Patents by Inventor Kazuhiro Tsurumaru

Kazuhiro Tsurumaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molded semiconductor device using polymide and nitride films for the passivation film
    Patent number: 4990993
    Abstract: Herein disclosed is a semiconductor device having a semiconductor element, which is constructed to include a bonding pad for the semiconductor element formed selectively on one main side of a semiconductor layer, with a nitride film so formed on the main side of said semiconductor layer as to expose the surface of said bonding pad to the outside, and with a polyimide resin film formed on both said bonding pad and said nitride film. A sealing resin is formed to cover the surface portion of the bonding pad and the nitride film. This construction seals the semiconductor element from moisture, and prevents corrosion of the bonding pad due to said moisture.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: February 5, 1991
    Assignee: Hitachi, Ltd.
    Inventor: Kazuhiro Tsurumaru
  • Resin-molded semiconductor device using polyimide and nitride films for the passivation film
    Patent number: 4733289
    Abstract: Herein disclosed is a semiconductor device having a semiconductor element, which is constructed to include a bonding pad for the semiconductor element formed selectively on one main side of a semiconductor layer, with a nitride film so formed on the main side of said semiconductor layer as to expose the surface of said bonding pad to the outside, and with a polyimide resin film formed on both said bonding pad and said nitride film. A sealing resin is formed to cover the surface portion of the bonding pad and the nitride film. This construction seals the semiconductor element from moisture, and prevents corrosion of the bonding pad due to said moisture.
    Type: Grant
    Filed: March 10, 1986
    Date of Patent: March 22, 1988
    Assignee: Hitachi, Ltd.
    Inventor: Kazuhiro Tsurumaru