a method and kit characterized by the same. Specifically, an antibody according to the present invention or an antigen-binding fragment thereof includes (a) a heavy chain including a heavy chain CDR1 comprising an amino acid sequence represented by SEQ ID NO. 52; a heavy chain CDR2 comprising an amino acid sequence represented by SEQ ID NO. 53; and a heavy chain CDR3 comprising an amino acid sequence represented by SEQ ID NO. 54; and a light chain including a light chain CDR1 comprising an amino acid sequence represented by SEQ ID NO. 55; a light chain CDR2 comprising an amino acid sequence represented by SEQ ID NO.

Abstract: Based on a ratio between Doppler frequencies calculated from a plurality of reception signals outputted by a receiver, a position detector calculates a relative position of a plurality of antennas in a mobile wireless apparatus to a stationary wireless apparatus. A train position detector calculates a position of a train from the calculated relative position, a placement position of the stationary wireless apparatus and placement positions in the train of the plurality of antennas.

Abstract: Provided is a novel double-stranded ribonucleic acid for suppressing expression of complement C5. A double-stranded ribonucleic acid comprising a combination of sense strand and antisense strand, wherein the combination of the sense strand and antisense strand are selected from the group consisting of combinations: SEQ ID NO: 13/14, SEQ ID NO: 159/160, SEQ ID NO: 115/116, SEQ ID NO: 117/118, SEQ ID NO: 119/120, SEQ ID NO: 121/122, SEQ ID NO: 123/124, SEQ ID NO: 125/126, SEQ ID NO: 127/128, SEQ ID NO: 129/130, SEQ ID NO: 131/132, SEQ ID NO: 133/134, SEQ ID NO: 137/138, SEQ ID NO: 139/140, SEQ ID NO: 141/142, SEQ ID NO: 143/144, SEQ ID NO: 145/146, SEQ ID NO: 147/148, SEQ ID NO: 149/150, SEQ ID NO: 151/152, and SEQ ID NO: 153/154.

Abstract: A train-position detection device includes: a radio-wave's angle-of-arrival calculator configured to calculate an angle of arrival of a radio wave on the basis of a reception signal received by an array antenna and a receiver; a position acquisition unit configured to acquire information on an installation position of a ground-based wireless communication apparatus from the reception signal; a train-position calculator configured to calculate a train position on the basis of a movement distance of a train; a correction-amount-to-train-position calculator configured to calculate a train-position correction amount, by using the calculated angle of arrival, the installation position of the ground-based wireless communication apparatus acquired by the position acquisition unit, and the calculated train position; and a train-position correcting unit configured to correct the calculated train position by using the train-position correction amount calculated by the correction-amount-to-train-position calculator.

Abstract: A train-position detection device (1) includes: a radio-wave's angle-of-arrival calculator (14) configured to calculate an angle of arrival of a radio wave on the basis of a reception signal received by an array antenna (11) and a receiver (12); a position acquisition unit (13) for a ground-based wireless communication apparatus, configured to acquire information on an installation position of a ground-based wireless communication apparatus (30) from the reception signal; a train-position calculator (15) configured to calculate a train position on the basis of a movement distance of a train (40); a correction-amount-to-train-position calculator (16b) configured to calculate a train-position correction amount, by using the radio wave's angle of arrival calculated by the radio-wave's angle-of-arrival calculator (14), the installation position of the ground-based wireless communication apparatus (30) acquired by the position acquisition unit (13) for a ground-based wireless communication apparatus, and the train

Abstract: A travel distance measurement device includes a transmitting antenna that is disposed in a vehicle and emits a transmission signal, as a radio wave, toward a ground surface, a receiving antenna that is disposed in the vicinity of the transmitting antenna, and receives a radio wave reflected from the ground surface and acquires a reflection signal, and a distance calculator (an IQ demodulator and a phase conversion integrator) that calculates the travel distance of the vehicle on the basis of the phase of the acquired reflection signal.

Abstract: Based on a ratio between Doppler frequencies calculated from a plurality of reception signals outputted by a receiver, a position detector calculates a relative position of a plurality of antennas in a mobile wireless apparatus to a stationary wireless apparatus. A train position detector calculates a position of a train from the calculated relative position, a placement position of the stationary wireless apparatus and placement positions in the train of the plurality of antennas.

Abstract: A travel distance measurement device includes a transmitting antenna that is disposed in a vehicle and emits a transmission signal, as a radio wave, toward a ground surface, a receiving antenna that is disposed in the vicinity of the transmitting antenna, and receives a radio wave reflected from the ground surface and acquires a reflection signal, a distance calculator (an IQ demodulator and a phase conversion integrator) that calculates the travel distance of the vehicle on the basis of the acquired reflection signal, a gyro sensor that measures a predetermined parameter regarding curve traveling of the vehicle, and a correcting operation unit that corrects the calculated travel distance on the basis of the measured parameter.

Abstract: A travel distance measurement device includes a transmitting antenna that is disposed in a vehicle and emits a transmission signal, as a radio wave, toward a ground surface, a receiving antenna that is disposed in the vicinity of the transmitting antenna, and receives a radio wave reflected from the ground surface and acquires a reflection signal, and a distance calculator (an IQ demodulator and a phase conversion integrator) that calculates the travel distance of the vehicle on the basis of the phase of the acquired reflection signal.

Abstract: A travel distance measurement device includes a transmitting antenna that is disposed in a vehicle and emits a transmission signal, as a radio wave, toward a ground surface, a receiving antenna that is disposed in the vicinity of the transmitting antenna, and receives a radio wave reflected from the ground surface and acquires a reflection signal, a distance calculator (an IQ demodulator and a phase conversion integrator) that calculates the travel distance of the vehicle on the basis of the acquired reflection signal, a gyro sensor that measures a predetermined parameter regarding curve traveling of the vehicle, and a correcting operation unit that corrects the calculated travel distance on the basis of the measured parameter.

Abstract: An apparatus for treating a substrate which includes a chamber and an opening formed in the chamber allowing the substrate to be conveyed into the chamber or taken out thereof. The chamber, also, includes a detachable baffle plate that fits around an electrode. For treatment to commence, the substrate is placed on the electrode and the chamber is exhausted of or supplied with gases. The electrode is then vertically lifted together with the baffle plate and the baffle plate is moved either to a position that is higher in level than an upper end of the opening of the chamber or to a position that is lower in level than a lower end of the opening of the chamber. This allows the baffle plate to shield a region near the opening of the chamber from a treatment region and allows reaction products to be adhered to the baffle plate.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the water.

Abstract: A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face of the central portion of the radiating plate, and an upper face of the central portion of the radiating plate is exposed to the top of a resin member. Since the upper face of the central portion of the radiating plate which has the pellet mounted on the lower face thereof is exposed from the resin member, heat generated by the pellet can be radiated efficiently.

Abstract: A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.

Abstract: A plastic-encapsulated semiconductor device is provided, which is capable of efficient heat dissipation without upsizing while preventing the moisture from reaching an IC chip. This device is comprised of an electrically-conductive island having a chip-mounting area, an IC chip fixed on the chip-mounting area of the island, leads electrically connected to bonding pads of the chip through bonding wires, a plastic package for encapsulating the island, the chip, the bonding wires, and inner parts of the leads. The package has an approximately flat bottom face. Outer parts of the leads are protruded from the package and are located in approximately a same plane as the bottom face of the package. The island has an exposition part exposed from the package at a location excluding the chip-mounting area. A lower face of the exposition part of the island is located in approximately a same plane as the bottom face of the package. The chip and the chip-mounting area of the island are entirely buried in the package.

Abstract: A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.