Patents by Inventor Kazuhiro Yukikata

Kazuhiro Yukikata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11833621
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Grant
    Filed: April 27, 2019
    Date of Patent: December 5, 2023
    Assignee: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Patent number: 11806817
    Abstract: A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: November 7, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Takefumi Arai, Yuri Misumi
  • Patent number: 11806818
    Abstract: A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: November 7, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Takefumi Arai, Masashige Hayakawa
  • Publication number: 20230103270
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 30, 2023
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Publication number: 20230090002
    Abstract: A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Inventors: Kazuhiro YUKIKATA, Takefumi ARAI, Yuri MISUMI
  • Patent number: 11541485
    Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 3, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Motohide Sasaki
  • Patent number: 11447626
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 20, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Publication number: 20220266397
    Abstract: A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
    Type: Application
    Filed: June 26, 2020
    Publication date: August 25, 2022
    Inventors: Kazuhiro YUKIKATA, Takefumi ARAI, Masashige HAYAKAWA
  • Publication number: 20220009042
    Abstract: A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
    Type: Application
    Filed: January 23, 2020
    Publication date: January 13, 2022
    Inventors: Kazuhiro YUKIKATA, Noriyoshi UCHIDA
  • Publication number: 20210086317
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 25, 2021
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Patent number: 10888960
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 12, 2021
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Mitsuyasu Furusawa, Kimiaki Mori
  • Publication number: 20200325326
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Application
    Filed: November 1, 2018
    Publication date: October 15, 2020
    Applicant: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 10702956
    Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: July 7, 2020
    Assignee: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Yuusuke Sato, Junichi Aoki, Mitsuyasu Furusawa, Kimiaki Mori
  • Publication number: 20200114477
    Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
    Type: Application
    Filed: June 29, 2018
    Publication date: April 16, 2020
    Inventors: Kazuhiro YUKIKATA, Motohide SASAKI
  • Publication number: 20190184500
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Application
    Filed: September 30, 2016
    Publication date: June 20, 2019
    Inventors: Kazuhiro YUKIKATA, Mitsuyasu FURUSAWA, Kimiaki MORI
  • Publication number: 20180015576
    Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
    Type: Application
    Filed: February 5, 2016
    Publication date: January 18, 2018
    Inventors: Kazuhiro Yukikata, Yuusuke Sato, Junichi Aoki, Mitsuyasu Furusawa, Kimiaki Mori