Patents by Inventor Kazuhisa Ikeda

Kazuhisa Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210115209
    Abstract: A prepreg sheet includes a plurality of prepreg tapes each of which overlaps with a corresponding adjacent prepreg tape for a suitable overlapping length. The plurality of prepreg tapes each contain a reinforcing fiber bundle that is impregnated with a thermosetting resin composition. According to a method for manufacturing a preform, for example, a primary premolded article is manufactured by preforming an intermediate base material containing a reinforcing fiber base material and a matrix resin composition, and a secondary premolded article is manufactured by preforming the primary premolded article on which the intermediate base material is further placed.
    Type: Application
    Filed: December 18, 2020
    Publication date: April 22, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yuma FURUHASHI, Masahiro ICHINO, Kazuhisa IKEDA
  • Patent number: 10960612
    Abstract: The purpose of the present invention is to obtain a fiber-reinforced composite material having excellent appearance or mechanical characteristics, whereby a three-dimensional shape is molded with high productivity while appearance defects such as fiber meandering or wrinkling are suppressed. In this method for manufacturing a fiber-reinforced composite material, when a stack in which a plurality of sheet-shaped prepregs (X) in which a plurality of continuously arranged reinforcing fibers are impregnated with a matrix resin composition are layered in different fiber directions is molded into a three-dimensional shape by a molding die (100) provided with a lower die (110) and an upper die (112), a stretchable sheet (10) or a resin film (Y) used in the stack (12) is utilized. In this method for manufacturing a fiber-reinforced composite material, the stack may be pre-molded to obtain a preform, and the preform may be furthermore compression-molded to obtain a fiber-reinforced composite material.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: March 30, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Kazuhisa Ikeda, Yoshihide Kakimoto, Daiki Hirakawa
  • Patent number: 10889074
    Abstract: The present invention relates to a method for manufacturing a fiber-reinforced composite material molding, having a step (A) for forming a plurality of partial preforms, each having a partial shape obtained by dividing the three-dimensional shape of a target fiber-reinforced composite material molding, by cutting a prepreg sheet containing reinforcing fibers and a matrix resin composition, and by preshaping the cut prepreg pieces; a step (B) for forming a preform having the three-dimensional shape of the target fiber-reinforced composite material molding by combining and integrating the plurality of partial preforms; and a step (C) for producing a fiber-reinforced composite material molding by compression-molding the preform, wherein the step (B) includes arranging a foamable material between the plurality of partial preforms when they are combined.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: January 12, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yoshihide Kakimoto, Kazuhisa Ikeda, Kouichi Akiyama, Mitsuru Kutsuwada
  • Publication number: 20200114590
    Abstract: There are provided a method of producing a laminate that is used to produce a fiber-reinforced composite material molded product having a complex shape, and a method of producing a fiber-reinforced composite material molded product having excellent appearance and mechanical characteristics and having a complex shape. The method of producing a laminate according to the present invention includes, in an assembly (50) having at least one selected from the group consisting of an abutment part in which ends of sheet-like prepregs are abutted so that side end surfaces come in contact with each other and an overlapping part in which ends of sheet-like prepregs overlap, laminating a sheet molding compound on at least a part of one or both of the abutment part and the overlapping part in an overlapping manner.
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Kazuhisa Ikeda, Yuma Furuhashi, Daiki Hirakawa
  • Publication number: 20200024414
    Abstract: A prepreg sheet (1) is formed by stacking a plurality of unit layers (10a, 10b) In the unit layers (10a, 10b), prepreg tapes (100), in which a reinforced fiber bundle is impregnated with a thermosetting matrix resin composition, are disposed in rows a plurality of times. One or more of the unit layers (10a, 10b) has a gap (G) between adjacent prepreg tapes (100), and the width thereof is 10% or less of the width of the narrower of the adjacent prepreg tapes (100).
