Abstract: An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The device can be configured to be capable of reducing the possibility of a break of the wire even under a thermal shock and the like. The optical semiconductor device can include a first lead for an optical semiconductor chip to be mounted on, a second lead for joining to a wire (for example, gold wire) extending from the optical semiconductor chip mounted on the first lead; a holder part for supporting the first lead and the second lead at two locations each; a lens part; and a light-transmitting sealing part. The second lead can be separated into two lead pieces with a predetermined gap (?0) therebetween as seen in a plan view, or with certain bend configurations as shown in side views, within the inside space of the holder part by which the second lead is supported at two locations.

Abstract: An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The device can be configured to be capable of reducing the possibility of a break of the wire even under a thermal shock and the like. The optical semiconductor device can include a first lead for an optical semiconductor chip to be mounted on, a second lead for joining to a wire (for example, gold wire) extending from the optical semiconductor chip mounted on the first lead; a holder part for supporting the first lead and the second lead at two locations each; a lens part; and a light-transmitting sealing part. The second lead can be separated into two lead pieces with a predetermined gap (?0) therebetween as seen in a plan view, or with certain bend configurations as shown in side views, within the inside space of the holder part by which the second lead is supported at two locations.