Patents by Inventor Kazuhiro Urashima
Kazuhiro Urashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8863378Abstract: A method for manufacturing a wiring board including, as steps executed in written order: a sub-core accommodation step of accommodating the ceramic sub-core in the sub-core accommodation space through the first-major-surface-side opening of the sub-core accommodation space; and a film formation and charging step of forming a lowest resin insulating layer of the first-major-surface-side wiring laminate by sticking a resin material to the core body and the ceramic sub-core from the first major surface side, and forming a groove-filling portion that is continuous with the lowest resin insulating layer by charging the resin material into a gap between the core body and the ceramic sub-core.Type: GrantFiled: February 16, 2010Date of Patent: October 21, 2014Assignee: NGK Spark Plug Co., Ltd.Inventors: Masaki Muramatsu, Shinji Yuri, Makoto Origuchi, Kazuhiro Urashima
-
Publication number: 20110182682Abstract: Provided are a cutting insert and a cutting tool, capable of maintaining cutting performance for a long time. The cutting insert has a cutting blade made of a ceramic including the base and the cutting blade integrated with each other, wherein the base has a first coefficient of thermal expansion larger than a second coefficient of thermal expansion that the cutting blade has; and a difference between the first coefficient and the second coefficient is from more than 0 ppm/K to not more than 3 ppm/K.Type: ApplicationFiled: March 30, 2009Publication date: July 28, 2011Applicant: NGK SPARK PLUG CO.,LTD.Inventors: Kohei Abukawa, Kazuhiro Urashima, Yusuke Suzuki, Tatsuya Ito, Ryoji Toyoda, Koji Kamikawa
-
Patent number: 7973245Abstract: An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.Type: GrantFiled: February 6, 2008Date of Patent: July 5, 2011Assignee: NGK Spark Plug Co., Ltd.Inventors: Masaki Muramatsu, Shinji Yuri, Kazuhiro Urashima, Hiroshi Yamamoto, Toshitake Seki, Motohiko Sato
-
Patent number: 7951737Abstract: A cutting insert 1 is made of an aluminum oxide-based composite sintered body constituted by a ternary ceramic material including aluminum oxide, silicon carbide, and a sialon. The sialon in the aluminum oxide-based composite sintered body is Si—Al—O—N as defined by JCPDS No. 32-0026 in X-ray diffraction analysis.Type: GrantFiled: August 29, 2007Date of Patent: May 31, 2011Assignee: NGK Spark Plug Co., Ltd.Inventors: Hiroko Nakayama, Kazuhiro Urashima
-
Patent number: 7889509Abstract: A circuit board (10, 10?, 10??) comprising: a board core (11) having a main core surface (12) and a rear core surface (13); a ceramic capacitor (101, 101?, 101?, 101??, 101??, 101???, 101???) having a main capacitor surface (102) and a rear capacitor surface (103), having a structure in which a first inner electrode layer (141) and a second inner electrode layer (142) are alternately stacked with a ceramic dielectric layer (105) interposed therebetween, and having a plurality of capacitor function units (107, 108) being electrically independent from each other, the ceramic capacitor (101, 101?, 101?, 101??, 101??, 101???, 101???) being buried in the board core (11) in a state where the main core surface (12) and the main capacitor surface (102) are directed in a same direction; and a buildup layer (31) having a structure in which an interlayer insulating layer (33, 35) and a conductor layer (42) are alternately stacked on the main core surface (12) and the main capacitor surface (102) and having a semiconductType: GrantFiled: August 31, 2006Date of Patent: February 15, 2011Assignee: NGK Spark Plug Co., Ltd.Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Yasuhiro Sugimoto
-
Patent number: 7742314Abstract: A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistorType: GrantFiled: August 31, 2006Date of Patent: June 22, 2010Assignee: NGK Spark Plug Co., Ltd.Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Kohki Ogawa
-
Publication number: 20100139090Abstract: A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer.Type: ApplicationFiled: February 16, 2010Publication date: June 10, 2010Applicant: NGK SPARK PLUG CO., LTD.Inventors: Masaki MURAMATSU, Shinji YURI, Makoto ORIGUCHI, Kazuhiro URASHIMA
-
Patent number: 7696442Abstract: A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer.Type: GrantFiled: June 2, 2006Date of Patent: April 13, 2010Assignee: NGK Spark Plug Co., Ltd.Inventors: Masaki Muramatsu, Shinji Yuri, Makoto Origuchi, Kazuhiro Urashima
-