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Masahiro Ichino, Kazuhisa Ikeda, Satoshi Okamoto, Yuma Furuhashi
  • Publication number: 20190232577
    Abstract: This fiber-reinforced resin molded article has: a sheet molding compound layer; a continuous fiber reinforcing material layer; and a harrier layer, wherein the barrier layer is interposed between the sheet molding compound layer and the continuous fiber reinforcing material layer.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Satoshi KAJI, Tsuneo TAKANO, Kazuhisa IKEDA
  • Publication number: 20190185612
    Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
  • Patent number: 10315343
    Abstract: A manufacturing method for a molded article of a fiber-reinforced composite material obtains a molded article of a fiber-reinforced composite material having a three-dimensional shape by: preparing a sheet-shaped prepreg containing reinforcing fibers and a matrix resin composition; preliminarily shaping the prepreg to produce a plurality of partial preforms having shapes obtained by dividing the shape of the molded article; producing a first partial preform group and a second partial preform group, which have the shape of the molded article, by combining the plurality of partial preforms so that the ends thereof in the direction perpendicular to the thickness direction do not overlap in the thickness direction; producing a preform by bringing the first and second partial preform groups into close contact with each other in the thickness direction; and compression molding the preform using a molding die.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: June 11, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Mitsuru Kutsuwada, Kouichi Akiyama, Yoshihide Kakimoto, Kazuhisa Ikeda
  • Publication number: 20180186101
    Abstract: The purpose of the present invention is to obtain a fiber-reinforced composite material having excellent appearance or mechanical characteristics, whereby a three-dimensional shape is molded with high productivity while appearance defects such as fiber meandering or wrinkling are suppressed. In this method for manufacturing a fiber-reinforced composite material, when a stack in which a plurality of sheet-shaped prepregs (X) in which a plurality of continuously arranged reinforcing fibers are impregnated with a matrix resin composition are layered in different fiber directions is molded into a three-dimensional shape by a molding die (100) provided with a lower die (110) and an upper die (112), a stretchable sheet (10) or a resin film (Y) used in the stack (12) is utilized. In this method for manufacturing a fiber-reinforced composite material, the stack may be pre-molded to obtain a preform, and the preform may be furthermore compression-molded to obtain a fiber-reinforced composite material.
    Type: Application
    Filed: July 8, 2016
    Publication date: July 5, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Kazuhisa IKEDA, Yoshihide KAKIMOTO, Daiki HIRAKAWA
  • Publication number: 20160354983
    Abstract: The present invention relates to a method for manufacturing a fiber-reinforced composite material molding, having a step (A) for forming a plurality of partial preforms, each having a partial shape obtained by dividing the three-dimensional shape of a target fiber-reinforced composite material molding, by cutting a prepreg sheet containing reinforcing fibers and a matrix resin composition, and by preshaping the cut prepreg pieces; a step (B) for forming a preform having the three-dimensional shape of the target fiber-reinforced composite material molding by combining and integrating the plurality of partial preforms; and a step (C) for producing a fiber-reinforced composite material molding by compression-molding the preform, wherein the step (B) includes arranging a foamable material between the plurality of partial preforms when they are combined.
    Type: Application
    Filed: February 19, 2015
    Publication date: December 8, 2016
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Yoshihide KAKIMOTO, Kazuhisa IKEDA, Kouichi AKIYAMA, Mitsuru KUTSUWADA
  • Publication number: 20150209982
    Abstract: A manufacturing method for a molded article of a fiber-reinforced composite material obtains a molded article of a fiber-reinforced composite material having a three-dimensional shape by: preparing a sheet-shaped prepreg containing reinforcing fibers and a matrix resin composition; preliminarily shaping the prepreg to produce a plurality of partial preforms having shapes obtained by dividing the shape of the molded article; producing a first partial preform group and a second partial preform group, which have the shape of the molded article, by combining the plurality of partial preforms so that the ends thereof in the direction perpendicular to the thickness direction do not overlap in the thickness direction; producing a preform by bringing the first and second partial preform groups into close contact with each other in the thickness direction; and compression molding the preform using a molding die.
