Abstract: A diplexer includes a first bandpass filter provided between an input terminal and a first output terminal and selectively passing a signal in a first frequency band, and a second bandpass filter provided between the input terminal and a second output terminal and selectively passing a signal in a second frequency band. The first bandpass filter includes a plurality of first resonators. The second bandpass filter includes a second resonator and a series resonant circuit. The series resonant circuit is composed of a capacitor provided between the input terminal and the second resonator, and an inductance component of a line that connects the input terminal and the second resonator via the capacitor.

Abstract: To provide a semiconductor device and a method of manufacturing the same capable of suppressing, when a plurality of MIS transistors having different absolute values of threshold voltage is used, the reduction of the drive current of a MIS transistor having a greater absolute value of threshold voltage. The threshold voltage of a second nMIS transistor is greater than the threshold voltage of a first nMIS transistor and the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a second nMIS high-k film included in the second nMIS transistor is lower than the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a first nMIS high-k film included in the first nMIS transistor.

Abstract: To provide a semiconductor device and a method of manufacturing the same capable of suppressing, when a plurality of MIS transistors having different absolute values of threshold voltage is used, the reduction of the drive current of a MIS transistor having a greater absolute value of threshold voltage. The threshold voltage of a second nMIS transistor is greater than the threshold voltage of a first nMIS transistor and the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a second nMIS high-k film included in the second nMIS transistor is lower than the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a first nMIS high-k film included in the first nMIS transistor.

Abstract: There have been provided a semiconductor device capable of preventing defects associated with etching, such as an increase in leak current, deterioration in film-coating properties and deterioration in transistor properties, and a method for manufacturing the semiconductor device. A CMOS transistor includes, on the same semiconductor substrate, an NMOS transistor having a gate electrode and a PMOS transistor having a gate electrode, wherein the former gate electrode includes a gate insulating film, a polycrystal silicon layer, a metal layer and another polycrystal silicon layer, and the latter gate electrode includes a gate insulating film, a metal layer and a polycrystal silicon layer.

Abstract: To provide a semiconductor device and a method of manufacturing the same capable of suppressing, when a plurality of MIS transistors having different absolute values of threshold voltage is used, the reduction of the drive current of a MIS transistor having a greater absolute value of threshold voltage. The threshold voltage of a second nMIS transistor is greater than the threshold voltage of a first nMIS transistor and the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a second nMIS high-k film included in the second nMIS transistor is lower than the sum of the concentration of lanthanum atom and the concentration of magnesium atom in a first nMIS high-k film included in the first nMIS transistor.

Abstract: There have been provided a semiconductor device capable of preventing defects associated with etching, such as an increase in leak current, deterioration in film-coating properties and deterioration in transistor properties, and a method for manufacturing the semiconductor device. A CMOS transistor includes, on the same semiconductor substrate, an NMOS transistor having a gate electrode and a PMOS transistor having a gate electrode, wherein the former gate electrode includes a gate insulating film, a polycrystal silicon layer, a metal layer and another polycrystal silicon layer, and the latter gate electrode includes a gate insulating film, a metal layer and a polycrystal silicon layer.

Abstract: A semiconductor device includes a conductive layer formed on a silicon semiconductor substrate, cobalt silicide films formed in a surface layer of the conductive layer, an interlayer insulating film which covers the silicon semiconductor substrate thereabove, and a barrier metal film and a tungsten film which fill in a contact hole formed in the interlayer insulating film and is electrically connected to the cobalt silicide film. The positions of lower surfaces of the cobalt silicide films at the bottom of the contact hole are set lower than the position of a lower surface of the cobalt silicide film provided outside the contact hole. A cobalt silicide film having a necessary thickness can be ensured at the bottom of the contact hole. Further, a contact resistance can be reduced and a junction leak can be suppressed.

