Abstract: A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.

Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.

Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.

Abstract: A semiconductor device is provided that is inexpensively manufactured with variation in high-frequency characteristics suppressed. Internal matching circuit boards are disposed on at least one signal transmission path of an input-side signal transmission path between an input terminal and a semiconductor element and an output-side signal transmission path between the semiconductor element and an output terminal and is provided for matching at least between output impedance of an external circuit connected to the input terminal and input impedance of the semiconductor device or between input impedance of an external circuit connected to the output terminal and output impedance of the semiconductor device, and components are electrically connected by at least one wire causing a change exceeding an allowable value in high-frequency characteristics of the semiconductor device due to a change in wire length and are disposed in contact with each other inside a package.

Abstract: When the super-resolution processing is performed, loss of signal occurs due to the aperture effect, and adversely affects the image quality. In order to improve the image quality by suppressing the occurrence of loss of signal, a pixel aperture characteristic provided for some of image capturing units differs from a pixel aperture characteristic provided for the other image capturing units, and a plurality of digital images are captured by these image capturing units and are synthesized thereafter.

Abstract: An information processing apparatus acquires virtual viewpoint information of a plurality of frames contained in a virtual viewpoint video, selects a camera for shooting an image to be used in generating an image at a virtual viewpoint in a frame from a plurality of cameras with respect to each of the plurality of the frames based on a positional relationship between the virtual viewpoint information of each frame and viewpoint information of the plurality of the cameras, and reselects the camera selected for each of the plurality of the frames.

Abstract: A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees.

Abstract: A plurality of first image data having a first resolution, which are obtained by capturing images from a plurality of viewpoints, and capturing information in the capturing operation are input. Based on the capturing information, a plurality of candidate values are set as a synthesis parameter required to synthesize second image data having a second resolution higher than the first resolution from the first image data. Using a candidate value selected from the plurality of candidate values as a synthesis parameter, the second image data is synthesized from the plurality of first image data.

Abstract: A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

Abstract: An image generation method is provided for generating an output image from an input image acquired by an image sensor that has an array of multiple pixels, each of which has arranged therein multiple sub-pixels that each receive a light beam that passes through a different pupil sub-area of an imaging optical system. The method includes a step of generating multiple parallax images that respectively correspond to the different pupil sub-areas; a step of generating multiple pixel shifted images by performing different shifting for each of the parallax images according to a virtual image forming plane of the imaging optical system; and a step of generating an output image that has a higher resolution than the resolution of the parallax images from the pixel shifted images through composition processing.

Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.

Abstract: In a case where a weighted mean value is calculated by calculating weights according to a degree of similarity based on a target pixel, the mean value is affected by noise included in the target pixel. The mean value thereby converges at a value different from a true pixel value without noise and this appears as a remaining noise. To solve this problem, an output value of the target pixel is determined based on a correlation established among a weighted mean value of multiple reference pixels, a pixel value of the target pixel, and the true value of the target pixel.

Abstract: A non-local means method is insufficient in its noise reduction effect or edge retainability due to a perfect match between blocks in a case where a reference pixel matches a target pixel. Therefore, information on a target region and plural reference regions is obtained for the target pixel. Whether the target region matches any one of the reference regions is determined from the obtained information. Switching between weight derivation methods based on similarity between the target region and the reference region is performed according to a determined result.

Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.

Abstract: An image processing apparatus executes a distortion correction on coordinates of a target pixel in a virtual viewpoint image based on distortion characteristics of a virtual camera and calculates coordinates in the virtual viewpoint image after the distortion correction. The image process apparatus calculates ideal coordinates in a captured image from the coordinates in the virtual viewpoint image after the distortion correction and calculates real coordinates in the captured image from the ideal coordinates in the captured image based on distortion characteristics of an imaging unit. The image process apparatus calculates a pixel value corresponding to the real coordinates from image data of the virtual viewpoint image and corrects the pixel value corresponding to the real coordinates based on ambient light amount decrease characteristics of the imaging unit and ambient light amount decrease characteristics of the virtual camera.

Abstract: Adaptive noise reduction processing for an image including both an edge area and a smooth area produces different noise reduction effects depending on the areas. Multiple different noise reduction processing parameters are inputted, multiple pieces of corrected image data are generated for the respective noise reduction processing parameters, and correction parameters are generated corresponding to each piece of the corrected image data. Then, the multiple pieces of the corrected image data are combined based on the generated correction parameters.

Abstract: Noise in RAW image data is reduced. Parameters including pixels used as a target area and reference pixels are determined in the RAW image data, based on color filter information for the RAW image data. The RAW image data is corrected based on the parameters thus determined.

Abstract: A radio frequency amplifier circuit includes: low-output transistors, each of which includes an input terminal, an output terminal, and a ground terminal, and amplifies a radio frequency signal; a harmonic processing circuit provided for each of the low-output transistors to be connected to the output terminal of the low-output transistor, and processing a secondary harmonic included in an amplified radio frequency signal, and a resistor connected to the output terminal of each of the low-output transistors. The input terminal of each of the low-output transistors is connected to an input terminal of the radio frequency amplifier circuit via an inductor, and the output terminal of each of the low-output transistors is connected to the other output terminal via the resistance and is further connected to an output terminal of the radio frequency amplifier circuit via an inductor.

Abstract: A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

Abstract: A radio frequency power amplifier includes a transistor and amplifies a radio frequency signal of a first frequency; an input matching circuit connected to an input terminal of the transistor; and an output matching circuit connected to an output terminal of the transistor. A reactance control circuit includes one end connected to the output terminal of the transistor, and the other end connected to an input terminal of an output matching circuit and a bias terminal. The reactance control circuit has a reactance which resonates at a second frequency with a parasitic capacitance of the transistor at the output terminal of the transistor, and the second frequency is identical or close to the first frequency.