    Type: Application
    Filed: September 10, 2013
    Publication date: July 30, 2015
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Mitsuru Kutsuwada, Kouichi Akiyama, Yoshihide Kakimoto, Kazuhisa Ikeda
  • Patent number: 7222118
    Abstract: A computer program product for accessing a database is a program product for accessing a database by allowing a computer to execute a plurality of screen components, including a step of designating order of the plurality of screen components to be executed by the computer. Each of the plurality of screen components includes: a step of generating a part except for a “where” clause in an SQL statement in accordance with definition given from the outside for each screen component; a step of generating a screen for inputting and/or outputting data; and a step of generating the “where” clause in the SQL statement in accordance with definition given from the outside for each screen component. Since the screen component as a part of the database access program processes the steps in accordance with definition given from the outside, the screen component can be used by another database access program. Thus, general versatility is obtained and development efficiency is improved.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: May 22, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Nobuhiro Nakamura, Kazuhisa Ikeda
  • Publication number: 20030208504
    Abstract: A computer program product for accessing a database is a program product for accessing a database by allowing a computer to execute a plurality of screen components, including a step of designating order of the plurality of screen components to be executed by the computer. Each of the plurality of screen components includes: a step of generating a part except for a “where” clause in an SQL statement in accordance with definition given from the outside for each screen component; a step of generating a screen for inputting and/or outputting data; and a step of generating the “where” clause in the SQL statement in accordance with definition given from the outside for each screen component. Since the screen component as a part of the database access program processes the steps in accordance with definition given from the outside, the screen component can be used by another database access program. Thus, general versatility is obtained and development efficiency is improved.
    Type: Application
    Filed: April 3, 2003
    Publication date: November 6, 2003
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuhiro Nakamura, Kazuhisa Ikeda
  • Patent number: 6267010
    Abstract: An integrated sensor device includes first and second housings combined together and is attached to a wall of a conduit via a joint portion thereof. Specifically, the first housing has the joint portion and a pressure conducting hole and holds a temperature measuring unit therein for detecting a temperature of a medium flowing in the conduit. The second housing holds a pressure measuring unit therein for measuring a pressure of the medium which has been conducted through the pressure conducting hole. Accordingly, several measuring units (sensors) can be attached to one portion of the conduit, so that the attachment process is simplified.
    Type: Grant
    Filed: October 10, 1997
    Date of Patent: July 31, 2001
    Assignee: Denso Corporation
    Inventors: Makoto Hatanaka, Kazuhisa Ikeda
  • Patent number: 6194236
    Abstract: An etching method for a silicon substrate, which can easily smooth the etching surface of the (110)-oriented silicon, is disclosed. A container is filled with KOH solution. In the KOH solution is immersed a (110)-oriented silicon wafer having a PN junction and is also disposed a platinum electrode plate to face the silicon wafer. To between a platinum electrode of the silicon wafer and the platinum electrode plate are connected a constant voltage power source, an ammeter and a contact in series. A controller starts etching from one surface on which the PN junction is formed, and terminates voltage application when the specified time lapses after the formation of an anodic oxide film is equilibrated with the etching of the anodic oxide film on the etching surface on the PN junction part.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: February 27, 2001
    Assignee: Denso Corporation
    Inventors: Minekazu Sakai, Tsuyoshi Fukada, Yukihiko Tanizawa, Koki Mizuno, Yasutoshi Suzuki, Yoshitsugu Abe, Hiroshi Tanaka, Motoki Ito, Kazuhisa Ikeda, Hiroshi Okada
  • Patent number: 5949118
    Abstract: An etching method for a silicon substrate, which can easily smooth the etching surface of the (110)-oriented silicon, is disclosed. A container is filled with KOH solution. In the KOH solution is immersed a (110)-oriented silicon wafer having a PN junction and is also disposed a platinum electrode plate to face the silicon wafer. To between a platinum electrode of the silicon wafer and the platinum electrode plate are connected a constant voltage power source, an ammeter and a contact in series. A controller starts etching from one surface on which the PN junction is formed, and terminates voltage application when the specified time lapses after the formation of an anodic oxide film is equilibrated with the etching of the anodic oxide film on the etching surface on the PN junction part.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: September 7, 1999
    Assignee: Nippondenso Co., Ltd.