Abstract: A semiconductor device includes a conductive layer formed on a silicon semiconductor substrate, cobalt silicide films formed in a surface layer of the conductive layer, an interlayer insulating film which covers the silicon semiconductor substrate thereabove, and a barrier metal film and a tungsten film which fill in a contact hole formed in the interlayer insulating film and is electrically connected to the cobalt silicide film. The positions of lower surfaces of the cobalt silicide films at the bottom of the contact hole are set lower than the position of a lower surface of the cobalt silicide film provided outside the contact hole. A cobalt silicide film having a necessary thickness can be ensured at the bottom of the contact hole. Further, a contact resistance can be reduced and a junction leak can be suppressed.

Abstract: A lower insulating film is formed so as to cover source/drain regions electrically connected to capacitors. Bit lines and upper insulating layers are formed on the lower insulating film. SCs opening to the lower insulating film are formed by an anisotropic etching process on process conditions for etching the upper insulating films at a high upper insulating film/lower insulating film selectivity. An insulating film of a quality equal to that of the lower insulating film is deposited so as to fill up the SCs and to cover the upper insulating film. The SCs is extended so as to open to the source/drain regions by an anisotropic etching process on process conditions for etching the lower insulating film at a high lower insulating film/silicon film selectivity.

Abstract: In a semiconductor device having a mark opening portion such as an alignment mark and an overlay mark, a BPSG film formed by patterning on this mark opening portion interposing a first conductive film is covered by a second conductive film; and the BPSG film serves as a core of a cylindrical storage node and is removed after the second conductive film is formed in a shape of sidewall by a vapor phase HF treatment process, whereby a conductive contaminant is not peeled off at the time of removing the BPSG film, wherein a drop of yield can be restricted.

Abstract: A portion of a cell plate 91 extending upon a field oxide film 107a and a silicon oxide film 123 is referred to as a lower layer interconnection film 109. The lower layer interconnection film 109 has a concave shape. A through hole 95a is formed in a silicon oxide film 93 reaching the bottom of the concave shape lower layer interconnection film 109. The depth of the through hole 95a is greater in comparison with the case where a through hole is formed on an upper face portion 123a of the silicon oxide film 123. Because the depth of through hole 95a is great, the thickness of the tungsten film 101a formed in through hole 95a becomes thicker. This eliminates the problem that all the tungsten film 101a in the through hole 95a, and then a portion of the lower layer interconnection film 109 are overetched. Therefore, electrical connection between the upper layer interconnection layer 103a and the lower layer interconnection layer 109 can be ensured.

Abstract: In a semiconductor device, a connection conductive layer is formed by patterning on a p-type semiconductor substrate. A silicon nitride film is formed on the connection conductive layer with an insulating layer. A silicon oxide film is formed on the silicon nitride film. The silicon oxide film is provided with a hole. The silicon nitride film is exposed at a bottom of the hole. The hole is located immediately above the connection conductive layer. Thereby, a thickness of the insulating layer on a fuse element which can be blown can be controlled easily in the semiconductor device.

Abstract: A keyboard device for an electronic musical instrument comprises a keyboard chassis, keys rotatively arranged on the keyboard chassis, and a key switch arranged beneath each of the keys for detecting a key status of each key. Each key has a switch-depressing projection arranged just above the key switch, and a hammer-depressing projection for depressing a hammer when the hammer is provided, with the switch-depressing projection and the hammer-depressing projection being formed adjacent to each other in one piece.

Abstract: A keyboard apparatus for an electronic musical instrument has a metallic keyboard chassis and a balance rail provided on the keyboard chassis. A plurality of pins are provided on the balance rail. The pins and the balance rail constitute fulcrums for swingably supporting white keys and black keys. A hammer is provided in a rear side of each of the white and the black keys so as to be swingable by swinging of each of the respective keys by a second fulcrum comprising oval cross sectional shafts extending outwardly from the side surface of one of the hammer and a bearing member, the side surface extending perpendicular to a direction of swing movement of the hammer and a pair of bearing recesses for pivotally receiving the shaft, the bearing recesses being formed in the other of the hammer and the bearing member. Each of the bearing recesses has a guide slot for guiding each of the shafts from outside into the bearing recess for assembling.