Publication number: 20090197073Abstract: A cutting insert 1 is made of an aluminum oxide-based composite sintered body constituted by a ternary ceramic material including aluminum oxide, silicon carbide, and a sialon. The sialon in the aluminum oxide-based composite sintered body is Si—Al—O—N as defined by JCPDS No. 32-0026 in X-ray diffraction analysis.Type: ApplicationFiled: August 29, 2007Publication date: August 6, 2009Inventors: Hiroko Nakayama, Kazuhiro Urashima
-
Patent number: 7473988Abstract: A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.Type: GrantFiled: August 31, 2006Date of Patent: January 6, 2009Assignee: NGK Spark Plug Co., LtdInventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Jun Otsuka
-
Publication number: 20080223607Abstract: An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.Type: ApplicationFiled: February 6, 2008Publication date: September 18, 2008Inventors: Masaki MURAMATSU, Shinji Yuri, Kazuhiro Urashima, Hiroshi Yamamoto, Toshitake Seki, Motohiko Sato
-
Patent number: 7388296Abstract: A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting the glass-ceramic, Fe converted into Fe2O3 and Cu. The Fe2O3 comprises 1 to 28 parts by weight with respect to 100 parts by weight of the Cu.Type: GrantFiled: June 8, 2006Date of Patent: June 17, 2008Assignee: NGK Spark Plug Co., Ltd.Inventors: Kazuhiro Urashima, Tatsuharu Ikawa, Mitsuo Shiraishi, Hiroshi Sumi
-
Patent number: 7345246Abstract: An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.Type: GrantFiled: February 9, 2006Date of Patent: March 18, 2008Assignee: NGK Spark Plug Co., Ltd.Inventors: Masaki Muramatsu, Shinji Yuri, Kazuhiro Urashima, Hiroshi Yamamoto, Toshitake Seki, Motohiko Sato
-
Patent number: 7317165Abstract: An intermediate substrate comprising: an intermediate substrate body containing an insulating material, and having a first face to be mounted with an semiconductor element and a second face opposing to said first face; and a semiconductor element mounting area including a plurality of first face terminals arranged on said first face, and being surrounded by an outermost periphery of said plurality of first face terminals, wherein a center of said semiconductor element mounting area is eccentric with respect to a center of said first face.Type: GrantFiled: June 24, 2004Date of Patent: January 8, 2008Assignee: NGK Spark Plug Co., Ltd.Inventors: Hajime Saiki, Kazuhiro Urashima
-
Publication number: 20070076392Abstract: A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistorType: ApplicationFiled: August 31, 2006Publication date: April 5, 2007Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Kohki Ogawa
-
Publication number: 20070064375Abstract: A circuit board (10, 10?, 10??) comprising: a board core (11) having a main core surface (12) and a rear core surface (13); a ceramic capacitor (101, 101?, 101?, 101??, 101??, 101???, 101???) having a main capacitor surface (102) and a rear capacitor surface (103), having a structure in which a first inner electrode layer (141) and a second inner electrode layer (142) are alternately stacked with a ceramic dielectric layer (105) interposed therebetween, and having a plurality of capacitor function units (107, 108) being electrically independent from each other, the ceramic capacitor (101, 101?, 101?, 101??, 101??, 101???, 101???) being buried in the board core (11) in a state where the main core surface (12) and the main capacitor surface (102) are directed in a same direction; and a buildup layer (31) having a structure in which an interlayer insulating layer (33, 35) and a conductor layer (42) are alternately stacked on the main core surface (12) and the main capacitor surface (102) and having a semiconductType: ApplicationFiled: August 31, 2006Publication date: March 22, 2007Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Yasuhiro Sugimoto
-
Publication number: 20070045815Abstract: A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.Type: ApplicationFiled: August 31, 2006Publication date: March 1, 2007Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Jun Otsuka
-
Publication number: 20060280919Abstract: A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting the glass-ceramic, Fe converted into Fe2O3 and Cu. The Fe2O3 comprises 1 to 28 parts by weight with respect to 100 parts by weight of the Cu.Type: ApplicationFiled: June 8, 2006Publication date: December 14, 2006Inventors: Kazuhiro Urashima, Tatsuharu Ikawa, Mitsuo Shiraishi, Hiroshi Sumi
-
Publication number: 20060272853Abstract: A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer.Type: ApplicationFiled: June 2, 2006Publication date: December 7, 2006Inventors: Masaki Muramatsu, Shinji Yuri, Makoto Origuchi, Kazuhiro Urashima
-
Publication number: 20060175083Abstract: An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.Type: ApplicationFiled: February 9, 2006Publication date: August 10, 2006Inventors: Masaki Muramatsu, Shinji Yuri, Kazuhiro Urashima, Hiroshi Yamamoto, Toshitake Seki, Motohiko Sato