    Inventors: Minekazu Sakai, Tsuyoshi Fukada, Koki Mizuno, Yasutoshi Suzuki, Yoshitsugu Abe, Hiroshi Tanaka, Motoki Ito, Kazuhisa Ikeda, Hiroshi Okada
  • Patent number: 5684428
    Abstract: A sensor apparatus is capable of removing RF noise. The sensor apparatus is comprised of a first power supply line connected to a power supply terminal; a second power supply line separately branched from the first power supply line and connected thereto; an output line; and a sensor circuit unit connected to the first power supply line so as to receive power therefrom, and for detecting a condition of an article under measurement to output a detection signal to the output line. In this sensor apparatus, the sensor circuit unit includes an operational amplifier operated by accepting the power supplied from the second power supply line, which performs the detection operation; a first filter circuit is connected to the first power supply line defined from a branch point between the first power supply line and the second power supply line to the first power supply line; a second filter circuit is connected to the second power supply line; and a third filter circuit is connected to the output line.
    Type: Grant
    Filed: November 3, 1995
    Date of Patent: November 4, 1997
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroshi Nomura, Kazuhisa Ikeda
  • Patent number: 5554881
    Abstract: At least four electrodes are provided on the same surface of a discrete transistor. Among these electrodes, one electrode is set as a base electrode, an electrode neighboring the base electrode in the up-and-down direction is set as an emitter electrode and an electrode neighboring the base electrode in the right-and-left direction is set as a collector electrode. On the same surface, a base electrode is provided at a position which is neither in the up-and-down direction nor in the right-and-left direction with respect to the base electrode. When the discrete transistor having this type of electrode arrangement is mounted on a substrate, one of the base electrodes formed on the substrate is connected to a first wiring, the collector electrode is connected to a second wiring, and the emitter electrode is connected to a third wiring.
    Type: Grant
    Filed: December 15, 1994
    Date of Patent: September 10, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Takahisa Koyasu, Kouji Numazaki, Hirokazu Kasuya, Mitsuhiro Saitou, Kazuhisa Ikeda
  • Patent number: 5528214
    Abstract: A pressure-adjusting device for adjusting an output of an integrated pressure sensor in which a silicon wafer is joined onto a seat that has pressure-adjusting passages formed therein, and which has formed in the silicon wafer a signal processing circuit with an adjusting resistor for each chip, a thin diaphragm for each chip and a piezo-resistance layer for each chip. The pressure-adjusting device includes a pressure-setting stage on which the seat is placed, the pressure setting stage having pressure-adjusting passages formed therein to adjust a pressure exerted on the respective thin diaphragm via the pressure-adjusting passages formed in the seat. A holding member is arranged on the pressure-setting stage as to surround at least an outer periphery of the seat. A first elastic air-tight member is arranged on the pressure-setting stage as to surround the outer periphery of the seat and be held compressed by the pressure-setting stage and by the holding member.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: June 18, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Kazuhiko Koga, Michitaka Hayashi, Kazuhisa Ikeda
  • Patent number: 5421956
    Abstract: A method of fabricating an integrated pressure sensor, which is capable of decreasing adverse effects caused by the distortion occurring at the time when a silicon wafer and a seat are joined together. On a silicon wafer 1 are formed a thin diaphragm 2 for each of the chips, a piezo-resitance layer for each of the chips, and a signal processing circuit with an adjusting resistor for each of the chips. The silicon wafer 1 is joined onto a glass seat 6 that has pressure-adjusting passges 7 formed therein to adjust the pressure exerted on the diaphragms 2 of the silicon wafer 1. Half-dicing is effected that reaches a predetermined depth of the glass seat 6 penetrating through the silicon wafer 1 for each of the chips, and resistance of the adjusting resistor is adjusted for each of the chips while adjusting the pressure applied to the diaphragms 2 via pressure-adjusting passages 7 in the seat in a step of adjusting the pressure sensitivity by trimming the wafer and by applying a negative pressure.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: June 6, 1995
    Assignee: Nippondenso Co., Ltd.
    Inventors: Kazuhiko Koga, Michitaka Hayashi, Kazuhisa Ikeda