Abstract: A portion of a cell plate 91 extending upon a field oxide film 107a and a silicon oxide film 123 is referred to as a lower layer interconnection film 109. The lower layer interconnection film 109 has a concave shape. A through hole 95a is formed in a silicon oxide film 93 reaching the bottom of the concave shape lower layer interconnection film 109. The depth of the through hole 95a is greater in comparison with the case where a through hole is formed on an upper face portion 123a of the silicon oxide film 123. Because the depth of through hole 95a is great, the thickness of the tungsten film 101a formed in through hole 95a becomes thicker. This eliminates the problem that all the tungsten film 101a in the through hole 95a, and then a portion of the lower layer interconnection film 109 are overetched. Therefore, electrical connection between the upper layer interconnection layer 103a and the lower layer interconnection layer 109 can be ensured.

Abstract: A keyboard apparatus for an electronic musical instrument has a metallic keyboard chassis and a balance rail provided on the keyboard chassis. A plurality of pins are provided on the balance rail. The pins and the balance +*rail constitute fulcrums for swingably supporting white keys and black keys. The fulcrums for the black keys are disposed on the same line with, or in front of, the fulcrums for the white keys. Hammers are provided in a rear of the keys so as to be swingable by swinging of each of the respective keys. The hammers are disposed on the same axis of rotation, and a position for the black keys to operate to swing the respective hammers is located in front of a position for the white keys to operate to swing the respective hammers such that an angle of rotation of the respective hammers becomes substantially equal to each other. A stopper member for restricting the swinging movement of the keys or the hammers are provided in a rear upper portion of the keys.

Abstract: A word line driving signal generating circuit and a sense amplifier activating signal generating circuit are provided for every partitioned memory cell array. When the levels of an external RAS signal and an external CAS signal have a predetermined relation and an external RNC signal remains at a predetermined potential or more, a refresh operation is started. A refresh address is generated from a refresh address counter in a sense restore control circuit. All of the memory cell arrays are simultaneously refreshed in response to the address. On this occasion, an operation for selecting a column by a column decoder provided in each of the memory cell arrays is inhibited. In the case in which an input of the external RNC signal is not prepared, when the levels of the external RAS signal and the external CAS signal have a predetermined relation and this state is held in a predetermined time period or more, the same refresh operation as described above is started.

Abstract: A novel semiconductor memory device includes an address detection circuit that produces a short-width pulse in response to the detection of an address change. A column decoder-activating signal generator detects the start of the short-width pulse and in response generates a column decoder-activating signal. A second detection circuit detects the conclusion of the short-width pulse and generates a second pulse that triggers a preamplifier-activating signal that activates a preamplifier and latches the data that is present on the input/output line. A reset signal generator produces a reset signal to deactivate the column decoder-activating signal and to delay the preamplifier-activating signal. The preamplifier-activating signal generator and the reset signal generator are reset while the first pulse is output.

Abstract: A memory cell array is divided into four blocks #1 to #4. The blocks #1 and #3 are operated when a row address signal RA.sub.8 equals "0". The blocks #2 and #4 are operated when the row address signal RA.sub.8 equals "1". A spare row sub-decoder is provided in each of the blocks. Spare row sub-decoders in the blocks #1 and #2 are connected to a spare row main decoder through a single spare decoder selecting line. The spare row sub-decoders in the blocks #2 and #4 are connected to the other spare row main decoder through another spare decoder selecting line. The spare main decoders are responsive to the row address signal RA.sub.8 and row address signals RA.sub.2, RA.sub.2, . . . , RA.sub.7, RA.sub.7 for operating a spare row sub-decoder in a block which is in the operating state.

Abstract: A dynamic random access memory device having an input/output load connected between a pair of input/output lines and a control circuit used to generate an internal /RAS signal having a reset transition delayed with respect to the same transition of the external /RAS signal. The internal /RAS signal controls at least a word signal applied to a transistor of a selected memory cell and an enable signal applied to an enable transistor, whereby the time the transistor of the memory cell and the enable transistor become non-conductive is delayed with respect to the time at which a transfer transistor connected between each pair of bit lines and the input/output lines becomes non-conductive.