Abstract: A process for selectively manufacturing vertical or horizontal type switch devices using a common form for substantially all parts or components, and products manufactured by the same process. The process comprises subjecting a metallic strip to stamping-out to leave predetermined patterns, each pattern consisting of a set of fixed contact elements, and two groups of terminals extending from the fixed contact elements and perpendicular to each other, and passageways between adjacent terminals in part; cutting some selected sites from the passageways so that one desired group of terminals in accordance with horizontal or vertical type may remain connected to the fixed contact elements before or after the molding with an insulating synthetic resin so that each resulting pattern may be inserted in the mold formed thereby; and making assembly of the thus-obtained mold-with-terminal-pattern and other parts and components.

Abstract: A slide-action switch in which a fixed contact is provided on an insulating wafer has a projection for raising and holding a movable contact away from the surface of the wafer when the movable contact slides to its open circuit position so as to eliminate a high voltage arcing path formed by metal powder left on the surface of the wafer. The metal powder is created by the sliding action of the movable contact against the fixed contact.