Abstract: A sample mounting plate which is used for mass spectrometry according to MALDI process and which is provided with at least one sample loading spot for mounting a sample on a substrate, wherein: a hydrophilic surface produced by a first hydrophilic film is formed within the sample loading spot on a surface of the substrate provided with the sample loading spot; a hydrophobic surface produced by a hydrophobic film is formed on the outside of the hydrophilic surface; and a boundary part, in which a hydrophilic member or a second hydrophilic film having a higher hydrophilicity than the first hydrophilic film is exposed, is formed at the boundary between the hydrophilic surface and the hydrophobic surface.

Abstract: A sample loading plate that includes at least one sample mounting spot that mount a sample thereon is provided with a substrate having a conductive surface and an insulating film that is laminated on the conductive surface of the substrate and that has at least an insulating surface, the insulating film being sparsely formed so that the conductive surface of the substrate is partially exposed at least in the sample mounting spot. Thus, a voltage applied to the sample loading plate can effectively place the sample in an electric field. As a result of which, in a mass spectrometric analysis of the sample, there is no charge up of the sample and appropriate ionization becomes possible.

Abstract: A sample loading plate that includes at least one sample mounting spot that mount a sample thereon is provided with a substrate having a conductive surface and an insulating film that is laminated on the conductive surface of the substrate and that has at least an insulating surface, the insulating film being sparsely formed so that the conductive surface of the substrate is partially exposed at least in the sample mounting spot. Thus, a voltage applied to the sample loading plate can effectively place the sample in an electric field. As a result of which, in a mass spectrometric analysis of the sample, there is no charge up of the sample and appropriate ionization becomes possible.

Abstract: A sample mounting plate which is used for mass spectrometry according to MALDI process and which is provided with at least one sample loading spot for mounting a sample on a substrate, wherein: a hydrophilic surface produced by a first hydrophilic film is formed within the sample loading spot on a surface of the substrate provided with the sample loading spot; a hydrophobic surface produced by a hydrophobic film is formed on the outside of the hydrophilic surface; and a boundary part, in which a hydrophilic member or a second hydrophilic film having a higher hydrophilicity than the first hydrophilic film is exposed, is formed at the boundary between the hydrophilic surface and the hydrophobic surface.

Abstract: A sample mounting plate has: a substrate made of alumina ceramic which exhibits white; and a cover layer which is laminated so as to cover the front surface of the substrate and which has multiple grooves formed in some areas. The cover layer has: a conductive interference layer which exhibits conductivity and is configured so as to exhibit a prescribed color (such as navy blue) through light interference and which is laminated on the substrate; and a water-repellent layer which exhibits higher water repellency than that of the substrate and is laminated on at least a part of the conductive interference layer and on which a sample is to be mounted.

Abstract: A sample mounting plate has: a substrate made of alumina ceramic which exhibits white; and a cover layer which is laminated so as to cover the front surface of the substrate and which has multiple grooves formed in some areas. The cover layer has: a conductive interference layer which exhibits conductivity and is configured so as to exhibit a prescribed color (such as navy blue) through light interference and which is laminated on the substrate; and a water-repellent layer which exhibits higher water repellency than that of the substrate and is laminated on at least a part of the conductive interference layer and on which a sample is to be mounted.

Abstract: An optical module and a fabrication method thereof, the optical module includes a sub-substrate which includes a support layer, an active layer, a BOX layer interposed between the support layer and the active layer, and a height adjusting layer, an optical fiber, and an optical device which is fixed to a silicon substrate, wherein the sub-substrate includes a fixing groove formed by the active layer and the BOX layer, the optical fiber is fixed to the fixing groove, and the optical fiber is optically coupled to the optical device by positioning the sub-substrate via the height adjusting layer with respect to the silicon substrate.

Abstract: An optical module and a fabrication method thereof, the optical module includes a sub-substrate which includes a support layer, an active layer, a BOX layer interposed between the support layer and the active layer, and a height adjusting layer, an optical fiber, and an optical device which is fixed to a silicon substrate, wherein the sub-substrate includes a fixing groove formed by the active layer and the BOX layer, the optical fiber is fixed to the fixing groove, and the optical fiber is optically coupled to the optical device by positioning the sub-substrate via the height adjusting layer with respect to the silicon substrate.

Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.

Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.

Abstract: The silicon substrate is masked on one surface of the silicon substrate where structures like combs and beams of comb drive are not to be formed on the other surface. The unmasked areas are then etched followed by masking areas on the other surface corresponding to the structures. Finally, the unmasked areas on the other surface are again etched by anisotropic reactive ion etching to form the structures.

Abstract: The silicon substrate is masked on one surface of the silicon substrate where structures like combs and beams of comb drive are not to be formed on the other surface. The unmasked areas are then etched followed by masking areas on the other surface corresponding to the structures. Finally, the unmasked areas on the other surface are again etched by anisotropic reactive ion etching to form the structures.